Patents by Inventor Yusaku Shimizu

Yusaku Shimizu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11977362
    Abstract: In the conventional distributed control system, since each control device updates the data area at a timing when a control packet is received, in a case where there is a difference in communication delay between the control devices or in a case where the communication delay includes jitter, it is difficult to match the contents of data in all the control devices in a case of focusing on a certain moment during system operation. Therefore, depending on the start timing of a control application, the control application operates on the basis of different data between the control devices, thus limiting control performance improvement. Accordingly, time slots on the network are allocated according to the result of a calculation unit, and a cyclic memory synchronization update unit synchronizes the timing of reflecting data in the input/output and the cyclic memory and the timing of using data of a cyclic memory.
    Type: Grant
    Filed: August 19, 2020
    Date of Patent: May 7, 2024
    Assignee: HITACHI, LTD.
    Inventors: Tatsuya Maruyama, Yusaku Otsuka, Hidenori Omiya, Toshiki Shimizu, Iori Kobayashi, Kazutaka Onishi, Noritaka Matsumoto
  • Patent number: 11850510
    Abstract: In accordance with a placement operation of a user, a part including at least one connection direction can be placed in a first placement direction in a virtual space that is a two-dimensional space including a plurality of square grid divisions, the part being square, and in accordance with a rotation operation of the user, and the part can be changed so that the part is placed in a second placement direction. Then, in accordance with a placement position in the virtual space where the part is placed in the virtual space, the first placement direction when the part is newly placed in the virtual space is determined by rotating the part to be placed in each of the square grid divisions by 90 degrees each time.
    Type: Grant
    Filed: April 2, 2021
    Date of Patent: December 26, 2023
    Assignee: NINTENDO CO., LTD.
    Inventors: Satoko Higashi, Yusaku Shimizu
  • Patent number: 11209974
    Abstract: An example of an information processing apparatus causes an object displayed on a display device to move based on a drag operation performed by a user. The information processing apparatus acquires input coordinates of the drag operation performed on the object. The information processing apparatus calculates a change amount of the input coordinates from when the drag operation has been started. The object moves based on the input coordinates during the drag operation. The information processing apparatus causes the object to move while performing a correction to make the object away from the input coordinates so that a distance between the input coordinates and coordinates of the object becomes larger in a case where the change amount is large than in a case where the change amount is small.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: December 28, 2021
    Assignee: NINTENDO CO., LTD.
    Inventors: Yosuke Oshino, Yusaku Shimizu
  • Publication number: 20210308573
    Abstract: In accordance with a placement operation of a user, a part including at least one connection direction can be placed in a first placement direction in a virtual space that is a two-dimensional space including a plurality of square grid divisions, the part being square, and in accordance with a rotation operation of the user, and the part can be changed so that the part is placed in a second placement direction. Then, in accordance with a placement position in the virtual space where the part is placed in the virtual space, the first placement direction when the part is newly placed in the virtual space is determined by rotating the part to be placed in each of the square grid divisions by 90 degrees each time.
    Type: Application
    Filed: April 2, 2021
    Publication date: October 7, 2021
    Applicant: Nintendo Co., Ltd.
    Inventors: Satoko HIGASHI, Yusaku SHIMIZU
  • Publication number: 20210187587
    Abstract: In order to manufacture a bottle can while eliminating the need for cleaning/drying after a mouth portion formation step, a bottle can manufacturing apparatus includes a necking processing part for carrying out a necking process while rotating a can body having a bottomed cylindrical shape around a rotational axis during formation of a mouth portion in the can; and a trimming processing part for subjecting the upper end portion of the can to slit processing and carrying out trimming while rotating the can while moving the can around the rotational axis. A plurality of necking processing parts are arranged in sequence, and the trimming processing part is arranged in sequence with at least one of the necking processing parts.
    Type: Application
    Filed: August 20, 2018
    Publication date: June 24, 2021
    Applicant: TOYO SEIKAN CO., LTD.
    Inventors: Tadashi ENDO, Masaomi TAMURA, Yusaku SHIMIZU
  • Patent number: 10688395
    Abstract: An example of an information processing apparatus places, as a component object to be used for collision detection, a slope object having a unit portion in a virtual space. An image representing the virtual space in which the component object is placed is generated. The information processing apparatus places a first slope object having one unit portion in the virtual space, based on a first instruction of the user. The unit portion has a first portion and a second portion. The first portion has a first side and a second side that form an interior angle being an acute angle. The information processing apparatus places a second slope object in the virtual space. The second slope object has a continuous unit portion in which a plurality of the unit portions are connected such that a plurality of the first sides thereof are connected to form a single side.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: June 23, 2020
    Assignee: Nintendo Co., Ltd.
