Abstract: Systems and methods are described for coordinating volt-var control between sub-transmission and distribution systems. Distributed energy resources of a distribution system are aggregated into virtual power plants from which reactive power can optimally be dispatched to the sub-transmission system. A sub-transmission controller executes a volt-var AC optimal power flow optimisation function to minimize voltage fluctuations that might otherwise occur when coordinating with a distribution system having distributed energy resources. The distribution system can use a sensitivity matrix for regulating voltage at distribution feeders while fulfilling a transmission or sub-transmission system's demand requests.

Abstract: System for synchronization of content between open applications. Remote access server (RAS) provides remote desktop to a mobile device. The mobile device has a remote access client component and communicates with the RAS and with an authorization component. First computer with a host application is connected to the RAS. Second computer is connected to the RAS and has a native application or a VM with a guest application. Authentication component authenticates the mobile device and the computers. The RAS synchronizes data between the mobile device and the computers, and provides a remote desktop for the mobile device via a remote access client component. The remote desktop includes the host application. Data entered in the host application for the first computer on the mobile device appears in the remote desktop via the RAS, and is synchronized with the guest application on the second computer.

Abstract: Systems and methods are described for coordinating volt-var control between sub-transmission and distribution systems. Distributed energy resources of a distribution system are aggregated into virtual power plants from which reactive power can optimally be dispatched to the sub-transmission system. A sub-transmission controller executes a volt-var AC optimal power flow optimisation function to minimize voltage fluctuations that might otherwise occur when coordinating with a distribution system having distributed energy resources. The distribution system can use a sensitivity matrix for regulating voltage at distribution feeders while fulfilling a transmission or sub-transmission system's demand requests.

Abstract: A method is described for the growth of high-quality epitaxial silicon carbide (SiC) films and boules, using the Chemical Vapor Deposition (CVD) technique, which comprises the steps of supplying original species SiH4 and CCl4 into a growth chamber, decomposing at elevated temperatures, producing decomposition product SiH2, SiH, Si, CCl3, or CCl2, producing interaction product HCl, CH3Cl, CH4, or SiH2Cl2, etching by one of the byproducts HCl to suppress Si nucleation, providing main species SiCl2 and CH4 at a cooled insert located on sides of a substrate holder and at a shower-head located on top of the substrate holder, in the growth chamber, with proper Si to C atom ratio and Si to Cl atom ratio, to suppress parasitic deposits, and depositing SiC on a substrate at a proper growth substrate temperature (1500 to 1800 centigrade range).

Abstract: A novel approach for the growth of high-quality on-axis epitaxial silicon carbide (SiC) films and boules, using the Chemical Vapor Deposition (CVD) technique, is described here. The method includes a method of substrate preparation, which allows for the growth of “on-axis” SiC films, plus an approach giving the opportunity to grow silicon carbide on singular (a small-angle miscut) substrates, using halogenated carbon-containing precursors (carbon tetrachloride, CCl4, or halogenated hydrocarbons, CHCl3, CH2Cl2, or CH3Cl, or similar compounds or chemicals), or introducing other chlorine-containing species, in the gas phase, in the growth chamber. At gas mixtures greater than the critical amount, small clusters of SiC are etched, before they can become stable nuclei. The presence of chlorine and the formation of gas species allow an increased removal rate of these nuclei, in contrast to the growth without the presence of chlorine.

Abstract: An approach for the growth of high-quality epitaxial silicon carbide (SiC) films and boules, using the Chemical Vapor Deposition (CVD) technique is described here. The method comprises modifications in the design of the typical cold-wall CVD reactors, providing a better temperature uniformity in the reactor bulk and a low temperature gradient in the vicinity of the substrate, and an approach to increase the silicon carbide growth rate and to improve the quality of the growing layers, using halogenated carbon-containing precursors (carbon tetrachloride CCl4 or halogenated hydrocarbons, CHCl3, CH2Cl2, CH3Cl, etc.), or introducing other chlorine-containing species in the gas phase in the growth chamber. The etching effect, proper ranges, and high temperature growth are also examined.

