Abstract: A first heat transport structure formed to penetrate a molding resin layer is connected to a first extending portion of a first heat transport layer and a first heat dissipation plate formed on the molding resin layer. A second heat transport structure formed to penetrate the molding resin layer is connected to a second extending portion of a second heat transport layer and a second heat dissipation plate formed on the molding resin layer.

Abstract: A semiconductor device includes a first wiring layer, a first semiconductor chip, a second wiring layer, and a second semiconductor chip. In addition, in the semiconductor device, a molding resin layer that molds the first semiconductor chip on the first wiring layer and a molding resin layer that molds the second semiconductor chip on the second wiring layer are formed, and the molding resin layers are integrally formed through a through-hole.

Abstract: A semiconductor device includes a wiring layer, and a first semiconductor chip and a second semiconductor chip disposed on the wiring layer. In addition, the semiconductor device includes a heat sink disposed on a back surface side of the first semiconductor chip and a back surface side of the second semiconductor chip. The heat sink includes a material having a thermal conductivity greater than thermal conductivities of the first semiconductor chip and the second semiconductor chip, and a reinforcing rib is formed on the heat sink.

Abstract: The purpose of the present invention is to provide: novel thiol compounds; a method for synthesizing said thiol compounds; curing agents containing said thiol compounds; resin compositions containing said thiol compounds and an epoxy compound; and resin compositions containing said thiol compounds and an ene compound having a carbon-carbon double bond in a molecule. Furthermore, the purpose of the present invention is to provide adhesives and sealants having these resin compositions as ingredients. The thiol compounds of the present invention are represented by chemical formula (I) to chemical formula (VII).

Abstract: An objective of the present invention is to provide: a novel thiol compound; a method for synthesizing the thiol compound; a curing agent containing the thiol compound; a resin composition containing the thiol compound and an epoxy compound; and a resin composition containing the thiol compound and an enic compound having an intramolecular carbon-carbon double bond. The thiol compound of the present invention, as exemplified by the compounds listed below, is a reaction product of a certain type of dialkene compound and a thiol compound, and has two or more intramolecular thioether bonds but no ester bonds.

Abstract: The present disclosure provides an electric wire including: a plurality of conductors that have been twisted together; and an insulation coating that covers an outer circumference of the plurality of conductors, wherein the plurality of conductors include: a plurality of outer conductors that are arranged along an outermost circumference; and at least one inner conductor that is provided on an inner side of the plurality of outer conductors, the at least one inner conductor includes one or more first strands, the one or more first strands are copper wires, each copper wire including a tin-plating layer, each of the plurality of outer conductors includes one or more second strands, and the one or more second strands are copper wires, each copper wire not including a plating layer.

Abstract: A semiconductor device includes a first heat sink formed in contact with a back surface of a first semiconductor chip, and a second heat sink formed in contact with a back surface of a second semiconductor chip. The first heat sink is made of a material with larger thermal conductivity than that of the first semiconductor chip and has a heat dissipation surface exposed from the mold resin layer to the outside. The second heat sink is made of a material with larger thermal conductivity than that of the second semiconductor chip and has a heat dissipation surface exposed from the mold resin layer to the outside.

Abstract: Provided is a graphite-based negative electrode active material that can impart both high output characteristics and high cycle characteristics to a nonaqueous electrolyte secondary battery. The graphite-based negative electrode active material disclosed herein is made up of particles having, in a cross-sectional view, a flat central portion made up of graphite, and a porous accumulation portion made up of accumulated graphite, on both sides of the flat central portion. The graphite that makes up the flat central portion is present more densely than the graphite that makes up the porous accumulation portion.

Abstract: A surfactant (a) having a critical micelle concentration (CMC) of 0.10 g/L or lower, represented by formula (1): R1—[—O-(A1O)n—H]m (1), wherein R1 is a C7-C20 hydrocarbon group having a valence number of m; m is an integer of 2 to 6; A1 in (A1O)n in each of [—O-(A1O)n—H]m is each independently a C2-C4 alkylene group; n in [—O-(A1O)n—H]m is each independently an integer of 1 to 100; and the sum of n in [—O-(A1O)n—H]m is 13 or greater.

Abstract: An objective of the present invention is to provide: a novel thiol compound; a method for synthesizing the thiol compound; a curing agent containing the thiol compound; a resin composition containing the thiol compound and an epoxy compound; and a resin composition containing the thiol compound and an enic compound having an intramolecular carbon-carbon double bond. The thiol compound of the present invention, as exemplified by the compounds listed below, is a reaction product of a certain type of dialkene compound and a thiol compound, and has two or more intramolecular thioether bonds but no ester bonds.

Abstract: This connector is provided with: an apparatus-side connector (70) attached to an apparatus having a case (90); and a wire-side connector (20) to which a protective pipe (11) that protects a wire (10) is attached. A through hole (27) is formed inside the wire-side connector (20). A through hole (78) is formed inside the apparatus-side connector (70). When the wire-side connector (20) and the apparatus-side connector (70) are normally fitted, an air passage (60) communicating the inner space (S2) of the case (90) of the apparatus and the inner space (S1) of the protective pipe (11) through the through hole (27) and the through hole (78) is formed inside the wire-side connector (20) and the apparatus-side connector (70).

