Patents by Inventor Yusaku Ito

Yusaku Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11474143
    Abstract: A testing apparatus for measuring a strength of a chip includes: a cassette mounting base on which to mount a cassette capable of accommodating wafer units; a frame fixing mechanism that fixes an annular frame of the wafer unit; a conveying mechanism that conveys the wafer unit between the cassette and the frame fixing mechanism; a pushing-up mechanism that pushes up a predetermined chip included in the wafer supported by the annular frame fixed by the frame fixing mechanism; a pick-up mechanism having a collet picking up the chip pushed up by the pushing-up mechanism; a strength measuring mechanism having a support unit supporting the chip picked up by the collet; and a collet moving mechanism that moves the collect from a position facing the pushing-up mechanism to a position facing the support unit.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: October 18, 2022
    Assignee: DISCO CORPORATION
    Inventors: Makoto Kobayashi, Okito Umehara, Yoshinobu Saito, Yusaku Ito, Hirohide Yano, Kazunari Tamura
  • Patent number: 11402310
    Abstract: A measuring apparatus for measuring a flexural strength of a test piece includes a support unit having a first support member and a second support member that are spaced from each other, for supporting a lower surface of the test piece, a presser for pressing the test piece, a moving mechanism for relatively moving the presser toward and away from the test piece supported by the support unit, a load measuring unit for measuring a load applied to the presser when the presser presses the test piece supported by the support unit, and a controller having a calculating section for calculating the flexural strength of the test piece on the basis of a thickness and a width of the test piece, a spacing between the first support member and the second support member, and a maximum value of the load measured by the load measuring unit.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: August 2, 2022
    Assignee: DISCO CORPORATION
    Inventors: Yoshinobu Saito, Yusaku Ito
  • Publication number: 20220236185
    Abstract: A method of detecting a Facet region includes: a fluorescence luminance detecting step of detecting fluorescence luminance unique to SiC by irradiating a SiC ingot with exciting light having a predetermined wavelength from a top surface of the SiC ingot; and a coordinate setting step of setting a region in which the fluorescence luminance is equal to or higher than a predetermined value in the fluorescence luminance detecting step as a non-Facet region, setting a region in which the fluorescence luminance is lower than the predetermined value in the fluorescence luminance detecting step as a Facet region, and setting coordinates of a boundary between the Facet region and the non-Facet region.
    Type: Application
    Filed: April 13, 2022
    Publication date: July 28, 2022
    Inventors: Yusaku ITO, Naoki MURAZAWA, Kazuya HIRATA
  • Patent number: 11340163
    Abstract: A method of detecting a Facet region includes: a fluorescence luminance detecting step of detecting fluorescence luminance unique to SiC by irradiating a SiC ingot with exciting light having a predetermined wavelength from a top surface of the SiC ingot; and a coordinate setting step of setting a region in which the fluorescence luminance is equal to or higher than a predetermined value in the fluorescence luminance detecting step as a non-Facet region, setting a region in which the fluorescence luminance is lower than the predetermined value in the fluorescence luminance detecting step as a Facet region, and setting coordinates of a boundary between the Facet region and the non-Facet region.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: May 24, 2022
    Assignee: DISCO CORPORATION
    Inventors: Yusaku Ito, Naoki Murazawa, Kazuya Hirata
  • Patent number: 11032456
    Abstract: An imaging unit for an ultrafast imaging apparatus includes an objective lens opposing a workpiece supported on a chuck table, a beam splitter disposed in a first optical path extending from the objective lens, an image processing unit disposed in a second optical path extending from the beam splitter, and an illumination unit disposed in a third optical path extending from the beam splitter. The illumination unit includes a broadband pulsed light source, and a spectrometer configured to divide a single pulse of light, which has been emitted from the broadband pulsed light source, into a plurality of wavelengths and to produce a time lag between each two adjacent ones of the plurality of wavelengths.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: June 8, 2021
    Assignee: DISCO CORPORATION
    Inventors: Keiji Nomaru, Yusaku Ito
  • Patent number: 10930616
    Abstract: A semiconductor module includes a substrate, a semiconductor element, and a wire. The semiconductor element is joined onto the substrate and has a surface electrode. Both ends of the wire are bonded to the substrate such that the wire passes over the surface electrode of the semiconductor element. The wire is electrically connected to the surface electrode.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: February 23, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Yusaku Ito
  • Publication number: 20210048472
    Abstract: A semiconductor device improved in deterioration detection accuracy by using an inductance of a bonding wire. The semiconductor device includes a first conductor pattern formed on the insulating substrate, the main current of the semiconductor die device flowing through the first conductor pattern; a second conductor pattern formed on the insulating substrate for sensing the potential of the surface electrode of the semiconductor die device; a first bonding wire for connecting the surface electrode and the first conductor pattern; and a second bonding wire. Further, there is a voltage sensing unit which is connected to the first conductor pattern and the second conductor pattern to sense a potential difference between the first conductor pattern and the second conductor pattern at the time of switching of the semiconductor die device; and a deterioration detection unit for detecting deterioration of the first bonding wire by using the sensed potential difference.
