Patents by Inventor Yunwon SONG

Yunwon SONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for etching substrate, stamp for etching substrate and method for manufacturing the same
    Patent number: 9911615
    Abstract: The inventive concepts relate to an apparatus and a method for etching a substrate, a stamp for etching a substrate, and a method for manufacturing the stamp. The method for etching a substrate includes bringing a substrate into contact with a stamp including a pattern on which a metal catalyst is formed, and etching the substrate by a chemical reaction between the metal catalyst and an etching solution.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: March 6, 2018
    Assignee: Industry-Academic Cooperation Foundation, Yonsei University
    Inventors: Jungwoo Oh, Bugeun Ki, Yunwon Song, Keorock Choi, Kyung Ho Kim
  • Methods for etching substrate and semiconductor devices
    Patent number: 9437441
    Abstract: A method of etching a substrate using a metal-assisted chemical etching process is provided. The method may include forming a metal catalytic layer to a predetermined thickness on a substrate and reacting the metal catalytic layer with the etching solution to form a porous surface in the metal catalytic layer and etch the substrate. When the metal catalytic layer is reacted with an etching solution, a porous surface may be formed on the metal catalytic layer.
    Type: Grant
    Filed: August 25, 2015
    Date of Patent: September 6, 2016
    Assignee: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
    Inventors: Jungwoo Oh, Yunwon Song, Bugeun Ki, Keorock Choi
  • METHODS FOR ETCHING SUBSTRATE AND SEMICONDUCTOR DEVICES
    Publication number: 20160133478
    Abstract: A method of etching a substrate using a metal-assisted chemical etching process is provided. The method may include forming a metal catalytic layer to a predetermined thickness on a substrate and reacting the metal catalytic layer with the etching solution to form a porous surface in the metal catalytic layer and etch the substrate. When the metal catalytic layer is reacted with an etching solution, a porous surface may be formed on the metal catalytic layer.
    Type: Application
    Filed: August 25, 2015
    Publication date: May 12, 2016
    Inventors: Jungwoo OH, Yunwon SONG, Bugeun KI, Keorock CHOI
  • APPARATUS AND METHOD FOR ETCHING SUBSTRATE, STAMP FOR ETCHING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20160020112
    Abstract: The inventive concepts relate to an apparatus and a method for etching a substrate, a stamp for etching a substrate, and a method for manufacturing the stamp. The method for etching a substrate includes bringing a substrate into contact with a stamp including a pattern on which a metal catalyst is formed, and etching the substrate by a chemical reaction between the metal catalyst and an etching solution.
    Type: Application
    Filed: July 15, 2015
    Publication date: January 21, 2016
    Inventors: Jungwoo OH, Bugeun KI, Yunwon SONG, Keorock CHOI, Kyung Ho KIM