Abstract: The purpose of the present invention is to provide: a novel curable compound which can be expected to be used as a raw material for photocurable resins and thermosetting resins; a method for synthesizing said compound; a resin composition containing said compound; and a cured product thereof. This compound is an epoxy-oxetane compound represented by a formula, and this compound has a structure in which two epoxycyclohexyl groups (groups in which an oxirane ring and a cyclohexane ring are condensed) are bonded to an oxetane ring via a connector having one ether bond. In formula (I?), R1 to R3 may be the same as, or different from, each other, and each denote a hydrogen atom or a methyl group. n is 1 or 2.

Abstract: A surfactant (a) having a critical micelle concentration (CMC) of 0.10 g/L or lower, represented by formula (1): R1—[—O-(A1O)n—H]m (1), wherein R1 is a C7-C20 hydrocarbon group having a valence number of m; m is an integer of 2 to 6; A1 in (A1O)n in each of [—O-(A1O)n—H]m is each independently a C2-C4 alkylene group; n in [—O-(A1O)n—H]m is each independently an integer of 1 to 100; and the sum of n in [—O-(A1O)n—H]m is 13 or greater.

Abstract: The purpose of the present invention is to provide: novel thiol compounds; a method for synthesizing said thiol compounds; curing agents containing said thiol compounds; resin compositions containing said thiol compounds and an epoxy compound; and resin compositions containing said thiol compounds and an ene compound having a carbon-carbon double bond in a molecule. Furthermore, the purpose of the present invention is to provide adhesives and sealants having these resin compositions as ingredients. The thiol compounds of the present invention are represented by chemical formula (I) to chemical formula (VII).

Abstract: This connector is provided with: an apparatus-side connector (70) attached to an apparatus having a case (90); and a wire-side connector (20) to which a protective pipe (11) that protects a wire (10) is attached. A through hole (27) is formed inside the wire-side connector (20). A through hole (78) is formed inside the apparatus-side connector (70). When the wire-side connector (20) and the apparatus-side connector (70) are normally fitted, an air passage (60) communicating the inner space (S2) of the case (90) of the apparatus and the inner space (S1) of the protective pipe (11) through the through hole (27) and the through hole (78) is formed inside the wire-side connector (20) and the apparatus-side connector (70).

Abstract: The purpose of the present invention is to provide: a novel curable compound which can be expected to be used as a raw material for photocurable resins and thermosetting resins; a method for synthesizing said compound; a resin composition containing said compound; and a cured product thereof. This compound is an epoxy-oxetane compound represented by a formula, and this compound has a structure in which two epoxycyclohexyl groups (groups in which an oxirane ring and a cyclohexane ring are condensed) are bonded to an oxetane ring via a connector having one ether bond. In formula (I?), R1 to R3 may be the same as, or different from, each other, and each denote a hydrogen atom or a methyl group. n is 1 or 2.

Abstract: A wire harness that comprises a connecting portion in which a first conductor exposed at a terminal portion of the first wire by stripping an insulating coating therefrom is connected to a second conductor exposed at a terminal portion of a second wire by stripping an insulating coating therefrom, the second wire having a higher flexibility than the first wire. The wire harness also comprises two layers of shrinkable tubes fitted around the outer circumference of the connecting portion. According to this structure, even if one of the shrinkable tubes is torn, the other shrinkable tube can provide protection to the connecting portion, thus improving the durability of the connecting portion.

Abstract: A structure for connecting electric wires in which a single-core conductor made of a single metal rod is connected to a flexible conductor made of a plurality of elemental metal wires and having a higher flexibility than the single-core conductor. A clamping portion formed at one end of the single-core conductor is connected to the flexible conductor with the clamping portion clamping the flexible conductor on two sides thereof in a direction transverse to the direction in which the electric wires extend.

Abstract: To provide a urinal apparatus, including: a water supplying device configured to supply water to a bowl section of a urinal; a trap section provided in a lower part of the bowl section and configured so that urine and water flow into the trap section; and a water sprinkling device configured to sprinkle water droplets to a region inside the bowl section, the region being located between the trap section and position of a nose of a user facing the bowl section, wherein the timing of sprinkling the water droplets by the water sprinkling device being different from timing of supplying water by the water supplying device.

Abstract: A wire harness that comprises a connecting portion in which a first conductor exposed at a terminal portion of the first wire by stripping an insulating coating therefrom is connected to a second conductor exposed at a terminal portion of a second wire by stripping an insulating coating therefrom, the second wire having a higher flexibility than the first wire. The wire harness also comprises two layers of shrinkable tubes fitted around the outer circumference of the connecting portion. According to this structure, even if one of the shrinkable tubes is torn, the other shrinkable tube can provide protection to the connecting portion, thus improving the durability of the connecting portion.