Abstract: An approach for the growth of high-quality epitaxial silicon carbide (SiC) films and boules, using the Chemical Vapor Deposition (CVD) technique is described here. The method comprises modifications in the design of the typical cold-wall CVD reactors, providing a better temperature uniformity in the reactor bulk and a low temperature gradient in the vicinity of the substrate, and an approach to increase the silicon carbide growth rate and to improve the quality of the growing layers, using halogenated carbon-containing precursors (carbon tetrachloride CCl4 or halogenated hydrocarbons, CHCl3, CH2Cl2, CH3Cl, etc.), or introducing other chlorine-containing species in the gas phase in the growth chamber. The etching effect, proper ranges, and high temperature growth are also examined.

Abstract: GaN is grown by creating a Ga vapor from a powder, and using an inert purge gas from a source to transport the vapor to a growth site where the GaN growth takes place. In one embodiment, the inert gas is N2, and the powder source is GaN powder that is loaded into source chambers. The GaN powder is congruently evaporated into Ga and N2 vapors at temperatures between approximately 1000 and 1200° C. The formation of Ga liquid in the powder is suppressed by the purging of an inert gas through the powder. The poser may also be isolated from a nitride containing gas provided at the growth cite. In one embodiment, the inert gas is flowed through the powder.

Abstract: A novel approach for the growth of high-quality on-axis epitaxial silicon carbide (SiC) films and boules, using the Chemical Vapor Deposition (CVD) technique, is described here. The method includes a method of substrate preparation, which allows for the growth of “on-axis” SiC films, plus an approach giving the opportunity to grow silicon carbide on singular (a small-angle miscut) substrates, using halogenated carbon-containing precursors (carbon tetrachloride, CCl4, or halogenated hydrocarbons, CHCl3, CH2Cl2, or CH3Cl, or similar compounds or chemicals), or introducing other chlorine-containing species, in the gas phase, in the growth chamber. At gas mixtures greater than the critical amount, small clusters of SiC are etched, before they can become stable nuclei. The presence of chlorine and the formation of gas species allow an increased removal rate of these nuclei, in contrast to the growth without the presence of chlorine.

Abstract: An approach for the growth of high-quality epitaxial silicon carbide (SiC) films and boules, using the Chemical Vapor Deposition (CVD) technique is described here. The method comprises modifications in the design of the typical cold-wall CVD reactors, providing a better temperature uniformity in the reactor bulk and a low temperature gradient in the vicinity of the substrate, and an approach to increase the silicon carbide growth rate and to improve the quality of the growing layers, using halogenated carbon-containing precursors (carbon tetrachloride CCl4 or halogenated hydrocarbons, CHCl3, CH2Cl2, CH3Cl, etc.), or introducing other chlorine-containing species in the gas phase in the growth chamber. The etching effect, proper ranges, and high temperature growth are also examined.

Abstract: An approach for the growth of high-quality epitaxial silicon carbide (SiC) films and boules, using the Chemical Vapor Deposition (CVD) technique is described here. The method comprises modifications in the design of the typical cold-wall CVD reactors, providing a better temperature uniformity in the reactor bulk and a low temperature gradient in the vicinity of the substrate, and an approach to increase the silicon carbide growth rate and to improve the quality of the growing layers, using halogenated carbon-containing precursors (carbon tetrachloride CCl4 or halogenated hydrocarbons, CHCl3, CH2Cl2, CH3Cl, etc.), or introducing other chlorine-containing species in the gas phase in the growth chamber. The etching effect, proper ranges, and high temperature growth are also examined.

Abstract: GaN is grown by creating a Ga vapor from a powder, and using an inert purge gas from a source to transport the vapor to a growth site where the GaN growth takes place. In one embodiment, the inert gas is N2, and the powder source is GaN powder that is loaded into source chambers. The GaN powder is congruently evaporated into Ga and N2 vapors at temperatures between approximately 1000 and 1200° C. The formation of Ga liquid in the powder is suppressed by the purging of an inert gas through the powder. The poser may also be isolated from a nitride containing gas provided at the growth cite. In one embodiment, the inert gas is flowed through the powder.

Abstract: The invention relates to a method for depositing compounds on a substrate by means of metalorganic chemical vapor deposition and a first mixture comprising at least one carrier gas and at least one organometallic compound as well as a second mixture comprising at least one carrier gas and at least one group V compound or group VI compound, both mixtures being separately fed into an MOCVD system. According to the invention, the first mixture comprising at least one carrier gas and at least one organometallic compound is directed into the system between the substrate and the second mixture comprising at least one carrier gas and at least one group V compound or group VI compound, which has the advantageous effect of creating no parasitic deposits on the walls of the MOCVD system. Hence, the deposition rates are increased compared with methods known in prior art.