Abstract: An encapsulation resin composition for preapplication, comprising (a) an epoxy resin, and (b) a curing agent having flux activity, wherein the tack after B-staging is at least 0 gf/5 mm? and at most 5 gf/5 mm?, and the melt viscosity at 130° C. is at least 0.01 Pa·s and at most 1.0 Pa·s; a preapplied encapsulated component and semiconductor device using the composition, and a process of fabrication thereof. The resin composition is less susceptible to air entrapment during provisional placement of semiconductor chips, and excels in workability and reliability.

Abstract: Although techniques for determining the positions of workers and products and displaying their tracks on a two-dimensional layout were available in the past, they were inconvenient in that work times and process shifts over time could not be grasped. A technique for grasping work contents of a worker highly accurately utilizing electronic tags was also available. However, it was also inconvenient in that the workers had to read the electronic tags intentionally while at work. The work information processor (100) is capable of showing passage of time and process shifts by specifying steps at given points in time by a position sensor (161) attached to a worker.

Abstract: Disclosed is a physical configuration detector, a physical configuration detecting program, and a physical configuration detecting method, which can detect the physical configuration of an object, regardless of whether the object is in motion or not, and which can also decrease the amount of work necessary to prepare for dictionaries and the like.

Abstract: To measure an action of a worker and analyze the measurement data to determine the type of the action and also determine the type of a work, thereby providing information for improving the work itself. A work information processing apparatus (110) receives, via an antenna (143), detection values obtained by sensors (101A, 101B, 101C); determines, from an action information table, actions corresponding to the received detection values; arranges the actions in time sequence; and determines, from a work dictionary table, a work corresponding to the actions arranged in time sequence, thereby determining the actions and the work for each of workers.

Abstract: A semiconductor device 100 has a BGA substrate 110, a semiconductor chip 101, a bump 106 and an underfill 108 filling the periphery of the bump. An interlayer dielectric 104 in the semiconductor chip 101 contains a low dielectric constant film. The bump 106 is comprised of a lead-free solder. The underfill 108 is comprised of a resin material having an elastic modulus of 150 MPa to 800 MPa both inclusive, and a linear expansion coefficient of the BGA substrate 110 in an in-plane direction of the substrate is less than 14 ppm/° C.

Abstract: An encapsulation resin composition for preapplication, comprising (a) an epoxy resin, and (b) a curing agent having flux activity, wherein the tack after B-staging is at least 0 gf/5 mm? and at most 5 gf/5 mm?, and the melt viscosity at 130° C. is at least 0.01 Pa·s and at most 1.0 Pa·s; a preapplied encapsulated component and semiconductor device using the composition, and a process of fabrication thereof. The resin composition is less susceptible to air entrapment during provisional placement of semiconductor chips, and excels in workability and reliability.

Abstract: A semiconductor device 100 has a BGA substrate 110, a semiconductor chip 101, a bump 106 and an underfill 108 filling the periphery of the bump. An interlayer dielectric 104 in the semiconductor chip 101 contains a low dielectric constant film. The bump 106 is comprised of a lead-free solder. The underfill 108 is comprised of a resin material having an elastic modulus of 150 MPa to 800 MPa both inclusive, and a linear expansion coefficient of the BGA substrate 110 in an in-plane direction of the substrate is less than 14 ppm/° C.

Abstract: A liquid potting composition, a semiconductor device manufactured using such composition and a process for manufacturing a semiconductor device using such composition. The liquid potting composition comprises: (a) a liquid epoxy resin; (b) a hardener comprising a multi-hydroxy aromatic compound containing at least two hydroxy groups and at least one carboxyl group; and (c) an accelerator. Suitable hardening agents include 2,3-dihydroxybenzoic acid; 2,4-dihydroxybenzoic acid; 2,5-dihydroxybenzoic acid; 3,4-dihydroxybenzoic acid; gallic acid; 1,4-dihydroxy-2-naphthoic acid; 3,5-dihydroxy-2-naphthoic acid; phenolphthaline; diphenolic acid and mixtures thereof.

Abstract: The object of the present invention is to provide a paste for bonding a semiconductor, which has excellent low stress and excellent heat conductivity and is useful industrially. The object has been achieved by a heat-conductive paste comprising(A) an epoxy resin which is liquid at room temperature and which has at least two epoxy groups in the molecule,(B) an epoxy group-containing reactive diluent having a viscosity of 100 cp or less at room temperature,(C) a phenolic compound as a curing agent represented by the following general formula (1), which is crystalline at room temperature: ##STR1## wherein R is hydrogen atom or an alkyl group of 1-5 carbon atoms, and (D) a silver powder,wherein the amount of the silver powder (D) is 70-90% by weight of the total paste; the silver powder (D) contains an atomized silver powder consisting of flake-shaped particles having longitudinal lengths ranging from 10.mu. to 50.mu. and thicknesses ranging from 1.mu. to 5.mu.

Abstract: The present invention provides a film adhesive comprising, as the main constituent, a polyimide resin having a glass transition temperature of 350.degree. C. or lower and soluble in organic solvents, which polyimide resin is obtained by reacting at least one of the following acid components (A) and (B)(A) 4,4'-oxydiphthalic acid dianhydride(B) 3,3',4,4'-biphenyltetracarboxylic acid dianhydride and/or 3,3',4,4'-benzophenonetetracarboxylic acid dianhydridewith at least one of the following amine components (C) and (D)(C) a siloxane compound represented by the following general formula (1) and/or 2,2-bis(4-(4-amino-phenoxy)phenyl)propane ##STR1## wherein R.sub.1 and R.sub.2 are each a bivalent aliphatic (C.sub.1-4) or aromatic group; R.sub.3, R.sub.4, R.sub.5 and R.sub.6 are each a mono-valent aliphatic or aromatic group; and k is an integer of 1-20,(D) bis(aminophenoxy)benzene and/or dimethylphenylene-diamineto give rise to ring closure of imide, as well as a process for producing said film adhesive.

Abstract: A resin paste for tight sealing, comprising(A) at least one filler selected from the group consisting of Ag, Au, Cu, diamond, high-temperature sintered graphite and beryllia,(B) at least one metal filler selected from the group consisting of Al, Fe and Mg,(C) a polyimide resin having an imidization degree of 80% or more, obtained by reacting 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride or 3,3',4,4'-oxydiphthalic acid dianhydride with a diamine, and(D) an organic solvent, wherein the weight proportions of (A), (B) and (C) are(A)/[(B)+(C)]=10/90 to 90/10(B)/[(A)+(C)]=5/95 to 90/10and the weight proportion of (D) is(D)/[(A)+(B)+(C)]=0.01/100 to 50/100.

Abstract: A process for producing a substrate for optical recording medium (optical disk recording medium), which comprises coating at least one inner surface of a casting mold with a radiation-curable or thermosetting resin, curing the resin to form a coating film on the mold surface or surfaces, casting into the mold an epoxy resin composition comprising an alicyclic epoxy resin or a mixture of an alicyclic epoxy resin and an aromatic epoxy resin, an organic polybasic acid anhydride, a curing accelerator and an anti-discoloring (anti-oxidative) agent, curing the epoxy resin composition to transfer the coating film of the mold to the surface of the cured product of the epoxy resin composition, thereby forming a double or triple layer cast laminate. The above casting mold may have a mold-releasing film on the inner surfaces and the coating film may be formed on this mold-releasing film.