Abstract: Provided is a substance capable of effectively suppressing cancer metastasis or a pharmaceutical composition that effectively acts on an inflammatory disease. The pharmaceutical composition is a pharmaceutical composition containing, as an active ingredient, an antibody or an antibody fragment thereof having antigen-binding activity for an S100A8/A9 heterodimer, and blocks interaction between S100A8/A9 and a group of receptors therefor, to thereby strongly suppress cancer metastasis both in vitro and in vivo, or alleviate inflammation. That is, the anti-S100A8/A9 antibody or the antibody fragment thereof can strongly suppress cancer metastasis or alleviate inflammation, by virtue of its blocking action on the interaction between S100A8/A9 and the group of receptors therefor.

Abstract: A recording apparatus includes a conveyance unit that conveys a recording medium in a first direction toward a recording head for ejecting a liquid, a tank including a containing chamber containing the liquid to be supplied to the recording head, and an injection port through which the liquid is injected into the containing chamber, the tank being disposed downstream of the conveyance unit in the first direction, a rotatable lever that holds a tank cap for closing the injection port, and a cover that rotates about a rotation shaft between an open position for exposing the lever and a closed position for covering the lever, the rotation shaft being disposed upstream of the conveyance unit in the first direction. The cover includes a sliding portion that is provided on a surface facing the lever and comes into contact with the lever while the cover is rotating toward the closed position.

Abstract: A technique capable of certainly suppressing adhesion of waste ink to hands, clothes, and the like during replacement of a waste ink tank is provided. There are included a container portion provided with an insertion port which a discharge member discharging waste ink can be inserted into and pulled out from and a shielding portion movable between a shielding position where the insertion port is shielded and an open position where the insertion port is opened.

Abstract: A recording apparatus includes a tank including a chamber configured to store liquid to be supplied to a recording head that ejects the liquid and a filling port from which the liquid is injected into the chamber, and an injection auxiliary member configured to assist injecting of the liquid into the chamber from the filling port, the injection auxiliary member including a first and a second flow channels each defined by a first or a second upper end portion that opens toward outside of the tank and a first or a second lower end portion that opens toward inside of the tank, wherein the second flow channel has an expansion portion arranged in a middle portion between the second upper end portion and the second lower end portion and configured to form a step to expand a cross-sectional area.

Abstract: A semiconductor device includes a wiring layer, and a first semiconductor chip and a second semiconductor chip disposed on the wiring layer. In addition, the semiconductor device includes a heat sink disposed on a back surface side of the first semiconductor chip and a back surface side of the second semiconductor chip. The heat sink includes a material having a thermal conductivity greater than thermal conductivities of the first semiconductor chip and the second semiconductor chip, and a reinforcing rib is formed on the heat sink.

Abstract: The purpose of the present invention is to provide: novel thiol compounds; a method for synthesizing said thiol compounds; curing agents containing said thiol compounds; resin compositions containing said thiol compounds and an epoxy compound; and resin compositions containing said thiol compounds and an ene compound having a carbon-carbon double bond in a molecule. Furthermore, the purpose of the present invention is to provide adhesives and sealants having these resin compositions as ingredients. The thiol compounds of the present invention are represented by chemical formula (I) to chemical formula (VII).

Abstract: An objective of the present invention is to provide: a novel thiol compound; a method for synthesizing the thiol compound; a curing agent containing the thiol compound; a resin composition containing the thiol compound and an epoxy compound; and a resin composition containing the thiol compound and an enic compound having an intramolecular carbon-carbon double bond. The thiol compound of the present invention, as exemplified by the compounds listed below, is a reaction product of a certain type of dialkene compound and a thiol compound, and has two or more intramolecular thioether bonds but no ester bonds.

Abstract: The present disclosure provides an electric wire including: a plurality of conductors that have been twisted together; and an insulation coating that covers an outer circumference of the plurality of conductors, wherein the plurality of conductors include: a plurality of outer conductors that are arranged along an outermost circumference; and at least one inner conductor that is provided on an inner side of the plurality of outer conductors, the at least one inner conductor includes one or more first strands, the one or more first strands are copper wires, each copper wire including a tin-plating layer, each of the plurality of outer conductors includes one or more second strands, and the one or more second strands are copper wires, each copper wire not including a plating layer.

Abstract: A semiconductor device includes a first heat sink formed in contact with a back surface of a first semiconductor chip, and a second heat sink formed in contact with a back surface of a second semiconductor chip. The first heat sink is made of a material with larger thermal conductivity than that of the first semiconductor chip and has a heat dissipation surface exposed from the mold resin layer to the outside. The second heat sink is made of a material with larger thermal conductivity than that of the second semiconductor chip and has a heat dissipation surface exposed from the mold resin layer to the outside.

Abstract: Provided is a graphite-based negative electrode active material that can impart both high output characteristics and high cycle characteristics to a nonaqueous electrolyte secondary battery. The graphite-based negative electrode active material disclosed herein is made up of particles having, in a cross-sectional view, a flat central portion made up of graphite, and a porous accumulation portion made up of accumulated graphite, on both sides of the flat central portion. The graphite that makes up the flat central portion is present more densely than the graphite that makes up the porous accumulation portion.

