Abstract: A learning device includes: a data acquisition unit that acquires learning target data that is full-size data of a learning target; a data generation unit that divides the learning target data to generate multiple pieces of first divided data that is divided data of the learning target data, and adds, to each piece of the first divided data, first identification information for identifying a region of the first divided data in the learning target data; and a model generation unit that generates a learned model for determining an anomaly in the first divided data using first correspondence information that is a set of the first divided data and the first identification information corresponding to the first divided data.

Abstract: In accordance with an embodiment, a pattern inspection method includes applying a light to a substrate including an inspection target pattern in a plurality of optical conditions, detecting a reflected light from the substrate to acquire a pattern image for each of the optical conditions, outputting a gray value difference between the pattern image and a reference image for each of the optical conditions, and specifying a position of the defect in a stacking direction of the stacked film from a relation of the obtained gray value difference between the optical conditions. The pattern is formed by a stacked film, the optical conditions includes at least a first optical condition for detection of a defect on a surface of the stacked film.

Abstract: According to one embodiment, a laser heating treatment method includes forming a film having a higher melting point than a structural body provided on a substrate so as to cover the structural body, and heating the structural body by irradiating the film and the structural body with laser.

Abstract: According to one embodiment, a solid-state imaging device includes a first structure part, a second structure part, and a third structure part. The first structure part includes a first insulating body and a first photoelectric conversion part. The first photoelectric conversion part is periodically disposed in the first insulating body and selectively absorbs light in the first wavelength band. The second structure part includes a second insulating body and a second photoelectric conversion part. The second photoelectric conversion part is periodically disposed in the second insulating body and selectively absorbs light in the second wavelength band. The third structure part includes a third photoelectric conversion part. The third photoelectric conversion part absorbs light in a third wavelength band. When viewed in the light incidence direction, the first photoelectric conversion part, the second photoelectric conversion part, and the third photoelectric conversion part are disposed in this order.

Abstract: According to one embodiment, there is provided a solid-state imaging device including a first photoelectric conversion layer and a color filter. The color filter includes a multi-layer interference filter and a guided mode resonant grating. The guided mode resonant grating includes a plurality of diffraction gratings and a plurality of inter-grating regions. The plurality of diffraction gratings are formed of a material having a first index of refraction and periodically arrayed at least one-dimensionally. The plurality of inter-grating regions are arranged between at least the plurality of diffraction gratings. Each of the plurality of inter-grating regions includes an insulating film region and an air gap region. The insulating film region is formed of a material having a second index of refraction lower than the first index of refraction.

Abstract: An optical module comprises an apodizer includes a black resin layer having a concavity the diameter of which gradually changes in a direction light passes through the apodizer, and, provided in the concavity, a transparent resin layer having the same refractive index as the black resin layer, the black resin layer and the transparent resin layer having a total thickness of 0.001 to 0.10 mm, an input lens opposed to the black resin layer of the apodizer and an output lens opposed to the transparent resin layer of the apodizer.

Abstract: According to one embodiment, a solid-state imaging element includes a substrate, and a plurality of color filters. A plurality of photoelectric conversion units is provided in the substrate. The plurality of color filters is provided respectively for the plurality of photoelectric conversion units. The plurality of color filters is configured to selectively transmit light of a designated wavelength band. Each of the plurality of color filters includes a stacked structure unit and a periodic structure unit. A plurality of layers having different refractive indexes is stacked in the stacked structure unit. A plurality of components is provided in the periodic structure unit at different periods according to the designated wavelength band and an incident angle of the light.

Abstract: According to one embodiment, there is provided a solid-state image sensor including a photoelectric conversion layer, and a multilayer interference filter. The multilayer interference filter is arranged to conduct light of a particular color, of incident light, selectively to the photoelectric conversion layer. The multilayer interference filter has a laminate structure in which a first layer having a first refraction index and a second layer having a second refraction index are repeatedly laminated, and a third layer which is in contact with a lower surface of the laminate structure and has a third refraction index. A lowermost layer of the laminate structure is the second layer. The third refraction index is not equal to the first refraction index and is higher than the second refraction index.

Abstract: In accordance with an embodiment, a pattern inspection method includes applying a light to a substrate including an inspection target pattern in a plurality of optical conditions, detecting a reflected light from the substrate to acquire a pattern image for each of the optical conditions, outputting a gray value difference between the pattern image and a reference image for each of the optical conditions, and specifying a position of the defect in a stacking direction of the stacked film from a relation of the obtained gray value difference between the optical conditions. The pattern is formed by a stacked film, the optical conditions includes at least a first optical condition for detection of a defect on a surface of the stacked film.

Abstract: A solid-state imaging device includes: a substrate including a plurality of light receiving sections; and a color filter including a guided-mode resonant grating provided immediately above each of the plurality of light receiving sections, at least one of an upper surface and a lower surface of the guided-mode resonant grating being covered with a layer having a lower refractive index than the guided-mode resonant grating.

Abstract: A solid-state imaging device includes: a substrate including a plurality of light receiving sections; an optical waveguide provided above each of the plurality of light receiving sections and surrounded by a cladding layer; a color filter provided above each of the optical waveguides; and a lens provided above the color filter, the optical waveguide including a first layer having a first refractive index and a second layer being in contact with the first layer and having a second refractive index higher than the first refractive index.