    Inventors: Yosuke Oshino, Yusaku Shimizu
  • Patent number: 10639545
    Abstract: An example of a game system includes an operation section, and a vibrating portion provided in the same casing as the operation section. The game system performs a game process based on an output from the operation section. The game system outputs, to the vibrating portion, a vibration signal to cause the vibrating portion to produce a series of vibrations at predetermined points in time during the game process. The game system evaluates a game operation based on operations performed using the operation section in relation to the predetermined points in time.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: May 5, 2020
    Assignee: NINTENDO CO., LTD.
    Inventors: Haruka Kakinuma, Masato Mizuta, Hideki Fujii, Kazunobu Shimizu, Koji Sakai, Yusaku Shimizu
  • Publication number: 20190310751
    Abstract: An example of an information processing apparatus causes an object displayed on a display device to move based on a drag operation performed by a user. The information processing apparatus acquires input coordinates of the drag operation performed on the object. The information processing apparatus calculates a change amount of the input coordinates from when the drag operation has been started. The object moves based on the input coordinates during the drag operation. The information processing apparatus causes the object to move while performing a correction to make the object away from the input coordinates so that a distance between the input coordinates and coordinates of the object becomes larger in a case where the change amount is large than in a case where the change amount is small.
    Type: Application
    Filed: April 5, 2019
    Publication date: October 10, 2019
    Inventors: Yosuke OSHINO, Yusaku SHIMIZU
  • Publication number: 20190282905
    Abstract: An example of an information processing apparatus places, as a component object to be used for collision detection, a slope object having a unit portion in a virtual space. An image representing the virtual space in which the component object is placed is generated. The information processing apparatus places a first slope object having one unit portion in the virtual space, based on a first instruction of the user. The unit portion has a first portion and a second portion. The first portion has a first side and a second side that form an interior angle being an acute angle. The information processing apparatus places a second slope object in the virtual space. The second slope object has a continuous unit portion in which a plurality of the unit portions are connected such that a plurality of the first sides thereof are connected to form a single side.
    Type: Application
    Filed: March 15, 2019
    Publication date: September 19, 2019
    Inventors: Yosuke OSHINO, Yusaku SHIMIZU
  • Patent number: 10297470
    Abstract: Provided are a resin sheet, for sealing an electronic device, which is not easily shifted out of position; and a method for manufacturing an electronic-device package. This resin sheet, for sealing an electronic device, has a probe tack of 5 to 500 g at 25° C. The tack is measured, using a probe having a diameter of 25 mm.
    Type: Grant
    Filed: October 3, 2014
    Date of Patent: May 21, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yusaku Shimizu, Eiji Toyoda, Goji Shiga
  • Publication number: 20180185752
    Abstract: An example of a game system includes an operation section, and a vibrating portion provided in the same casing as the operation section. The game system performs a game process based on an output from the operation section. The game system outputs, to the vibrating portion, a vibration signal to cause the vibrating portion to produce a series of vibrations at predetermined points in time during the game process. The game system evaluates a game operation based on operations performed using the operation section in relation to the predetermined points in time.
    Type: Application
    Filed: December 1, 2017
    Publication date: July 5, 2018
    Inventors: Haruka KAKINUMA, Masato MIZUTA, Hideki FUJII, Kazunobu SHIMIZU, Koji SAKAI, Yusaku SHIMIZU
  • Publication number: 20160269000
    Abstract: Provided are a resin sheet, for sealing an electronic device, which is not easily shifted out of position; and a method for manufacturing an electronic-device package. This resin sheet, for sealing an electronic device, has a probe tack of 5 to 500 g at 25° C. The tack is measured, using a probe having a diameter of 25 mm.
    Type: Application
    Filed: October 3, 2014
    Publication date: September 15, 2016
    Inventors: Yusaku Shimizu, Eiji Toyoda, Goji Shiga
  • Publication number: 20160060450
    Abstract: Provided are a sealing sheet having excellent flexibility and capable of producing an electronic component package which is highly reliable even if an object to be sealed has a hollow structure, a method for manufacturing the sealing sheet, and a method for manufacturing the electronic component package. The present invention is a sealing sheet containing dispersed domains of an elastomer, the domains having a maximum diameter of 20 ?m or less.
