Abstract: Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor device assembly includes a semiconductor die, a skeletal heat transfer structure over the semiconductor die; and a casing over the skeletal heat transfer structure that is over the semiconductor die. The skeletal heat transfer structure provides multiple thermal conduction pathways to satisfy a thermal performance threshold of the semiconductor device assembly.

Abstract: A car washing device includes an assembly of brushes such as sponge brushes or other equivalents composed of bristles or cloth attached to the front side of a brush body. A hose joint is provided near the hand grip of the brush body for introducing clean water into the device and to supply the water to the brush assembly via at least one water outlet hole in the brush body. A car washer can wash the car with one hand using the device. A valve may be provided to control the flow rate of the water.