Patents by Inventor Yusman Sugianto

Yusman Sugianto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Test pin configuration for test device for testing devices under test
    Patent number: 10197599
    Abstract: A test pin for a test device for electrically contacting a device under test to be tested, wherein the test pin comprises an electrically conductive base structure for electrically conducting a test signal between the device under test and the test device, and an exchangeable electrically conductive pin tip body configured to directly contact the device under test and to be exchangeably assembled with the base structure.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: February 5, 2019
    Assignee: Infineon Technologies AG
    Inventors: Fu San Hiew, Siao Kiat Tan, Wee Kuan Tan, Arieff Ridzwan Yussuff, Murad Hudda, Wang Xiaojun, Ge Dandong, Yusman Sugianto, Tay Chyeo Yong, Lee Chow York, Gan Swee Lee
  • Test Pin Configuration for Test Device for Testing Devices Under Test
    Publication number: 20170176494
    Abstract: A test pin for a test device for electrically contacting a device under test to be tested, wherein the test pin comprises an electrically conductive base structure for electrically conducting a test signal between the device under test and the test device, and an exchangeable electrically conductive pin tip body configured to directly contact the device under test and to be exchangeably assembled with the base structure.
    Type: Application
    Filed: December 16, 2015
    Publication date: June 22, 2017
    Inventors: Fu San HIEW, Siao Kiat TAN, Wee Kuan TAN, Arieff Ridzwan YUSSUFF, Murad HUDDA, Wang XIAOJUN, Ge DANDONG, Yusman SUGIANTO, Tay CHYEO YONG, Lee CHOW YORK, Gan SWEE LEE
  • SOCKET ATTACHMENT STRUCTURE AND SPRING MEMBER
    Publication number: 20150139722
    Abstract: A socket attachment structure for attaching a socket to a substrate, the socket including a plurality of contact probes that respectively contact the substrate and a contacted body at both longitudinal direction ends thereof, a probe holder that accommodates and holds therein the plurality of contact probes according to a predetermined pattern, and a holder member provided around the probe holder, includes: a plurality of support members that extend out from a principal plane of the substrate and are respectively inserted through insertion holes provided in the holder member; and a spring member that is attached to the plurality of support members in a state of biasing the holder member placed on the substrate towards the substrate.
    Type: Application
    Filed: March 4, 2013
    Publication date: May 21, 2015
    Applicant: NHK SPRING CO., LTD.
    Inventors: Yoshio Yamada, Kohei Hironaka, Yusman Sugianto, Chee Ping B. Loh, Choon Joo S. Yeow, Teck H. Wong, Xiaojun T. Wang
  • DOCKING DEVICE, DOCKING METHOD
    Publication number: 20140043053
    Abstract: A docking device for connecting a semiconductor probe to a semiconductor handler has in each case one probe-side and one handler-side connecting device, a handling device for handling a contact-making device and a coupling device for coupling the connecting devices. The coupling device has a first shifting device, which allows the translational and guided shifting of the probe-side connecting device relative to the handler-side connecting device towards and away from one another.
    Type: Application
    Filed: March 13, 2012
    Publication date: February 13, 2014
    Applicant: ESMO AG
    Inventors: Werner Huber, Yusman Sugianto, Cheng Khoon Clement Sng