Patents by Inventor Yuo Umei

Yuo Umei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11241809
    Abstract: A molding die and a molding method are provided, which allow high-cycle manufacturing of molded bodies of a thermoplastic resin or thermoplastic resin-fiber composite material, thereby improving productivity. Molding is performed using a molding die including a plurality of die portions that form a cavity in which a molded body is molded, the molding die including: a first temperature adjusting unit disposed in the vicinity of the cavity surface and capable of at least cooling the cavity surface; and a second temperature adjusting unit disposed on a side of the first temperature adjusting unit opposite from the cavity surface and capable of at least heating the cavity surface, wherein a distance L0 from the cavity surface to the first temperature adjusting unit and a distance L1 from the cavity surface to a surface of the corresponding die portion opposite from the cavity surface satisfy the relationship: (L1/L0)>3.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: February 8, 2022
    Assignee: Asahi Kasei Kabushiki Kaisha
    Inventors: Kazuharu Yasuda, Yuo Umei, Hideaki Ichiki, Susumu Sugano
  • Patent number: 10479005
    Abstract: A composite molded article (3) containing: a thermoplastic resin continuous fiber composite material (1) containing a continuous reinforcement fiber (A) and a thermoplastic resin (B); and a thermoplastic resin composition (2), wherein the thermoplastic resin continuous fiber composite material (1) is bonded to the thermoplastic resin composition (2) via a bonding surface, and a bonded part between the thermoplastic resin continuous fiber composite material (1) and the thermoplastic resin composition (2) has a tensile strength which is 0.35 times or more as strong as a tensile strength of the thermoplastic resin composition (2).
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: November 19, 2019
    Assignee: Asahi Kasei Kabushiki Kaisha
    Inventors: Hideaki Ichiki, Taiga Saito, Yuo Umei
  • Patent number: 10400103
    Abstract: The thermoplastic resin composition contains (A) a polyamide, (B) a polyphenylene ether, and (C) a compatibilizer. When the thermoplastic resin composition is molded into a specimen, a continuous phase containing the polyamide (A) and a dispersed phase containing the polyphenylene ether (B) are formed in the specimen, and E-20 represents a mean ellipticity of the dispersed phase in region I extending from a surface of the hinge portion to a depth of 20 ?m in the thickness direction, and E-mid represents a mean ellipticity of the dispersed phase in region II extending from a distance, measured along the thickness direction from the surface, equal to 48% of the thickness to a distance, measured along the thickness direction from the surface, equal to 52% of the thickness, the following formula (1) is satisfied: 4.0?(E-20)/(E-mid)??(1).
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: September 3, 2019
    Assignee: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Chihiro Maeda, Yuo Umei, Mihoko Yamamoto
  • Publication number: 20190126521
    Abstract: A molding die and a molding method are provided, which allow high-cycle manufacturing of molded bodies of a thermoplastic resin or thermoplastic resin-fiber composite material, thereby improving productivity. Molding is performed using a molding die including a plurality of die portions that form a cavity in which a molded body is molded, the molding die including: a first temperature adjusting unit disposed in the vicinity of the cavity surface and capable of at least cooling the cavity surface; and a second temperature adjusting unit disposed on a side of the first temperature adjusting unit opposite from the cavity surface and capable of at least heating the cavity surface, wherein a distance L0 from the cavity surface to the first temperature adjusting unit and a distance L1 from the cavity surface to a surface of the corresponding die portion opposite from the cavity surface satisfy the relationship: (L1/L0)>3.
    Type: Application
    Filed: April 13, 2017
    Publication date: May 2, 2019
    Applicant: Asahi Kasei Kabushiki Kaisha
    Inventors: Kazuharu YASUDA, Yuo UMEI, Hideaki ICHIKI, Susumu SUGANO
  • Publication number: 20180326627
    Abstract: A composite molded article (3) containing: a thermoplastic resin continuous fiber composite material (1) containing a continuous reinforcement fiber (A) and a thermoplastic resin (B); and a thermoplastic resin composition (2), wherein the thermoplastic resin continuous fiber composite material (1) is bonded to the thermoplastic resin composition (2) via a bonding surface, and a bonded part between the thermoplastic resin continuous fiber composite material (1) and the thermoplastic resin composition (2) has a tensile strength which is 0.35 times or more as strong as a tensile strength of the thermoplastic resin composition (2).
    Type: Application
    Filed: October 27, 2016
    Publication date: November 15, 2018
    Applicant: Asahi Kasei Kabushiki Kaisha
    Inventors: Hideaki Ichiki, Taiga Saito, Yuo Umei
  • Publication number: 20170166746
    Abstract: The thermoplastic resin composition contains (A) a polyamide, (B) a polyphenylene ether, and (C) a compatibilizer. When the thermoplastic resin composition is molded into a specimen, a continuous phase containing the polyamide (A) and a dispersed phase containing the polyphenylene ether (B) are formed in the specimen, and E-20 represents a mean ellipticity of the dispersed phase in region I extending from a surface of the hinge portion to a depth of 20 ?m in the thickness direction, and E-mid represents a mean ellipticity of the dispersed phase in region II extending from a distance, measured along the thickness direction from the surface, equal to 48% of the thickness to a distance, measured along the thickness direction from the surface, equal to 52% of the thickness, the following formula (1) is satisfied: 4.
    Type: Application
    Filed: December 5, 2016
    Publication date: June 15, 2017
    Applicant: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Chihiro MAEDA, Yuo UMEI, Mihoko YAMAMOTO
  • Patent number: 6077472
    Abstract: The purpose of the invention is to produce a shaped article having a uniform dull surface with less noticeable weld line and other surface detects. The injection molded synthetic resin article of the invention has a weld portion and is characterized in that the weld line on the surface of the injection molded article has a dent of no more than 2 .mu.m, the surface of the injection molded article is a dull surface with no more than 30% gloss, the general portion, the weld portion and the resin flow end portion of the surface of the injection molded article provide a uniform dull surface, said dull surface having such abrasion resistance that no visible flaws develops at a hardness of 2B and below in a pencil scratch test. Such molded article can be produced without post-molding paint application and yet it has practical utility, thus presenting a maximum economic advantage.
    Type: Grant
    Filed: December 20, 1996
    Date of Patent: June 20, 2000
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Hiroshi Kataoka, Yuo Umei
  • Patent number: 5362226
    Abstract: It has been conventionally considered difficult to adhere a mold metal and a polyimide, etc. whose coefficients of thermal expansion differ from each other by one figure and to retain the adhesion in injection molding, etc. involving severe heating-cooling cycles over several tens of thousands of times. The greatest merit of injection molding resides in that a molded article of complicated shape can be obtained through one shot. It has been demanded to obtain a mirror-smooth injection molded article with good molding surface reproduction without extending the mold-cooling time while retaining this merit. The present invention provides a mold satisfying both of the durability and the demand. The present invention relates to a mold for synthetic resin molding comprising a mold body made of a metal having a heat conductivity of not less than 0.05 cal/cm.multidot.sec.multidot..degree.C.
    Type: Grant
    Filed: May 28, 1993
    Date of Patent: November 8, 1994
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Hiroshi Kataoka, Yuo Umei