Patents by Inventor Yunpeg Yin

Yunpeg Yin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FinFET with merge-free fins
    Patent number: 9947791
    Abstract: A semiconductor device comprises an insulation layer, an active semiconductor layer formed on an upper surface of the insulation layer, and a plurality of fins formed on the insulation layer. The fins are formed in the gate and spacer regions between a first source/drain region and second source/drain region, without extending into the first and second source/drain regions.
    Type: Grant
    Filed: August 13, 2013
    Date of Patent: April 17, 2018
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Hong He, Chiahsun Tseng, Junli Wang, Chun-chen Yeh, Yunpeg Yin
  • FINFET WITH MERGE-FREE FINS
    Publication number: 20140170825
    Abstract: A semiconductor device comprises an insulation layer, an active semiconductor layer formed on an upper surface of the insulation layer, and a plurality of fins formed on the insulation layer. The fins are formed in the gate and spacer regions between a first source/drain region and second source/drain region, without extending into the first and second source/drain regions.
    Type: Application
    Filed: August 13, 2013
    Publication date: June 19, 2014
    Applicant: International Business Machines Corporation
    Inventors: Hong He, Chiahsun Tseng, Junli Wang, Chun-chen Yeh, Yunpeg Yin
  • FINFET WITH MERGE-FREE FINS
    Publication number: 20140167162
    Abstract: A semiconductor device comprises an insulation layer, an active semiconductor layer formed on an upper surface of the insulation layer, and a plurality of fins formed on the insulation layer. The fins are formed in the gate and spacer regions between a first source/drain region and second source/drain region, without extending into the first and second source/drain regions.
    Type: Application
    Filed: December 13, 2012
    Publication date: June 19, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hong He, Chiahsun Tseng, Junli Wang, Chun-chen Yeh, Yunpeg Yin