    Type: Application
    Filed: March 17, 2014
    Publication date: March 3, 2016
    Inventors: Eiji Toyoda, Yusaku SHIMIZU, Jun ISHII
  • Patent number: 9147625
    Abstract: A thermosetting resin sheet for sealing an electronic component, that is excellent in adhesiveness, onto the electric component; a resin-sealed type semiconductor device high in reliability; and a method for producing the device are provided. The present invention relates to a thermosetting resin sheet for sealing an electronic component, comprising one or more resin components, one of the components being allowable to be a thermoplastic resin, and having a content by percentage of the thermoplastic resin of 30% or less by weight of all of the entire resin components.
    Type: Grant
    Filed: August 22, 2013
    Date of Patent: September 29, 2015
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yusaku Shimizu, Takeshi Matsumura, Eiji Toyoda, Tsuyoshi Torinari, Daisuke Uenda
  • Patent number: 8912669
    Abstract: Provided are a sealing resin sheet, wherein a clean, smooth and flat ground surface is obtained by grinding after resin sealing, a method for producing an electronic component package using the same, and an electronic component package obtained by the production method. The present invention provides a sealing resin sheet, wherein a ground surface has a mean surface roughness Ra of 1 ?m or less when grinding is performed under conditions of a grind bite peripheral velocity of 1000 m/minute, a feed pitch of 100 ?m and a cut depth of 10 ?m after a heat curing treatment is performed at 180° C. for 1 hour; and a Shore D hardness at 100° C. after the heat curing treatment is 70 or more.
    Type: Grant
    Filed: July 3, 2013
    Date of Patent: December 16, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Eiji Toyoda, Yusaku Shimizu
  • Publication number: 20140106133
    Abstract: An object of the invention is to prevent staining of processing equipment by a resin originated from a resin sheet during pressing. The present invention achieves the object by a laminate having a support, a resin sheet that is laminated on a part of the support, and a release sheet that is laminated on the resin sheet, in which a peel force F1 between the support and the resin sheet is larger than a peel force F2 between the resin sheet and the release sheet.
    Type: Application
    Filed: October 10, 2013
    Publication date: April 17, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tsuyoshi Torinari, Eiji Toyoda, Yusaku Shimizu, Daisuke UENDA
  • Publication number: 20140061955
    Abstract: A thermosetting resin sheet for sealing an electronic component, that is excellent in adhesiveness, onto the electric component; a resin-sealed type semiconductor device high in reliability; and a method for producing the device are provided. The present invention relates to a thermosetting resin sheet for sealing an electronic component, comprising one or more resin components, one of the components being allowable to be a thermoplastic resin, and having a content by percentage of the thermoplastic resin of 30% or less by weight of all of the entire resin components.
    Type: Application
    Filed: August 22, 2013
    Publication date: March 6, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yusaku Shimizu, Takeshi Matsumura, Eiji Toyoda, Tsuyoshi Torinari, Daisuke Uenda
  • Publication number: 20140042645
    Abstract: An electronic-component-sealing resin sheet capable of restraining the warp amount of a package obtained by use of the sheet, a resin-sealed type semiconductor device high in reliability, and a method for producing the device are provided. The present invention relates to a resin sheet for sealing an electronic component, wherein after the resin sheet is hot-pressed onto an iron nickel alloy plate containing 42% by weight of nickel and having a shape 90 mm square and a thickness of 0.15 mm to give a thickness 0.2 mm and the resultant hot-pressed unit is cured at 150° C., the unit exhibits a warp amount of 5 mm or less.
    Type: Application
    Filed: August 6, 2013
    Publication date: February 13, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yusaku Shimizu, Takeshi Matsumura, Eiji Toyoda, Tsuyoshi Torinari
  • Publication number: 20140008821
    Abstract: Provided are a sealing resin sheet, wherein a clean, smooth and flat ground surface is obtained by grinding after resin sealing, a method for producing an electronic component package using the same, and an electronic component package obtained by the production method. The present invention provides a sealing resin sheet, wherein a ground surface has a mean surface roughness Ra of 1 ?m or less when grinding is performed under conditions of a grind bite peripheral velocity of 1000 m/minute, a feed pitch of 100 ?m and a cut depth of 10 ?m after a heat curing treatment is performed at 180° C. for 1 hour; and a Shore D hardness at 100° C. after the heat curing treatment is 70 or more.
    Type: Application
    Filed: July 3, 2013
    Publication date: January 9, 2014
    Inventors: Eiji Toyoda, Yusaku Shimizu