Abstract: In accordance with an embodiment, a pattern inspection method includes: applying a light generated from a light source to the same region of a substrate in which an inspection target pattern is formed; guiding, imaging and then detecting a reflected light from the substrate, and acquiring a detection signal for each of a plurality of different wavelengths; and adding the detection signals of the different wavelengths in association with an incident position of an imaging surface to generate added image data including information on a wavelength and signal intensity, judging, by the added image data, whether the inspection target pattern has any defect, and when judging that the inspection target pattern has a defect, detecting the position of the defect in a direction perpendicular to the substrate.

Abstract: An optical module comprises an apodizer includes a black resin layer having a concavity the diameter of which gradually changes in a direction light passes through the apodizer, and, provided in the concavity, a transparent resin layer having the same refractive index as the black resin layer, the black resin layer and the transparent resin layer having a total thickness of 0.001 to 0.10 mm, an input lens opposed to the black resin layer of the apodizer and an output lens opposed to the transparent resin layer of the apodizer.

Abstract: According to one embodiment, a pattern inspection apparatus includes a light source, a beam splitter, a first optical system, a second optical system, a controller, a phase controller and a detector. The beam splitter splits an emitted light into first and second optical paths. The first optical system delivers the light to a first pattern and delivers a first reflected light from the first pattern. The second optical system delivers the light to a second pattern and delivers a second reflected light from the second pattern. The controller is provided on the optical path, and intensities of the first and second reflected lights are substantially equal. The phase controller is provided on the optical path, and phases of the first and second reflected lights are inverted. In addition, the detector detects a light that the first and second reflected lights are made to interfere with each other.

Abstract: According to one embodiment, there is provided a solid-state image sensor including a photoelectric conversion layer, and a multilayer interference filter. The multilayer interference filter is arranged to conduct light of a particular color, of incident light, selectively to the photoelectric conversion layer. The multilayer interference filter has a laminate structure in which a first layer having a first refraction index and a second layer having a second refraction index are repeatedly laminated, and a third layer which is in contact with a lower surface of the laminate structure and has a third refraction index. A lowermost layer of the laminate structure is the second layer. The third refraction index is not equal to the first refraction index and is higher than the second refraction index.

Abstract: According to one embodiment, there is provided a solid-state imaging device including a first photoelectric conversion layer and a color filter. The color filter includes a multi-layer interference filter and a guided mode resonant grating. The guided mode resonant grating includes a plurality of diffraction gratings and a plurality of inter-grating regions. The plurality of diffraction gratings are formed of a material having a first index of refraction and periodically arrayed at least one-dimensionally. The plurality of inter-grating regions are arranged between at least the plurality of diffraction gratings. Each of the plurality of inter-grating regions includes an insulating film region and an air gap region. The insulating film region is formed of a material having a second index of refraction lower than the first index of refraction.

Abstract: In one embodiment, a pattern inspection apparatus includes a light source configured to generate light, and a condenser configured to shape the light into a line beam to illuminate a wafer with the line beam. The apparatus further includes a spectrometer configured to disperse the line beam reflected from the wafer. The apparatus further includes a two-dimensional detector configured to detect the line beam dispersed by the spectrometer, and output a signal including spectrum information of the line beam. The apparatus further includes a comparison unit configured to compare the spectrum information obtained from corresponding places of a repetitive pattern on the wafer with each other, and a determination unit configured to determine whether the wafer includes a defect, based on a comparison result of the spectrum information.

Abstract: According to one embodiment, a solid-state imaging element includes a substrate, and a plurality of color filters. A plurality of photoelectric conversion units is provided in the substrate. The plurality of color filters is provided respectively for the plurality of photoelectric conversion units. The plurality of color filters is configured to selectively transmit light of a designated wavelength band. Each of the plurality of color filters includes a stacked structure unit and a periodic structure unit. A plurality of layers having different refractive indexes is stacked in the stacked structure unit. A plurality of components is provided in the periodic structure unit at different periods according to the designated wavelength band and an incident angle of the light.

Abstract: According to one embodiment, a solid state imaging device includes a substrate, and a plurality of interference filters. The substrate includes a plurality of photoelectric conversion units. The plurality of interference filters is provided individually for the plurality of photoelectric conversion units. The plurality of interference filters includes a plurality of layers with different refractive indices stacked. The plurality of interference filters is configured to selectively transmit light in a prescribed wavelength range. A space is provided between adjacent ones of the interference filters.

Abstract: In accordance with an embodiment, a pattern inspection apparatus includes a stage supporting a substrate with a pattern, a light source irradiating the substrate with light, a detection unit, an optical system, a focus position change unit, a control unit, and a determination unit. The detection unit detects reflected light from the substrate. The optical system leads the light from the light source to the substrate and leads the reflected light to the detection unit. The focus position change unit changes a focus position of the light to the substrate in a direction vertical to the surface of the substrate. The control unit associates the movement of the stage with the light irradiation and controls the stage drive unit and the focus position change unit, thereby changing the focus position. The determination unit determines presence/absence of a defect of the pattern based on the signal from the determination unit.