Abstract: It relates to the technical field of cooling devices, a cooling integrated system configured to cool a computing device provided with a cooling channel, which includes a housing and a cooling apparatus integrally packaged inside the housing. The cooling apparatus includes a heat exchange mechanism, a liquid inlet pipe, a liquid return pipe, and a delivery pump. The heat exchange mechanism and the cooling channel are communicated by the liquid inlet pipe, and the heat exchange mechanism and the cooling channel are communicated by the liquid return pipe. The delivery pump is installed on the liquid inlet pipe and/or the liquid return pipe and configured to circulate coolant between the heat exchange mechanism and the cooling channel to cool the computing device. The cooling apparatuses in the cooling integrated system of the embodiments of the present application are integrally configured.

Abstract: Provided are a power distribution unit and a rack system. The power distribution unit includes: a terminal block (1) having an input terminal (11) for power supply and a lead-out terminal (12) for power supply; at least one wiring pad (2) respectively electrically connected to the lead-out terminal (12); a plurality of power output terminal groups (3), each power output terminal group (3) being composed of at least one power output terminal (31), and each power output terminal (31) being electrically connected to a respective wiring pad (2); and a plurality of switch mechanisms (4) provided in such a way that a switch mechanism (4) is correspondingly provided for a power output terminal group (3), where the switch mechanism (4) causes the corresponding power output terminal group (3) to be electrically connected to or electrically disconnected from the corresponding wiring pad (2).