Abstract: The invention relates to electronic technique, particularly to technology of fabricating and checking semiconductor integrated circuits and semiconductor structures. The method of manufacturing and checking electronic components consists in that a plurality of dice are disposed in a press-form, orienting to the dice bonding pads and base elements of the press-form, all non-protected surfaces of the dice except the bonding pads are insulated. Specificity of the method consists in that disposing in the press-form dice are fixed one to another forming a group carrier, providing a disposal of the dice facial (main) surfaces on common plane with one of the group carrier's surfaces, at that all the conductors, necessary for burn-in and checking, and also external connector are deposited on this plane simultaneously. Variants of the method consist in that a group metal frame is disposed simultaneously with the dice.

Abstract: The invention relates to an area of electronic equipment assembly using packaged and unpackaged electronic components. The invention solves a problem of creating an all-purpose construction of three-dimensional electronic modules with the possibility of employing practically any kind of packaged and unpackaged electronic components, providing high packing density, effecting heat removal and allowing good accessibility for repair. This is provided due to the arrangement of both packaged and unpackaged components in three-dimensional space in combination with effective heat removal directly from heat emitting components. Use of corrugated commutation boards and ordinary tools allows repair of any alternative design of the module without dismounting other components. This constructive solution allows an increased packing density of electronic equipment by 2-10 times in comparison with conventional constructions and increases mean time between failures (MTBF).

Abstract: A double-sided electronic device includes a heat conductive substrate having working zones of structures and components disposed thereon in double planar arrangement, as a monolithic or hybrid electronic device. In order to connect the structures or components, disposed on different sides of a substrate, connecting conductors go through the substrate's edges. At the same time the connecting conductors are insulated from the structures and pass on main surfaces of double-sided electronic device. In a case of failure detection after burn-in and checking, the device having one good side is used as conventional, housed in a package or three-dimensional module. A device having two good surfaces has double information capacity. The invention provides a large economic benefit due to economy of materials and significantly increases a packing density of electronic equipment.

Abstract: Three-dimensional flexible electronic module consists of unpackaged electronic components, packaged electronic components and microboards with unpackaged active and passive electronic components. The module can contain different transducers and receiver-transmitter system. Unpackaged electronic components, packaged electronic components and microboards besides interconnections are electrically connected one to another by the means of flexible corrugated commutation boards having variable cross-section. Every heat emitting component is obtained by a heat sink, having a heat contact with external flexible cover of the module. Repairability of the module in the case of any component failure is provided.The being proposed construction, having all the advantages of three-dimensional modules (first of all, high packing density), is able to change its shape: be compressed and strained, bended in every direction without any change in functional properties.

Abstract: The invention discloses a three-dimensional module with the use of volume unpackaged and film electronic components.Between the independent electronic components comprising IC chips and the microboards comprising active and passive electronic components are disposed intermediate multifunctional boards. All module members are fabricated mostly from heat conductive materials, and together with the module's heatsinks make up an effective heat dissipation system. The microboards and intermediate boards further contain film active and passive components fabricated using semiconductor, thin film and thick film techniques and increasing the operational range of equipment. The proposed design is versatile and can be used in any-purpose electronic equipment.The module structure allows its application under severe operational conditions and increases the packing density up to the technological limit.