Patents by Inventor Yunpeng Song
Yunpeng Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180011267Abstract: One example embodiment includes an optical subassembly (OSA). The OSA includes a leadframe circuit, an optical port, and an active optical component subassembly. The active optical component subassembly is mounted to the leadframe circuit. The optical port is mechanically coupled to the leadframe circuit.Type: ApplicationFiled: July 7, 2017Publication date: January 11, 2018Inventors: Wendy Pei Fen Lau, Paul Thien Vui Chia, Yunpeng Song, Tat Ming Teo, Yew-Tai Chieng
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Patent number: 9854687Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a multi-layer substrate with a bottom layer, a top layer having top thin film signal lines, and one or more intermediate layers having thick film traces between the top layer and the bottom layer, the thick film traces electrically coupled to the top thin film signal lines; and optoelectronic components positioned over the multi-layer substrate and electrically coupled with the signal lines.Type: GrantFiled: October 26, 2015Date of Patent: December 26, 2017Assignee: FINISAR CORPORATIONInventors: Maziar Amirkiai, Yunpeng Song, Hongyu Deng
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Patent number: 9848498Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer.Type: GrantFiled: October 26, 2015Date of Patent: December 19, 2017Assignee: FINISAR CORPORATIONInventors: Maziar Amirkiai, Yunpeng Song, Peter Henry Mahowald, Hongyu Deng
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Patent number: 9686856Abstract: A circuit may include a first transmission line that includes a first first-line conductor configured to transport a signal and a second first-line conductor. The circuit may also include a second transmission line that includes a first second-line conductor, a second second-line conductor electrically coupled to the second first-line conductor, and a third second-line conductor separated from and positioned between the first and second second-line conductors. The third second-line conductor may be electrically coupled to the first first-line conductor. The circuit may also include a conductive jumper electrically coupling the first and second second-line conductors. The conductive jumper may contact the first and second second-line conductors in a position near the coupling of the first and second transmission lines.Type: GrantFiled: April 2, 2014Date of Patent: June 20, 2017Assignee: FINISAR CORPORATIONInventors: Yunpeng Song, Hongyu Deng, Mark Donovan
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Publication number: 20160277140Abstract: An optical transmitter may include a transmit laser assembly configured to emit multiple light beams. The optical transmitter may additionally include an isolator configured to rotate a corresponding polarization state of each of the multiple light beams. The optical transmitter may additionally include a power multiplexing combiner configured to receive the multiple light beams from the isolator and combine the multiple light beams into a combined light beam. The optical transmitter may additionally include a lens configured to focus the combined light beam onto an optical fiber for transmission.Type: ApplicationFiled: February 17, 2016Publication date: September 22, 2016Inventors: Tao Wu, Hongyu Deng, Maziar Amirkiai, Shanshan Zeng, Tengda Du, Yunpeng Song
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Patent number: 9437912Abstract: In an example embodiment, an electronics package includes one or more insulating layers and an electrically conductive transmission line. The electrically conductive transmission line includes a signal trace disposed substantially parallel to the one or more insulating layers. The electrically conductive transmission line further includes one or more signal vias electrically coupled to the signal trace. The one or more signal vias are configured to pass through at least a portion of the one or more insulating layers. The electronics package further includes one or more electrically conductive ground planes substantially parallel to the one or more insulating layers. The ground planes include one or more signal via ground cuts. The one or more signal via ground cuts provide clearance between the one or more signal vias and the one or more ground planes.Type: GrantFiled: April 20, 2015Date of Patent: September 6, 2016Assignee: FINISAR CORPORATIONInventors: Yunpeng Song, Yongsheng Liu, Hongyu Deng
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Publication number: 20160050751Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a multi-layer substrate with a bottom layer, a top layer having top thin film signal lines, and one or more intermediate layers having thick film traces between the top layer and the bottom layer, the thick film traces electrically coupled to the top thin film signal lines; and optoelectronic components positioned over the multi-layer substrate and electrically coupled with the signal lines.Type: ApplicationFiled: October 26, 2015Publication date: February 18, 2016Inventors: Maziar Amirkiai, Yunpeng Song, Hongyu Deng
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Publication number: 20160050775Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer.Type: ApplicationFiled: October 26, 2015Publication date: February 18, 2016Inventors: Maziar Amirkiai, Yunpeng Song, Peter Henry Mahowald, Hongyu Deng
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Publication number: 20160013536Abstract: In an example embodiment, an electronics package includes one or more insulating layers and an electrically conductive transmission line. The electrically conductive transmission line includes a signal trace disposed substantially parallel to the one or more insulating layers. The electrically conductive transmission line further includes one or more signal vias electrically coupled to the signal trace. The one or more signal vias are configured to pass through at least a portion of the one or more insulating layers. The electronics package further includes one or more electrically conductive ground planes substantially parallel to the one or more insulating layers. The ground planes include one or more signal via ground cuts. The one or more signal via ground cuts provide clearance between the one or more signal vias and the one or more ground planes.Type: ApplicationFiled: April 20, 2015Publication date: January 14, 2016Inventors: Yunpeng SONG, Yongsheng LIU, Hongyu DENG
