Patents by Inventor Yushi SOETA

Yushi SOETA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11984637
    Abstract: A transmission line includes first, second, third, and fourth signal lines, and first, second, third, and fourth electrode pads respectively connected thereto. A first main surface of an external connection portion includes a first region in which the first electrode pad and the second electrode pad are provided, and a second region in which the third electrode pad and the fourth electrode pad are provided. Each of the first electrode pad and the second electrode pad, in a plan view, is surrounded by a ground electrode, and at least one of the third electrode pad and the fourth electrode pad, in the plan view, includes a portion that is not surrounded by the ground electrode.
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: May 14, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yushi Soeta, Hiromasa Koyama
  • Publication number: 20230318160
    Abstract: A multilayer body has a structure including insulating layers stacked on each other in an up-down direction. A first conductive layer is on a top main surface of one of the insulating layers. A first signal is transmitted through the first conductive layer. A second conductive layer is on a same insulating layer that the first conductive layer is on. The second conductive layer is on a same main surface as the top main surface or the bottom main surface of the insulating layer on which the first conductive layer is located. A second signal having a higher frequency than the first signal is transmitted through the second conductive layer. A top conductive layer is above the second conductive layer. A thickness of the second conductive layer in the up-down direction is smaller than that of the first conductive layer in the up-down direction.
    Type: Application
    Filed: June 8, 2023
    Publication date: October 5, 2023
    Inventors: Yushi SOETA, Kentarou KAWABE, Kouki SHIMIZU, Toru KURISU, Akihiro YAMAKAWA
  • Publication number: 20230038684
    Abstract: A conductor non-formed portion where no conductor layer exists is provided in a first ground conductor layer. A multilayer body is provided with a void where no insulating resin exists. At least a portion of the conductor non-formed portion is provided in a first area positioned at a right of a first interlayer connection conductor with respect to a multilayer body left-right direction and at left of a second interlayer connection conductor with respect to the multilayer body left-right direction in a view in a multilayer body downward direction. At least a portion of a void overlaps with the conductor non-formed portion in the view in the multilayer body downward direction and is provided above a first signal conductor layer with respect to a multilayer body up-down direction and below the first ground conductor layer with respect to the multilayer body up-down direction.
    Type: Application
    Filed: October 24, 2022
    Publication date: February 9, 2023
    Inventor: Yushi SOETA
  • Publication number: 20220077556
    Abstract: A transmission line includes first, second, third, and fourth signal lines, and first, second, third, and fourth electrode pads respectively connected thereto. A first main surface of an external connection portion includes a first region in which the first electrode pad and the second electrode pad are provided, and a second region in which the third electrode pad and the fourth electrode pad are provided. Each of the first electrode pad and the second electrode pad, in a plan view, is surrounded by a ground electrode, and at least one of the third electrode pad and the fourth electrode pad, in the plan view, includes a portion that is not surrounded by the ground electrode.
    Type: Application
    Filed: November 19, 2021
    Publication date: March 10, 2022
    Inventors: Yushi SOETA, Hiromasa KOYAMA