Patents by Inventor Yupeng XU

Yupeng XU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250245396
    Abstract: A method of predicting behavior of a downhole tool implemented in a wellbore includes receiving geometry data associated with the downhole tool. The geometry data may indicate a bend angle of the downhole tool based on the tool being bent at a bend point. The method further includes, based on the geometry data, generating a simplified model of the downhole tool including determining an effective bend point and an effective bend angle based on the longitudinal axis of the wellbore. The method further includes receiving operational parameters for the downhole tool and simulating an operation of the downhole tool based on applying the operational parameters to the simplified model. The method further includes determining one or more behavior characteristics of the downhole tool based on the simulation.
    Type: Application
    Filed: January 30, 2024
    Publication date: July 31, 2025
    Inventors: Feng Feng, Yupeng Xu, Bo Liu, Gang Xu, Rahul R. Bijai, James Masdea, Balasubramanian Durairajan, Yuelin Shen, Alexei Jozef Barr
  • Publication number: 20250105168
    Abstract: Electromagnetic shielding structure and packaging method are provided. Electromagnetic shielding structure includes substrate, first device, second device, shielding wire, edge wire, encapsulation, and shielding metal layer. Substrate is provided with shielding and non-shielding regions; and wire-bonding pad and grounding pad, with grounding pad positioned farther from shielding region compared to wire-bonding pad. First device is located in shielding region, and second device is located in non-shielding region. Shielding wire is electrically connected to wire-bonding pad, and edge wire is electrically connected to grounding pad. Edge wire is located on side of shielding wire farther from shielding region. Grounding pad and wire-bonding pad are electrically connected. Encapsulation encapsulates first device, second device, shielding wire, and edge wire, with shielding wire exposed from encapsulation. Shielding metal layer covers encapsulation, and is electrically connected to shielding wire.
    Type: Application
    Filed: September 20, 2024
    Publication date: March 27, 2025
    Inventors: Zhenghong HE, Yupeng XU, Lei ZHONG, Li LI
  • Publication number: 20250067163
    Abstract: A method for calibrating a model of a subterranean formation includes capturing one or more measurements at a surface of a wellbore that extends into a subterranean formation. The measurements include a surface torque (STOR) on a drill string that extends into the wellbore and a surface weight (SWOB) on the drill string. The method also includes determining a friction factor based upon the STOR when a drill bit is off-bottom in the wellbore. The drill bit is coupled to a lower end of the drill string. The method also includes determining a downhole torque on the drill bit (DTOR) and a downhole weight on the drill bit (DWOB) when the drill bit is on-bottom in the wellbore. The method also includes identifying a rock type in the subterranean formation based at least partially upon the friction factor, the DTOR, and the DWOB.
    Type: Application
    Filed: August 9, 2024
    Publication date: February 27, 2025
    Inventors: Bo Liu, Yupeng Xu, Feng Feng, Yan Song Huang
  • Patent number: 11867037
    Abstract: An experimental apparatus used for displacement of CO2 within the reservoir comprises a displacement container and a core holder. The displacement container comprises a water container, an oil container and a gas container. The core holder is respectively connected with the water container, the oil container and the gas container through a connecting pipe; and the core holder connects with a gas-liquid separator through the connecting pipe.
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: January 9, 2024
    Assignee: ZHEJIANG OCEAN UNIVERSITY
    Inventors: Dongfeng Zhao, Dandan Yin, Yanhong Zhao, Yupeng Xu, Zhenyu Zhu, Hongyu Zhang
  • Patent number: 11563043
    Abstract: The present disclosure provides a chip packaging structure and a chip packaging method, relating to the technical field of chip packaging. In the above, the chip packaging structure includes: a substrate, wherein a light-transmitting hole penetrating through upper and lower surfaces thereof is provided on the substrate, and openings communicated with the light-transmitting hole are formed on two opposite sidewall surfaces of the substrate, respectively; light-transmitting glass, wherein two opposite sides of the light-transmitting glass are inserted into the two openings, respectively, and shield the light-transmitting hole; a chip, provided on the upper surface of the substrate, wherein a photosensitive area of the chip faces the light-transmitting glass; and a packaging layer, provided on the chip and the upper surface of the substrate so as to package the chip on the substrate.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: January 24, 2023
    Assignee: Forehope Electronic (Ningbo) Co., Ltd.
    Inventors: Yupeng Xu, Li Li, Lei Zhong
  • Publication number: 20220186594
    Abstract: An experimental method and apparatus for CO2 displacement process of ultra-low permeability oil reservoir are provided. The apparatus comprises a displacement container and a core holder. The displacement container comprises a water container, an oil container and a gas container. The core holder is respectively connected with the water container, the oil container and the gas container through a connecting pipe; and the core holder connects with a gas-liquid separator through the connecting pipe. By designing the experimental apparatus, the problem of deviation of the experimental result caused by the reduction of the accuracy of the experimental apparatus is solved. Under the condition that the accuracy of the experiment is guaranteed, a relatively reasonable injection mode is obtained through the designed experimental method, and the recovery efficiency is improved.
    Type: Application
    Filed: December 6, 2021
    Publication date: June 16, 2022
    Applicant: ZHEJIANG OCEAN UNIVERSITY
    Inventors: Dongfeng ZHAO, Dandan YIN, Yanhong ZHAO, Yupeng XU, Zhenyu ZHU, Hongyu ZHANG
  • Publication number: 20210327934
    Abstract: The present disclosure provides a chip packaging structure and a chip packaging method, relating to the technical field of chip packaging. In the above, the chip packaging structure includes: a substrate, wherein a light-transmitting hole penetrating through upper and lower surfaces thereof is provided on the substrate, and openings communicated with the light-transmitting hole are formed on two opposite sidewall surfaces of the substrate, respectively; light-transmitting glass, wherein two opposite sides of the light-transmitting glass are inserted into the two openings, respectively, and shield the light-transmitting hole; a chip, provided on the upper surface of the substrate, wherein a photosensitive area of the chip faces the light-transmitting glass; and a packaging layer, provided on the chip and the upper surface of the substrate so as to package the chip on the substrate.
    Type: Application
    Filed: April 6, 2021
    Publication date: October 21, 2021
    Inventors: Yupeng XU, Li LI, Lei ZHONG