Abstract: An Active Plate-Connector Device has built-in semiconductor dies to switch large current. The signal pads of the dies are routed out through a built-in printed circuit board and associated pins. The power pads of the dies are connected to the power plate and power terminals, respectively. The power plate, power terminals, mating terminals and wires connected to the mating terminals all serve as heat sinks for the large-current-handling device. Built-in temperature sensors monitor die temperature for every channel. The ON resistance of the new device is virtually the die resistance. The unique package adds little resistance to the overall device resistance. The current capacity of the new device is more than three times higher compared to the traditional package with the same die.