Abstract: A method and device for erasing a memory cell with a floating gate, by applying successive first erase pulses to the memory cell to remove electrons from the floating gate until a coarse target read current, and then applying successive second erase pulses to the memory cell to remove electrons from the floating gate until a target read current for the memory cell is achieved. The first erase pulses include a first parameter following a first progression that changes in value after respective ones of the first erase pulses. The first progression begins with a first value and ends with a second value. The second erase pulses include the first parameter following a second progression in which the first parameter changes in value after respective ones of the second erase pulses. The second progression begins with a third value that is between, and unequal to, the first and second values.

Abstract: In one example, a system comprises a programmable logic block comprising programmable logic and a configuration block to store and provide configuration data to the programmable logic, the configuration block comprising a flash memory array to store the configuration data, and the flash memory array comprising an array of split-gate flash memory cells.

Abstract: A memory device, and method of formation, that includes a first insulation material disposed over a semiconductor substrate. A first conductive contact extends through the first insulation material. A second block of conductive material is disposed on the first insulation material and on, and in electrical contact with, the first conductive contact. A block of resistive switching dielectric material is disposed directly on the second block of conductive material. A first block of conductive material is disposed directly on the block of resistive switching dielectric material. The block of resistive switching dielectric material and the first block of conductive material are displaced laterally from the first conductive contact. An insulation layer is disposed over the first block of conductive material, the block of resistive switching dielectric material and the second block of conductive material.

Abstract: A semiconductor device includes a semiconductor substrate, a first module of circuitry formed on the semiconductor substrate, a second module of circuitry formed on the semiconductor substrate, and a communication ring that encircles the first module of circuitry. The communication ring includes an insulation material disposed over the semiconductor substrate, a plurality of electrical connectors disposed over the semiconductor substrate and extending across a width of the communication ring, and a conductive diffusion in the semiconductor substrate that encircles the first module of circuitry.

Abstract: A method of testing non-volatile memory cells formed on a die includes erasing the memory cells and performing a first read operation to determine a lowest read current RC1 for the memory cells and a first number N1 of the memory cells having the lowest read current RC1. A second read operation is performed to determine a second number N2 of the memory cells having a read current not exceeding a target read current RC2. The target read current RC2 is equal to the lowest read current RC1 plus a predetermined current value. The die is determined to be acceptable if the second number N2 is determined to exceed the first number N1 plus a predetermined number. The die is determined to be defective if the second number N2 is determined not to exceed the first number N1 plus the predetermined number.

Abstract: A method of testing non-volatile memory cells formed on a die includes erasing the memory cells and performing a first read operation to determine a lowest read current RC1 for the memory cells and a first number N1 of the memory cells having the lowest read current RC1. A second read operation is performed to determine a second number N2 of the memory cells having a read current not exceeding a target read current RC2. The target read current RC2 is equal to the lowest read current RC1 plus a predetermined current value. The die is determined to be acceptable if the second number N2 is determined to exceed the first number N1 plus a predetermined number. The die is determined to be defective if the second number N2 is determined not to exceed the first number N1 plus the predetermined number.

Abstract: Examples for ultra-precise tuning of a selected memory cell are disclosed. In one example, a method of programming a first memory cell in a neural memory to a target value is disclosed, the method comprising programming a second memory cell by applying programming voltages to terminals of the second memory cell; and determining if an output of the first memory cell has reached the target value.

Abstract: Embodiments for ultra-precise tuning of a selected memory cell are disclosed. The selected memory cell optionally is first programmed using coarse programming and fine programming methods. The selected memory cell then undergoes ultra-precise programming through the programming of an adjacent memory cell. As the adjacent memory cell is programmed, capacitive coupling between the floating gate of the adjacent memory cell and the floating gate of the selected memory cell will cause the voltage of the floating gate of the selected memory cell to increase, but in smaller increments than could be achieved by programming the selected memory cell directly. In this manner, the selected memory cell can be programmed with ultra-precise gradations.

Abstract: A memory device includes a semiconductor substrate with memory cell and logic regions. A floating gate is disposed over the memory cell region and has an upper surface terminating in opposing front and back edges and opposing first and second side edges. An oxide layer has a first portion extending along the logic region and a first thickness, a second portion extending along the memory cell region and has the first thickness, and a third portion extending along the front edge with the first thickness and extending along a tunnel region portion of the first side edge with a second thickness less than the first thickness. A control gate has a first portion disposed on the oxide layer second portion and a second portion vertically over the front edge and the tunnel region portion of the first side edge. A logic gate is disposed on the oxide layer first portion.

Abstract: A memory device includes a semiconductor substrate with memory cell and logic regions. A floating gate is disposed over the memory cell region and has an upper surface terminating in opposing front and back edges and opposing first and second side edges. An oxide layer has a first portion extending along the logic region and a first thickness, a second portion extending along the memory cell region and has the first thickness, and a third portion extending along the front edge with the first thickness and extending along a tunnel region portion of the first side edge with a second thickness less than the first thickness. A control gate has a first portion disposed on the oxide layer second portion and a second portion vertically over the front edge and the tunnel region portion of the first side edge. A logic gate is disposed on the oxide layer first portion.