    Type: Application
    Filed: December 3, 2018
    Publication date: February 18, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yusaku ITO, Yusuke NAKAMATSU, Jun TOMISAWA
  • Publication number: 20200371005
    Abstract: A measuring apparatus for measuring a flexural strength of a test piece includes a support unit having a first support member and a second support member that are spaced from each other, for supporting a lower surface of the test piece, a presser for pressing the test piece, a moving mechanism for relatively moving the presser toward and away from the test piece supported by the support unit, a load measuring unit for measuring a load applied to the presser when the presser presses the test piece supported by the support unit, and a controller having a calculating section for calculating the flexural strength of the test piece on the basis of a thickness and a width of the test piece, a spacing between the first support member and the second support member, and a maximum value of the load measured by the load measuring unit.
    Type: Application
    Filed: May 14, 2020
    Publication date: November 26, 2020
    Inventors: Yoshinobu SAITO, Yusaku ITO
  • Publication number: 20200322510
    Abstract: An imaging unit for an ultrafast imaging apparatus includes an objective lens opposing a workpiece supported on a chuck table, a beam splitter disposed in a first optical path extending from the objective lens, an image processing unit disposed in a second optical path extending from the beam splitter, and an illumination unit disposed in a third optical path extending from the beam splitter. The illumination unit includes a broadband pulsed light source, and a spectrometer configured to divide a single pulse of light, which has been emitted from the broadband pulsed light source, into a plurality of wavelengths and to produce a time lag between each two adjacent ones of the plurality of wavelengths.
    Type: Application
    Filed: March 25, 2020
    Publication date: October 8, 2020
    Inventors: Keiji NOMARU, Yusaku ITO
  • Publication number: 20200182923
    Abstract: A testing apparatus for measuring a strength of a chip includes: a cassette mounting base on which to mount a cassette capable of accommodating wafer units; a frame fixing mechanism that fixes an annular frame of the wafer unit; a conveying mechanism that conveys the wafer unit between the cassette and the frame fixing mechanism; a pushing-up mechanism that pushes up a predetermined chip included in the wafer supported by the annular frame fixed by the frame fixing mechanism; a pick-up mechanism having a collet picking up the chip pushed up by the pushing-up mechanism; a strength measuring mechanism having a support unit supporting the chip picked up by the collet; and a collet moving mechanism that moves the collect from a position facing the pushing-up mechanism to a position facing the support unit.
    Type: Application
    Filed: December 9, 2019
    Publication date: June 11, 2020
    Inventors: Makoto KOBAYASHI, Okito UMEHARA, Yoshinobu SAITO, Yusaku ITO, Hirohide YANO, Kazunari TAMURA
  • Publication number: 20200150038
    Abstract: A method of detecting a Facet region includes: a fluorescence luminance detecting step of detecting fluorescence luminance unique to SiC by irradiating a SiC ingot with exciting light having a predetermined wavelength from a top surface of the SiC ingot; and a coordinate setting step of setting a region in which the fluorescence luminance is equal to or higher than a predetermined value in the fluorescence luminance detecting step as a non-Facet region, setting a region in which the fluorescence luminance is lower than the predetermined value in the fluorescence luminance detecting step as a Facet region, and setting coordinates of a boundary between the Facet region and the non-Facet region.
    Type: Application
    Filed: November 6, 2019
    Publication date: May 14, 2020
    Inventors: Yusaku ITO, Naoki MURAZAWA, Kazuya HIRATA
  • Patent number: 10643969
    Abstract: A semiconductor module includes: a semiconductor device having a front-side electrode; a bonding wire having a bonding portion bonded to the front-side electrode; a first sealing member; and a second sealing member. The first sealing member seals a portion where the front-side electrode and the bonding wire are bonded to each other. The second sealing member covers the first sealing member. The first sealing member is higher than the second sealing member in elastic modulus.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: May 5, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventor: Yusaku Ito
  • Publication number: 20200035639
    Abstract: A semiconductor module includes a substrate, a semiconductor element, and a wire. The semiconductor element is joined onto the substrate and has a surface electrode. Both ends of the wire are bonded to the substrate such that the wire passes over the surface electrode of the semiconductor element. The wire is electrically connected to the surface electrode.
    Type: Application
    Filed: December 4, 2017
    Publication date: January 30, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventor: Yusaku ITO
  • Publication number: 20190043827
    Abstract: A semiconductor module includes: a semiconductor device having a front-side electrode; a bonding wire having a bonding portion bonded to the front-side electrode; a first sealing member; and a second sealing member. The first sealing member seals a portion where the front-side electrode and the bonding wire are bonded to each other. The second sealing member covers the first sealing member. The first sealing member is higher than the second sealing member in elastic modulus.
