Abstract: A resin composition for temporary fixing, the resin composition containing (A) a thermoplastic resin, (B) a thermosetting resin, and (C) a silicone compound, the resin composition having a shear viscosity of 4000 Pa·s or less at 120° C. and a rate of change in the shear viscosity being within 30% as determined before and after the resin composition is left to stand for 7 days in an atmosphere of 25° C.

Abstract: The present invention relates to a method for manufacturing an electronic component having an electromagnetic shield, comprising: a bonding step of bonding a temporary protective material on a workpiece with unevenness on the surface thereof; a photocuring step of curing the temporary protective material by light irradiation; a icing step of singulating the workpiece and the temporary protective material; a shielding step of forming a metal film on the portion of the singulated workpiece, the portion having no temporary protective material bonded thereon; and a peeling step of peeling the temporary protective material from the workpiece having the metal film formed, wherein the temporary protective material is formed from a resin composition for temporary protection with an elastic modulus at 25° C. of 3 MPa or less and an elastic modulus at 25° C. of 40 MPa or more after light irradiation with an exposure dose of 500 mJ/cm2 or more.

Abstract: The present invention relates to a method for manufacturing an electronic component having an electromagnetic shield, comprising: a bonding step of bonding a temporary protective material on a workpiece with unevenness on the surface thereof; a photocuring step of curing the temporary protective material by light irradiation; a icing step of singulating the workpiece and the temporary protective material; a shielding step of forming a metal film on the portion of the singulated workpiece, the portion having no temporary protective material bonded thereon; and a peeling step of peeling the temporary protective material from the workpiece having the metal film formed, wherein the temporary protective material is formed from a resin composition for temporary protection with an elastic modulus at 25° C. of 3 MPa or less and an elastic modulus at 25° C. of 40 MPa or more after light irradiation with an exposure dose of 500 mJ/cm2 or more.

Abstract: Chemically modified carbon nanotubes composed of carbon nanotubes (such as multiwall carbon nanotubes) having carboxyl groups on the surface thereof and polymeric aniline (such as 3- to 300-meric aniline) bonding thereto through the amide linkage. The chemically modified carbon nanotubes exhibit good affinity with organic solvents and readily disperse into organic solvents.

Abstract: Chemically modified carbon nanotubes composed of carbon nanotubes (such as multiwall carbon nanotubes) having carboxyl groups on the surface thereof and polymeric aniline (such as 3- to 300-meric aniline) bonding thereto through the amide linkage. The chemically modified carbon nanotubes exhibit good affinity with organic solvents and readily disperse into organic solvents.

Abstract: A magnetic recording medium comprising a non-magnetic transparent support, a magnetic layer, and a conductive intermediate layer formed between the non-magnetic transparent support and the magnetic layer, the conductive intermediate layer comprising, as major components, powder of conductive metal or metal compound and a binder resin, wherein:the binder resin of the intermediate layer contains from 10 to 200 .mu.eq/g of --SO.sub.3 M group, --COOM group, --PO.sub.3 M.sub.2 group, or --NH.sub.3.sup.+ X.sup.- group, where M is a hydrogen atom, an alkali metal atom, or an alkaline earth metal atom, and X is a monovalent anion, andthe ratio of the content of the powder of the conductive metal or metal compound to that of the binder resin, based on weight, in the conductive intermediate layer is from 8 to 13, and a recording/reproducing method.