Abstract: An experimental apparatus used for displacement of CO2 within the reservoir comprises a displacement container and a core holder. The displacement container comprises a water container, an oil container and a gas container. The core holder is respectively connected with the water container, the oil container and the gas container through a connecting pipe; and the core holder connects with a gas-liquid separator through the connecting pipe.

Abstract: The present disclosure provides a chip packaging structure and a chip packaging method, relating to the technical field of chip packaging. In the above, the chip packaging structure includes: a substrate, wherein a light-transmitting hole penetrating through upper and lower surfaces thereof is provided on the substrate, and openings communicated with the light-transmitting hole are formed on two opposite sidewall surfaces of the substrate, respectively; light-transmitting glass, wherein two opposite sides of the light-transmitting glass are inserted into the two openings, respectively, and shield the light-transmitting hole; a chip, provided on the upper surface of the substrate, wherein a photosensitive area of the chip faces the light-transmitting glass; and a packaging layer, provided on the chip and the upper surface of the substrate so as to package the chip on the substrate.

Abstract: An experimental method and apparatus for CO2 displacement process of ultra-low permeability oil reservoir are provided. The apparatus comprises a displacement container and a core holder. The displacement container comprises a water container, an oil container and a gas container. The core holder is respectively connected with the water container, the oil container and the gas container through a connecting pipe; and the core holder connects with a gas-liquid separator through the connecting pipe. By designing the experimental apparatus, the problem of deviation of the experimental result caused by the reduction of the accuracy of the experimental apparatus is solved. Under the condition that the accuracy of the experiment is guaranteed, a relatively reasonable injection mode is obtained through the designed experimental method, and the recovery efficiency is improved.

Abstract: The present disclosure provides a chip packaging structure and a chip packaging method, relating to the technical field of chip packaging. In the above, the chip packaging structure includes: a substrate, wherein a light-transmitting hole penetrating through upper and lower surfaces thereof is provided on the substrate, and openings communicated with the light-transmitting hole are formed on two opposite sidewall surfaces of the substrate, respectively; light-transmitting glass, wherein two opposite sides of the light-transmitting glass are inserted into the two openings, respectively, and shield the light-transmitting hole; a chip, provided on the upper surface of the substrate, wherein a photosensitive area of the chip faces the light-transmitting glass; and a packaging layer, provided on the chip and the upper surface of the substrate so as to package the chip on the substrate.