Abstract: A wiring board includes a ceramic insulating base; a recessed portion provided on a side surface of the insulating base, the recessed portion being connected to one main surface of the insulating base; an internal wiring conductor disposed in an interior of the insulating base; an external wiring conductor disposed on one main surface of the insulating base; a recessed portion wiring conductor disposed in the recessed portion, the recessed portion wiring conductor being connected to the internal wiring conductor and the external wiring conductor; and a through conductor disposed in an interior of the insulating base, the through conductor electrically connecting the internal wiring conductor and the external wiring conductor. In a see-through plan view of the insulating base from a one main surface side, the recessed portion extends in one direction, and the through conductor is disposed in a periphery of an end portion of the recessed portion.

Abstract: A wiring board includes an insulating substrate having a side surface including a protrusion portion or a recess portion and a lower surface having a metal member bonded thereto; a wiring conductor embedded in the insulating substrate and having an exposed portion partially exposed above the protrusion portion or the recess portion from the side surface of the insulating substrate; and a metal member bonded to the lower surface of the insulating substrate. It is possible to suppress occurrence of ion migration between the wiring conductor and the metal member by increasing a distance between the exposed portion and the metal member without increasing a thickness of the wiring board.

Abstract: A wiring board includes a ceramic insulating base; a recessed portion provided on a side surface of the insulating base, the recessed portion being connected to one main surface of the insulating base; an internal wiring conductor disposed in an interior of the insulating base; an external wiring conductor disposed on one main surface of the insulating base; a recessed portion wiring conductor disposed in the recessed portion, the recessed portion wiring conductor being connected to the internal wiring conductor and the external wiring conductor; and a through conductor disposed in an interior of the insulating base, the through conductor electrically connecting the internal wiring conductor and the external wiring conductor. In a see-through plan view of the insulating base from a one main surface side, the recessed portion extends in one direction, and the through conductor is disposed in a periphery of an end portion of the recessed portion.

Abstract: A wiring board includes an insulating substrate having a side surface including a protrusion portion or a recess portion and a lower surface having a metal member bonded thereto; a wiring conductor embedded in the insulating substrate and having an exposed portion partially exposed above the protrusion portion or the recess portion from the side surface of the insulating substrate; and a metal member bonded to the lower surface of the insulating substrate. It is possible to suppress occurrence of ion migration between the wiring conductor and the metal member by increasing a distance between the exposed portion and the metal member without increasing a thickness of the wiring board.