    Type: Application
    Filed: January 31, 2017
    Publication date: February 7, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventor: Yusaku ITO
  • Patent number: 9989468
    Abstract: A fluorescence detecting apparatus includes an excitation light applying section that applies excitation light to a protective film containing an absorbing agent. A photomultiplier tube detects fluorescence emitted from the absorbing agent due to absorption of the excitation light. A fluorescence passing filter removes light having wavelengths other than the wavelength of the fluorescence emitted from the absorbing agent, and a reflecting mirror having a reflecting surface reflects the fluorescence emitted from the protective film toward the photomultiplier tube. This reflecting surface is formed by a part of a curved surface forming a spheroid having first and second foci. The first focus is positioned at a target area of the protective film where the excitation light is applied, and the second focus is positioned at a light detecting element included in the photomultiplier tube.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: June 5, 2018
    Assignee: Disco Corporation
    Inventors: Yusaku Ito, Senichi Ryo, Junichi Kuki
  • Patent number: 9976951
    Abstract: A method detects whether or not a workpiece is coated with a water-soluble protective film. The method includes a preparatory step before detection and a detecting step. The preparatory step includes irradiating with infrared light a first region coated with the water-soluble protective film and a second region not coated with the water-soluble protective film for a reference, receiving the reflected light, and thereby acquiring an intensity of reflection from the first region and an intensity of reflection from the second region; and a threshold determining step of determining a threshold from the intensity of reflection from the first region and the intensity of reflection from the second region at a wavenumber of 3000 cm?1 to 3600 cm?1. The detecting step includes irradiating a surface of the workpiece with the infrared light, receiving the reflected light, and comparing the thus obtained intensity of reflection with the threshold.
    Type: Grant
    Filed: March 10, 2016
    Date of Patent: May 22, 2018
    Assignee: DISCO CORPORATION
    Inventors: Senichi Ryo, Yusaku Ito, Tomoaki Endo, Yukinobu Ohura, Kentaro Odanaka
  • Patent number: 9953407
    Abstract: A wafer inspection method includes a step of picking up an image of a processed face of a wafer, a step of extracting a pixel having a pixel value higher than those of peripheral pixels as a characteristic point from among pixels in each predetermined region of picked up image data to create a first image, and a step of extracting a pixel having a pixel value lower than those of peripheral pixels as a characteristic point from among the pixels in each predetermined region of the picked up image data to create a second image. The first and second images are used to inspect the processed face of the wafer.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: April 24, 2018
    Assignee: Disco Corporation
    Inventors: Yusaku Ito, Hirohide Yano, Tomoyuki Yaguchi
  • Patent number: 9895768
    Abstract: A laser processing apparatus includes a laser beam applying unit having a processing head for applying a laser beam to a workpiece held on a chuck table, a moving unit for relatively moving the chuck table and the laser beam applying unit, a controller for controlling the laser beam applying unit and the moving unit, an input unit for inputting a desired processing result, and a three-dimensional imaging unit for imaging a processed condition of the workpiece held on the chuck table to form a three-dimensional image. The controller adjusts processing conditions so as to obtain the desired processing result input by the input unit according to the desired processing result and the three-dimensional image formed by the three-dimensional imaging unit, and then controls the laser beam applying unit and the moving unit according to the processing conditions adjusted in the processing conditions adjusting step.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: February 20, 2018
    Assignee: DISCO CORPORATION
    Inventors: Junichi Kuki, Yusaku Ito
  • Patent number: 9881828
    Abstract: Disclosed herein is a wafer processing method including the steps of attaching a dicing tape to the back side of a wafer, the dicing tape being composed of a base tape, a DAF, and an adhesive layer for uniting the base tape and the DAF, imaging the wafer through the dicing tape to obtain an image of the wafer, detecting the positions of poor adhesion of the DAF from the image, storing the positions of poor adhesion detected above, dividing the wafer and the DAF into individual chips each having the DAF, curing the adhesive layer of the dicing tape by the application of ultraviolet light, selectively separating the chips with the DAF well adhered, at the boundary between the adhesive layer and the DAF according to the positions of poor adhesion stored above, and then picking up the chips with the DAF well adhered.
    Type: Grant
    Filed: January 20, 2017
    Date of Patent: January 30, 2018
    Assignee: DISCO CORPORATION
    Inventors: Shinji Yoshida, Yusaku Ito, Hirohide Yano
  • Publication number: 20170370845
    Abstract: A fluorescence detecting apparatus includes an excitation light applying section that applies excitation light to a protective film containing an absorbing agent. A photomultiplier tube detects fluorescence emitted from the absorbing agent due to absorption of the excitation light. A fluorescence passing filter removes light having wavelengths other than the wavelength of the fluorescence emitted from the absorbing agent, and a reflecting mirror having a reflecting surface reflects the fluorescence emitted from the protective film toward the photomultiplier tube. This reflecting surface is formed by a part of a curved surface forming a spheroid having first and second foci. The first focus is positioned at a target area of the protective film where the excitation light is applied, and the second focus is positioned at a light detecting element included in the photomultiplier tube.
    Type: Application
    Filed: June 13, 2017
    Publication date: December 28, 2017
    Inventors: Yusaku Ito, Senichi Ryo, Junichi Kuki