Patents by Inventor Yusua Agabus

Yusua Agabus has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microneedles and methods of fabricating
    Patent number: 7785459
    Abstract: Low cost methods for fabricating microneedles are disclosed. According to one embodiment, the fabrication method includes the steps of: providing a substrate; forming a metal-containing seed layer on the top surface of the substrate; forming a nonconductive pattern on a portion of the seed layer; plating a first metal on the seed layer and over the edge of the nonconductive pattern to create a micromold with an opening that exposes a portion of the nonconductive pattern; plating a second metal onto the micromold to form a microneedle in the opening; separating the micromold with the microneedle formed therein from the seed layer and the nonconductive pattern; and selectively etching the micromold so as to release the microneedle. In another embodiment, the micromold is not required.
    Type: Grant
    Filed: May 28, 2006
    Date of Patent: August 31, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ramesh S/O Govinda Raju, Ming-Li Tan, Yusua Agabus, Patricia A. Beck
  • Microneedles and Method Of Fabricating Thereof
    Publication number: 20060226016
    Abstract: Low cost methods for fabricating microneedles are disclosed. According to one embodiment, the fabrication method includes the steps of: providing a substrate; forming a metal-containing seed layer on the top surface of the substrate; forming a nonconductive pattern on a portion of the seed layer; plating a first metal on the seed layer and over the edge of the nonconductive pattern to create a micromold with an opening that exposes a portion of the nonconductive pattern; plating a second metal onto the micromold to form a microneedle in the opening; separating the micromold with the microneedle formed therein from the seed layer and the nonconductive pattern; and selectively etching the micromold so as to release the microneedle. In another embodiment, the micromold is not required.
    Type: Application
    Filed: May 28, 2006
    Publication date: October 12, 2006
    Inventors: Ramesh S/O Govinda Raju, Ming-Li Tan, Yusua Agabus, Patricia Beck