Abstract: A solid-state drive device includes a memory module in which at least one non-volatile memory device is mounted, a first heat storage unit and a second heat storage unit covering upper and lower parts of the memory module, respectively, to store heat emitted by the memory module, and having at least portions connected to each other, respectively, a cover having a space in which the memory module and the first and second heat storage units are received and arranged with a spacing distance from the first and second heat storage units, respectively, and an inner frame arranged between the cover and at least one of the first and second heat storage units, to provide the spacing distance.

Abstract: Provided are a receptacle connector configured to avoid damage to conductors of the receptacle connector. The receptacle connector includes a plurality of connection terminals, a mold structure which comprises a front part exposing each of the connection terminals and a support part disposed on a rear end of the front part and surrounding each of the connection terminals, and a shield which is disposed on the support part and comprises a conductive material, wherein the support part comprises a flat part which includes a surface along which the shield extends and a protruding part which protrudes from the surface of the flat part and is disposed in front of a front end of the shield. The protruding part is configured to avoid damage to conductors of the receptacle when a plug is mated to the receptacle.

Abstract: An electronic device includes a substrate, at least one electronic element on the substrate, a heat dissipating pad on the substrate in thermal contact with the at least one electronic element, and including an encapsulated phase change material therein, and a bracket covering the substrate, the at least one electronic element and the heat dissipating pad.

Abstract: A method for estimating the remaining life of a solid state drive (SSD) device includes generating a sensing value by periodically measuring an environmental variable, generating a load value associated with the SSD device based on the sensing value and a distance between the sensor and the SSD device, calculating stress applied to the SSD device based on the load value, calculating damage of the SSD device based on a stress-life curve and the stress, and determining the remaining life of the SSD device based on a difference between a threshold value and the damage. The stress-life curve may represent a relationship between the stress and life of the SSD device.

Abstract: A solid-state drive device includes a memory module in which at least one non-volatile memory device is mounted, a first heat storage unit and a second heat storage unit covering upper and lower parts of the memory module, respectively, to store heat emitted by the memory module, and having at least portions connected to each other, respectively, a cover having a space in which the memory module and the first and second heat storage units are received and arranged with a spacing distance from the first and second heat storage units, respectively, and an inner frame arranged between the cover and at least one of the first and second heat storage units, to provide the spacing distance.

Abstract: A method for estimating the remaining life of a solid state drive (SSD) device includes generating a sensing value by periodically measuring an environmental variable, generating a load value associated with the SSD device based on the sensing value and a distance between the sensor and the SSD device, calculating stress applied to the SSD device based on the load value, calculating damage of the SSD device based on a stress-life curve and the stress, and determining the remaining life of the SSD device based on a difference between a threshold value and the damage. The stress-life curve may represent a relationship between the stress and life of the SSD device.

Abstract: A storage device includes memories and a controller. The controller controls first and second program operations on the memory. When a temperature of the memory is lower than a reference value, the controller controls execution of the first program operation. When the temperature of the memory is equal to or higher than the reference value, the controller controls execution of the second program operation which consumes a smaller amount of power than the first program operation. The controller adjusts an operational condition of the memory such that bandwidth on the memory remains equivalent during the first and second program operations.

Abstract: A storage device includes memories and a controller. The controller controls first and second program operations on the memory. When a temperature of the memory is lower than a reference value, the controller controls execution of the first program operation. When the temperature of the memory is equal to or higher than the reference value, the controller controls execution of the second program operation which consumes a smaller amount of power than the first program operation. The controller adjusts an operational condition of the memory such that bandwidth on the memory remains equivalent during the first and second program operations.

Abstract: A memory module includes a module board extending in one direction, a plurality of electronic elements mounted on the module board, and at least one stress detection pattern in a position between the electronic elements or adjacent to one or more of the electronic elements on the module board and including a plurality of strips configured to indicate a stress level generated in the position by an external force applied to the module board.

Abstract: A memory module includes a module board extending in one direction, a plurality of electronic elements mounted on the module board, and at least one stress detection pattern in a position between the electronic elements or adjacent to one or more of the electronic elements on the module board and including a plurality of strips configured to indicate a stress level generated in the position by an external force applied to the module board.