Patents by Inventor Yuri Imai

Yuri Imai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240065645
    Abstract: Systems and methods are described, which generate a plurality of virtual monochromatic X-ray images having different energy levels even with a CT system with single energy CT. An example CT system includes an X-ray tube in which a prescribed tube voltage (120 (kVp)) is applied and one or more processors. The one or more processors perform an operation including inputting a CT image generated based on the single energy CT data collected from a subject body to a trained neural network (94), and causing the trained neural network to infer 40 (keV), 50 (keV), 60 (keV), 80 (keV), 90 (keV), and 100 (keV) virtual monochromatic X-ray images based on the CT image.
    Type: Application
    Filed: August 28, 2023
    Publication date: February 29, 2024
    Inventors: Miyo Hattori, Yuri Teraoka, Ayako Matsumi, Yasuhiro Imai, Yuhei Koike
  • Publication number: 20240070861
    Abstract: A device including one or more processor for performing an operation, the operation including inputting a CT image into a first trained neural network, causing the first trained neural network to infer a virtual monochromatic X-ray image based on the CT image, generating a water density image and iodine density image based on the CT image and the virtual monochromatic X-ray image inferred by the first trained neural network, inputting the water density image and iodine density image into a second trained neural network, and causing the second trained neural network to infer a water density image and iodine density image based on the water density image and iodine density image.
    Type: Application
    Filed: August 29, 2023
    Publication date: February 29, 2024
    Inventors: Yasuhiro Imai, Yuri Teraoka, Ayako Matsumi
  • Patent number: 10763240
    Abstract: A semiconductor device may include a first semiconductor chip, a second semiconductor chip, an encapsulant encapsulating the first and second semiconductor chips, a first signal terminal extending over inside and outside of the encapsulant and connected to the first semiconductor chip inside the encapsulant, and a second signal terminal extending over the inside and the outside of the encapsulant and connected to the second semiconductor chip inside the encapsulant. The first and second signal terminals may protrude from the encapsulant in a same direction. The first signal terminal may include, inside the encapsulant, a section where the first signal terminal extends farther away from the second signal terminal along a direction toward the first semiconductor chip. The second signal terminal may include, inside the encapsulant, a section where the second signal terminal extends farther away from the first signal terminal along a direction toward the second semiconductor chip.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: September 1, 2020
    Assignee: DENSO CORPORATION
    Inventors: Shingo Iwasaki, Kaisei Satou, Yuri Imai
  • Publication number: 20190279961
    Abstract: A semiconductor device may include a first semiconductor chip, a second semiconductor chip, an encapsulant encapsulating the first and second semiconductor chips, a first signal terminal extending over inside and outside of the encapsulant and connected to the first semiconductor chip inside the encapsulant, and a second signal terminal extending over the inside and the outside of the encapsulant and connected to the second semiconductor chip inside the encapsulant. The first and second signal terminals may protrude from the encapsulant in a same direction. The first signal terminal may include, inside the encapsulant, a section where the first signal terminal extends farther away from the second signal terminal along a direction toward the first semiconductor chip. The second signal terminal may include, inside the encapsulant, a section where the second signal terminal extends farther away from the first signal terminal along a direction toward the second semiconductor chip.
    Type: Application
    Filed: February 6, 2019
    Publication date: September 12, 2019
    Applicant: Toyota Jidosha Kabushiki Kaisha
    Inventors: Shingo IWASAKI, Kaisei Satou, Yuri Imai