Patents by Inventor Yuri Lopez de Meneses

Yuri Lopez de Meneses has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9153470
    Abstract: A wafer handler including, a wafer loading station (3) for loading a wafer (1) mounted on a tack film (2); a tensioner (30) for tensioning the tacky film; a picking module (66) for successively picking a plurality of devices from the wafer; a vision system (5, 50) with one or several cameras (50) for capturing a first image of the wafer or of portions of the wafer, the first image showing a plurality of devices, wherein the vision system is arranged for determining from the first image the individual position of a plurality of devices. The wafer handler further includes an additional camera (63) positioned proximate to the picking module (66) and arranged for capturing an second image of a device to be picked, wherein the second image is used for fine adjustment of the wafer so that the device to be picked is centered under the picking module.
    Type: Grant
    Filed: June 12, 2012
    Date of Patent: October 6, 2015
    Assignee: ISMECA SEMICONDUCTOR HOLDING SA
    Inventors: Yuri Lopez De Meneses, Damien Coste, Massimo Fauro, Serge Kunzli
  • Publication number: 20120249773
    Abstract: A wafer handler including, a wafer loading station (3) for loading a wafer (1) mounted on a tack film (2); a tensioner (30) for tensioning the tacky film; a picking module (66) for successively picking a plurality of devices from the wafer; a vision system (5, 50) with one or several cameras (50) for capturing a first image of the wafer or of portions of the wafer, the first image showing a plurality of devices, wherein the vision system is arranged for determining from the first image the individual position of a plurality of devices. The wafer handler further includes an additional camera (63) positioned proximate to the picking module (66) and arranged for capturing an second image of a device to be picked, wherein the second image is used for fine adjustment of the wafer so that the device to be picked is centered under the picking module.
    Type: Application
    Filed: June 12, 2012
    Publication date: October 4, 2012
    Applicant: ISMECA SEMICONDUCTOR HOLDING SA
    Inventors: Yuri Lopez de Meneses, Damien Coste, Massimo Fauro, Serge Künzli