Abstract: Embodiments for ultra-precise tuning of a selected memory cell are disclosed. The selected memory cell optionally is first programmed using coarse programming and fine programming methods. The selected memory cell then undergoes ultra-precise programming through the programming of an adjacent memory cell. As the adjacent memory cell is programmed, capacitive coupling between the floating gate of the adjacent memory cell and the floating gate of the selected memory cell will cause the voltage of the floating gate of the selected memory cell to increase, but in smaller increments than could be achieved by programming the selected memory cell directly. In this manner, the selected memory cell can be programmed with ultra-precise gradations.

Abstract: A method of forming a memory device includes forming a floating gate on a memory cell area of a semiconductor substrate, having an upper surface terminating in an edge. An oxide layer is formed having first and second portions extending along the logic and memory cell regions of the substrate surface, respectively, and a third portion extending along the floating gate edge. A non-conformal layer is formed having a first, second and third portions covering the oxide layer first, second and third portions, respectively. An etch removes the non-conformal layer third portion, and thins but does not entirely remove the non-conformal layer first and second portions. An etch reduces the thickness of the oxide layer third portion. After removing the non-conformal layer first and second portions, a control gate is formed on the oxide layer second portion and a logic gate is formed on the oxide layer first portion.

Abstract: A memory device with a memory cell and control circuitry. The memory cell includes source and drain regions formed in a semiconductor substrate, with a channel region extending there between. A floating gate is disposed over a first portion of the channel region for controlling its conductivity. A select gate is disposed over a second portion of the channel region for controlling its conductivity. A control gate is disposed over the floating gate. An erase gate is disposed over the source region and adjacent to the floating gate. The control circuitry is configured to perform a program operation by applying a negative voltage to the erase gate for causing electrons to tunnel from the erase gate to the floating gate, and perform an erase operation by applying a positive voltage to the erase gate for causing electrons to tunnel from the floating gate to the erase gate.

Abstract: A memory device with a memory cell and control circuitry. The memory cell includes source and drain regions formed in a semiconductor substrate, with a channel region extending there between. A floating gate is disposed over a first portion of the channel region for controlling its conductivity. A select gate is disposed over a second portion of the channel region for controlling its conductivity. A control gate is disposed over the floating gate. An erase gate is disposed over the source region and adjacent to the floating gate. The control circuitry is configured to perform a program operation by applying a negative voltage to the erase gate for causing electrons to tunnel from the erase gate to the floating gate, and perform an erase operation by applying a positive voltage to the erase gate for causing electrons to tunnel from the floating gate to the erase gate.

Abstract: A system and method to inhibit the erasing of a portion of a sector of split gate flash memory cells while allowing the remainder of the sector to be erased is disclosed. The inhibiting is controlled by control logic that applies one or more bias voltages to the portion of the sector whose erasure is to be inhibited.

Abstract: A memory device having a substrate of semiconductor material of a first conductivity type, first and second spaced-apart regions in the substrate of a second conductivity type, with a channel region in the substrate therebetween, a conductive floating gate over and insulated from the substrate, wherein the floating gate is disposed at least partially over the first region and a first portion of the channel region, a conductive second gate laterally adjacent to and insulated from the floating gate, wherein the second gate is disposed at least partially over and insulated from a second portion of the channel region, and wherein at least a portion of the channel region first portion is of the second conductivity type.

Abstract: A method of reading a memory device having rows and columns of memory cells formed on a substrate, where each memory cell includes spaced apart first and second regions with a channel region therebetween, a floating gate disposed over a first portion of the channel region, a select gate disposed over a second portion of the channel region, a control gate disposed over the floating gate, and an erase gate disposed over the first region. The method includes placing a small positive voltage on the unselected source lines, and/or a small negative voltage on the unselected word lines, during the read operation to suppress sub-threshold leakage and thereby improve read performance.

Abstract: A system and method to inhibit the erasing of a portion of a sector of split gate flash memory cells while allowing the remainder of the sector to be erased is disclosed. The inhibiting is controlled by control logic that applies one or more bias voltages to the portion of the sector whose erasure is to be inhibited.

Abstract: A method of operating a memory cell that comprises first and second regions spaced apart in a substrate with a channel region therebetween, a floating gate disposed over the channel region and the fir region, a control gate disposed over the channel region and laterally adjacent to the floating gate with a portion disposed over the floating gate, and a coupling gate disposed over the first region and laterally adjacent to the floating gate. A method of erasing the memory cell includes applying a positive voltage to the control gate and a negative voltage to the coupling gate. A method of reading the memory cell includes applying positive voltages to the control gate, to the coupling gate, and to one of the first and second regions.

Abstract: A non-volatile memory cell includes a substrate of a first conductivity type with first and second spaced apart regions of a second conductivity type, forming a channel region therebetween. A select gate is insulated from and disposed over a first portion of the channel region which is adjacent to the first region. A floating gate is insulated from and disposed over a second portion of the channel region which is adjacent the second region. Metal material is formed in contact with the floating gate. A control gate is insulated from and disposed over the floating gate. An erase gate includes a first portion insulated from and disposed over the second region and is insulated from and disposed laterally adjacent to the floating gate, and a second portion insulated from and laterally adjacent to the control gate and partially extends over and vertically overlaps the floating gate.