Patents by Inventor Yunping HAN

Yunping HAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240162247
    Abstract: Disclosed are a thin film transistor and a manufacturing method therefor, a displaying base plate and a displaying apparatus. The thin film transistor includes an active layer, a first insulating layer and a gate layer which are disposed in stack, wherein the active layer includes a source contact area, a drain contact area, and a channel area connecting the source contact area and the drain contact area; the channel area includes a first channel area, a first resistance area and a second channel area sequentially disposed in a first direction; the gate layer includes a first gate and a second gate which are separately disposed; an orthographic projection of the first gate on a plane where the active layer is located covers the first channel area; and an orthographic projection of the second gate on a plane where the active layer is located covers the second channel area.
    Type: Application
    Filed: June 29, 2021
    Publication date: May 16, 2024
    Applicant: BOE Technology Group Co., Ltd.
    Inventors: Fuqiang Li, Zhen Zhang, Zhenyu Zhang, Lizhong Wang, Ce Ning, Yunping Di, Zheng Fang, Jiahui Han, Chenyang Zhang, Yawei Wang, Chengfu Xu
  • Publication number: 20240111923
    Abstract: A method and a system for obtaining ecological impact mechanism are provided.
    Type: Application
    Filed: November 8, 2023
    Publication date: April 4, 2024
    Applicant: BEIHANG UNIVERSITY
    Inventors: Weiying FENG, Jiayue GAO, Tengke WANG, Yuxin DENG, Fang YANG, Yingnan CAO, Yunping HAN
  • Publication number: 20240103328
    Abstract: A displaying base plate and a manufacturing method thereof, and a displaying device. The displaying base plate includes a substrate, and a first electrode layer disposed on one side of the substrate, wherein the first electrode layer includes a first electrode pattern; a first planarization layer disposed on one side of the first electrode layer that is away from the substrate, wherein the first planarization layer is provided with a through hole, and the through hole penetrates the first planarization layer, to expose the first electrode pattern; and a second electrode layer, a second planarization layer and a third electrode layer that are disposed in stack on one side of the first planarization layer that is away from the substrate, wherein the second electrode layer is disposed closer to the substrate, the second electrode layer is connected to the first electrode pattern and the third electrode layer.
    Type: Application
    Filed: June 29, 2021
    Publication date: March 28, 2024
    Applicant: BOE Technology Group Co., Ltd.
    Inventors: Zhen Zhang, Fuqiang Li, Zhenyu Zhang, Yunping Di, Lizhong Wang, Zheng Fang, Jiahui Han, Yawei Wang, Chenyang Zhang, Chengfu Xu, Ce Ning, Pengxia Liang, Feihu Zhou, Xianqin Meng, Weiting Peng, Qiuli Wang, Binbin Tong, Rui Huang, Tianmin Zhou, Wei Yang