Patents by Inventor Yury Tolmachev

Yury Tolmachev has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FLIP CHIP BONDING APPARATUS AND MANUFACTURING METHOD THEREOF
    Publication number: 20120118876
    Abstract: According to example embodiments, a flip chip bonding apparatus includes a metal chamber, a stage in the metal chamber, and a planar antenna in the chamber. The stage may be configured to receive a circuit board having flip chips arranged thereon. The antenna may be configured to bond the flip chips to the circuit board by inductively heating the flip chips on the circuit board.
    Type: Application
    Filed: November 4, 2011
    Publication date: May 17, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung Hyun Cho, Yury Tolmachev, Sang Jean Jeon, Byung Joon Lee, Jae Bong Shin, Hyungjoon Kim, Moon Seok Kim
  • Plasma Generating Apparatus
    Publication number: 20120007503
    Abstract: At least two antenna coils are electrically connected in parallel to each other to generate uniform high density plasma, and capacitors are installed between the respective antenna coils and a ground to minimize an antenna voltage, thereby minimizing the effect of capacitive plasma coupling due to the antenna voltage.
    Type: Application
    Filed: July 6, 2011
    Publication date: January 12, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyungjoon Kim, Sang Jean Jeon, Yury Tolmachev, Vasily Pashkovskiy, Sangheon Lee, Yunkwang Jeon