Patents by Inventor Yu Seon Heo

Yu Seon Heo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package
    Patent number: 10741498
    Abstract: A semiconductor package includes: a first structure including a plurality of stacked first semiconductor chips and electrically connected to a first redistribution layer through connection vias having different heights; and a second structure including a second semiconductor chip electrically connected to a second redistribution layer. The first and second redistribution layers are electrically connected to each other through an electrical connection member formed on the second structure.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: August 11, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yu Seon Heo, Jae Kul Lee
  • SEMICONDUCTOR PACKAGE
    Publication number: 20200020638
    Abstract: A semiconductor package includes: a first structure including a plurality of stacked first semiconductor chips and electrically connected to a first redistribution layer through connection vias having different heights; and a second structure including a second semiconductor chip electrically connected to a second redistribution layer. The first and second redistribution layers are electrically connected to each other through an electrical connection member formed on the second structure.
    Type: Application
    Filed: March 19, 2019
    Publication date: January 16, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yu Seon Heo, Jae Kul Lee