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Publication number: 20150288049Abstract: A circuit may include a first transmission line that includes a first first-line conductor configured to transport a signal and a second first-line conductor. The circuit may also include a second transmission line that includes a first second-line conductor, a second second-line conductor electrically coupled to the second first-line conductor, and a third second-line conductor separated from and positioned between the first and second second-line conductors. The third second-line conductor may be electrically coupled to the first first-line conductor. The circuit may also include a conductive jumper electrically coupling the first and second second-line conductors. The conductive jumper may contact the first and second second-line conductors in a position near the coupling of the first and second transmission lines.Type: ApplicationFiled: April 2, 2014Publication date: October 8, 2015Applicant: Finisar CorporationInventors: Yunpeng SONG, Hongyu DENG, Mark DONOVAN
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Patent number: 9013891Abstract: An electronics package includes one or more insulating layers and an electrically conductive transmission line. The electrically conductive transmission line includes a signal trace disposed substantially parallel to the one or more insulating layers. The electrically conductive transmission line further includes one or more signal vias electrically coupled to the signal trace. The one or more signal vias are configured to pass through at least a portion of the one or more insulating layers. The electronics package further includes one or more electrically conductive ground planes substantially parallel to the one or more insulating layers. The ground planes include one or more signal via ground cuts. The one or more signal via ground cuts provide clearance between the one or more signal vias and the one or more ground planes.Type: GrantFiled: March 9, 2012Date of Patent: April 21, 2015Assignee: Finisar CorporationInventors: Yunpeng Song, Yongsheng Liu, Hongyu Deng
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Patent number: 8854836Abstract: An example embodiment includes a TO can including a header, an RF pin opening, an internal volume, an RF pin, a submount, and a flex circuit. The header defines the RF pin opening. The internal volume is defined by a TO can housing and an interior header surface. The RF pin extends through the RF pin opening such that a first surface connection is located in the internal volume and a second surface connection is located outside of the internal volume and extends past an exterior header surface. The submount is located in the internal volume and the submount includes a submount trace. The submount trace includes a pin connection portion in-line with the RF pin and electrically coupled to the first surface connection. The flex circuit includes a flex trace further including a flex trace connection in-line with the RF pin and electrically coupled to the second surface connection.Type: GrantFiled: April 20, 2012Date of Patent: October 7, 2014Assignee: Finisar CorporationInventors: Hongyu Deng, Yunpeng Song, Maziar Amirkiai, Martin Kalberer
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Publication number: 20130279139Abstract: An example embodiment includes a TO can including a header, an RF pin opening, an internal volume, an RF pin, a submount, and a flex circuit. The header defines the RF pin opening. The internal volume is defined by a TO can housing and an interior header surface. The RF pin extends through the RF pin opening such that a first surface connection is located in the internal volume and a second surface connection is located outside of the internal volume and extends past an exterior header surface. The submount is located in the internal volume and the submount includes a submount trace. The submount trace includes a pin connection portion in-line with the RF pin and electrically coupled to the first surface connection. The flex circuit includes a flex trace further including a flex trace connection in-line with the RF pin and electrically coupled to the second surface connection.Type: ApplicationFiled: April 20, 2012Publication date: October 24, 2013Inventors: Hongyu Deng, Yunpeng Song, Maziar Amirkiai, Martin Kalberer
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Publication number: 20130235542Abstract: In an example embodiment, an electronics package includes one or more insulating layers and an electrically conductive transmission line. The electrically conductive transmission line includes a signal trace disposed substantially parallel to the one or more insulating layers. The electrically conductive transmission line further includes one or more signal vias electrically coupled to the signal trace. The one or more signal vias are configured to pass through at least a portion of the one or more insulating layers. The electronics package further includes one or more electrically conductive ground planes substantially parallel to the one or more insulating layers. The ground planes include one or more signal via ground cuts. The one or more signal via ground cuts provide clearance between the one or more signal vias and the one or more ground planes.Type: ApplicationFiled: March 9, 2012Publication date: September 12, 2013Applicant: FINISAR CORPORATIONInventors: Yunpeng SONG, Yongsheng LIU, Hongyu DENG
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Publication number: 20120032752Abstract: In one example embodiment, a coplanar waveguide signal transition element transitions high-speed signals between vertically stacked coplanar waveguide transmission lines. The signal transition element comprises one or more dielectric layers and a plurality of electrically conductive vias extending through at least a portion of the one or more dielectric layers. The vias include one or more signal vias and one or more ground vias that are configured to transition signals between the vertically stacked coplanar waveguide transmission lines. The signal transition element also comprises a ground plane disposed within the one or more dielectric layers and electrically coupled to the one or more ground vias. The ground plane has one or more openings through which the one or more signal vias respectively pass.Type: ApplicationFiled: August 3, 2010Publication date: February 9, 2012Applicant: FINISAR CORPORATIONInventors: Yunpeng Song, Yanyang Zhao, Yuheng Lee, Jianying Zhou