Patents by Inventor Yushen Zeng

Yushen Zeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of separating a carrier-workpiece bonded stack
    Patent number: 9962919
    Abstract: The present invention provides a method of separating a bonded stack utilizing the force generated by a gas jet. The stack includes a carrier and a thinned workpiece such as device wafer that are bonded together through one or more layers therebetween. The gas jet can separate two adjacent layers having peeling strength therebetween in the range of from 0.01 to 50.0 g/cm. The invention can simplify the procedure and provide high throughput in separating thinned wafer from its carrier.
    Type: Grant
    Filed: July 11, 2015
    Date of Patent: May 8, 2018
    Assignee: Micro Materials Inc.
    Inventors: Hao Tang, Yushen Zeng
  • Method of Separating a Carrier-Workpiece Bonded Stack
    Publication number: 20160332436
    Abstract: The present invention provides a method of separating a bonded stack utilizing the force generated by a gas jet. The stack includes a carrier and a thinned workpiece such as device wafer that are bonded together through one or more layers therebetween. The gas jet can separate two adjacent layers having peeling strength therebetween in the range of from 0.01 to 50.0 g/cm. The invention can simplify the procedure and provide high throughput in separating thinned wafer from its carrier.
    Type: Application
    Filed: July 11, 2015
    Publication date: November 17, 2016
    Applicant: MICRO MATERIALS INC.
    Inventors: Hao Tang, Yushen Zeng