Abstract: A surfactant (a) having a critical micelle concentration (CMC) of 0.10 g/L or lower, represented by formula (1): R1—[—O-(A1O)n—H]m (1), wherein R1 is a C7-C20 hydrocarbon group having a valence number of m; m is an integer of 2 to 6; A1 in (A1O)n in each of [—O-(A1O)n—H]m is each independently a C2-C4 alkylene group; n in [—O-(A1O)n—H]m is each independently an integer of 1 to 100; and the sum of n in [—O-(A1O)n—H]m is 13 or greater.

Abstract: An objective of the present invention is to provide: a novel thiol compound; a method for synthesizing the thiol compound; a curing agent containing the thiol compound; a resin composition containing the thiol compound and an epoxy compound; and a resin composition containing the thiol compound and an enic compound having an intramolecular carbon-carbon double bond. The thiol compound of the present invention, as exemplified by the compounds listed below, is a reaction product of a certain type of dialkene compound and a thiol compound, and has two or more intramolecular thioether bonds but no ester bonds.

Abstract: This connector is provided with: an apparatus-side connector (70) attached to an apparatus having a case (90); and a wire-side connector (20) to which a protective pipe (11) that protects a wire (10) is attached. A through hole (27) is formed inside the wire-side connector (20). A through hole (78) is formed inside the apparatus-side connector (70). When the wire-side connector (20) and the apparatus-side connector (70) are normally fitted, an air passage (60) communicating the inner space (S2) of the case (90) of the apparatus and the inner space (S1) of the protective pipe (11) through the through hole (27) and the through hole (78) is formed inside the wire-side connector (20) and the apparatus-side connector (70).

Abstract: The purpose of the present invention is to provide: a novel curable compound which can be expected to be used as a raw material for photocurable resins and thermosetting resins; a method for synthesizing said compound; a resin composition containing said compound; and a cured product thereof. This compound is an epoxy-oxetane compound represented by a formula, and this compound has a structure in which two epoxycyclohexyl groups (groups in which an oxirane ring and a cyclohexane ring are condensed) are bonded to an oxetane ring via a connector having one ether bond. In formula (I?), R1 to R3 may be the same as, or different from, each other, and each denote a hydrogen atom or a methyl group. n is 1 or 2.

Abstract: A surfactant (a) having a critical micelle concentration (CMC) of 0.10 g/L or lower, represented by formula (1): R1—[—O-(A1O)n—H]m (1), wherein R1 is a C7-C20 hydrocarbon group having a valence number of m; m is an integer of 2 to 6; A1 in (A1O)n in each of [—O-(A1O)n—H]m is each independently a C2-C4 alkylene group; n in [—O-(A1O)n—H]m is each independently an integer of 1 to 100; and the sum of n in [—O-(A1O)n—H]m is 13 or greater.

Abstract: The purpose of the present invention is to provide: novel thiol compounds; a method for synthesizing said thiol compounds; curing agents containing said thiol compounds; resin compositions containing said thiol compounds and an epoxy compound; and resin compositions containing said thiol compounds and an ene compound having a carbon-carbon double bond in a molecule. Furthermore, the purpose of the present invention is to provide adhesives and sealants having these resin compositions as ingredients. The thiol compounds of the present invention are represented by chemical formula (I) to chemical formula (VII).

Abstract: This connector is provided with: an apparatus-side connector (70) attached to an apparatus having a case (90); and a wire-side connector (20) to which a protective pipe (11) that protects a wire (10) is attached. A through hole (27) is formed inside the wire-side connector (20). A through hole (78) is formed inside the apparatus-side connector (70). When the wire-side connector (20) and the apparatus-side connector (70) are normally fitted, an air passage (60) communicating the inner space (S2) of the case (90) of the apparatus and the inner space (S1) of the protective pipe (11) through the through hole (27) and the through hole (78) is formed inside the wire-side connector (20) and the apparatus-side connector (70).

Abstract: The purpose of the present invention is to provide: a novel curable compound which can be expected to be used as a raw material for photocurable resins and thermosetting resins; a method for synthesizing said compound; a resin composition containing said compound; and a cured product thereof. This compound is an epoxy-oxetane compound represented by a formula, and this compound has a structure in which two epoxycyclohexyl groups (groups in which an oxirane ring and a cyclohexane ring are condensed) are bonded to an oxetane ring via a connector having one ether bond. In formula (I?), R1 to R3 may be the same as, or different from, each other, and each denote a hydrogen atom or a methyl group. n is 1 or 2.

Abstract: A wire harness that comprises a connecting portion in which a first conductor exposed at a terminal portion of the first wire by stripping an insulating coating therefrom is connected to a second conductor exposed at a terminal portion of a second wire by stripping an insulating coating therefrom, the second wire having a higher flexibility than the first wire. The wire harness also comprises two layers of shrinkable tubes fitted around the outer circumference of the connecting portion. According to this structure, even if one of the shrinkable tubes is torn, the other shrinkable tube can provide protection to the connecting portion, thus improving the durability of the connecting portion.

Abstract: A structure for connecting electric wires in which a single-core conductor made of a single metal rod is connected to a flexible conductor made of a plurality of elemental metal wires and having a higher flexibility than the single-core conductor. A clamping portion formed at one end of the single-core conductor is connected to the flexible conductor with the clamping portion clamping the flexible conductor on two sides thereof in a direction transverse to the direction in which the electric wires extend.