Patents by Inventor Yusaku Matsuda

Yusaku Matsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5067969
    Abstract: A cutter comprises a base plate formed by joining two thin annular members with each other; a groove formed in the outer periphery of the base plate; an annular metal supporting plate, to be positioned in the groove of the base plate, having a plurality of openings formed therethrough; and a cutting member formed around the outer periphery of the base plate with the supporting plate thereby. In the above construction, the cutting member is formed by sintering a mixture of abrasive grains and powders formed by alloying copper, cobalt and tin with each other.Since the base plate is formed by adhereing the two annular members to each other, the strength of the base plate is higher than those of conventional cutters. Therefore, there is little possibility that the base is damaged while the cutter is being used.In addition, since the supporting plate is sandwiched between the two annular members, and the cutting member is bonded, in a high strength, with the supporting plate having openings formed therethrough.
    Type: Grant
    Filed: March 9, 1990
    Date of Patent: November 26, 1991
    Assignee: Sanwa Diamond Industrial Co., Ltd.
    Inventor: Yusaku Matsuda
  • Patent number: 5016498
    Abstract: In the method for manufacturing a super abrasive cutting saw, press molds are formed with uneven portions on the main opposite surfaces. The molds define a space portion for containing the periphery of a cutting saw plate. Two masses of compressed sinterable powders are prepared. The two masses of compressed powder are brought to oppose each other while holding the periphery of the cutting saw plate therebetween for engagement. The press molds are engaged to press and hold the masses. Heating the compressed powder to sinter while pressing the same fuses the two masses of compressed powder together and to the cutting saw plate and forms a sinter around the periphery of the cutting saw plate. An apparatus used in the method of manufacturing the super abrasive cutting saw includes the space portion for containing at least the periphery of the cutting saw plate and the pressed powder.
    Type: Grant
    Filed: August 28, 1987
    Date of Patent: May 21, 1991
    Assignee: Sanwa Diamond Industrial Co., Ltd.
    Inventor: Yusaku Matsuda
  • Patent number: 5014678
    Abstract: The invention is directed to a cutter comprising, a base plate formed by bonding two sheets of thin ring member together, a plurality of projections formed thinner than the base plate on the peripheral edge thereof, an provided with holes and slits which are interposed therebetween, wires passing through the holes so as to connect the projection, and a ring-shaped cutting body including abrasive grains and formed around the projections so as to expose a portion of slits.Since the projections are formed thinner, abrasions easily take place thereon when the cutter is used. Furthermore, the cutting body at the slits is reinforced by the wires connecting the projections.Since the base plate is formed by bonding two ring members, it has a large strength as compared with the base plate used in the conventional cutter. Therefore, the base plate hardly breaks when using the cutter.
    Type: Grant
    Filed: March 9, 1990
    Date of Patent: May 14, 1991
    Assignee: Sanwa Diamond Industrial Co., Ltd.
    Inventor: Yusaku Matsuda
  • Patent number: 4982720
    Abstract: A cutting saw includes a cutting saw plate formed by bonding two thin plates having an orbicular shape together. The thin plates are bonded together by bracing or silver-alloy brazing. In fact the cutting saw plate is formed as an assemblage of two thin plates. A sinter including abrasive is formed around the periphery of the cutting saw plate. The sinter is formed in zigzag fashion in the direction of its thickness.
    Type: Grant
    Filed: April 13, 1989
    Date of Patent: January 8, 1991
    Assignee: Sanwa Diamond Industrial Co., Ltd.
    Inventor: Yusaku Matsuda
  • Patent number: 4909234
    Abstract: A cutter comprises a ring-shaped base plate. On the peripheral edge of the base plate there are formed a plurality of projections interposing slits therebetween. The projections are formed thinner than the base plate and provided with holes, through which wires are passed to connect the projections. Furthermore, around the projections, a ring-shaped cutting body is formed. The cutting body includes abrasive grains and is formed to expose a portion of slits.
    Type: Grant
    Filed: June 5, 1989
    Date of Patent: March 20, 1990
    Assignee: Sanwa Diamond Industrial Co., Ltd.
    Inventor: Yusaku Matsuda
  • Patent number: 4860721
    Abstract: A super abrasive cutting saw includes a cutting saw plate formed with concave sections in spaced relation around its periphery. The concave sections alternate with convex sections. Each successive convex section is bent outward toward the opposite surface of the cutting saw plate from the next convex section. A sinter is bonded to the periphery of the cutting saw blade by heating two bodies of a compressed powder formed of material which includes super abrasives and pressing them on the saw plate to be sintered there. Concave and convex portions of the two bodies are formed fused so that the convexities of each oppose the concavities of the other. The border thus formed is extended in zigzag fashion in the direction of thickness of the cutting saw plate corresponding to concave and convex sections thereof. The concave sections of the periphery of the cutting saw plate are deep enough and the inner rim of the sinter is placed for defining holes through the plate for plate cooling and air turbulence generation.
    Type: Grant
    Filed: August 27, 1987
    Date of Patent: August 29, 1989
    Assignee: Sanwa Diamond Industrial Co., Ltd.
    Inventor: Yusaku Matsuda