Abstract: A first heat transport structure formed to penetrate a molding resin layer is connected to a first extending portion of a first heat transport layer and a first heat dissipation plate formed on the molding resin layer. A second heat transport structure formed to penetrate the molding resin layer is connected to a second extending portion of a second heat transport layer and a second heat dissipation plate formed on the molding resin layer.

Abstract: A vehicle door apparatus includes first and second link arms each having a first pivot coupling point with respect to a vehicle body and a second pivot coupling point with respect to a door of a vehicle. The vehicle door apparatus includes a coupling length variable mechanism provided on at least one of the first and second link arms and configured such that a coupling length serving as a distance between the first and second pivot coupling points is variable. The coupling length variable mechanism is configured to change an opening and closing motion track of the door.

Abstract: A work vehicle includes: a power transmission shaft drivable to rotate; a shaft holder holding the power transmission shaft in such a manner that the power transmission shaft is rotatable; and a hydraulically operable section configured to operate in response to receiving operating oil, the power transmission shaft including: a shaft groove extending entirely around an outer circumferential portion of the power transmission shaft; an inlet port extending inside the power transmission shaft in a radial direction of the power transmission shaft and connected with the shaft groove; and a supply oil passage extending inside the power transmission shaft in a longitudinal direction of the power transmission shaft and connected with the inlet port inside the power transmission shaft.

Abstract: A semiconductor device includes a first wiring layer, a first semiconductor chip, a second wiring layer, and a second semiconductor chip. In addition, in the semiconductor device, a molding resin layer that molds the first semiconductor chip on the first wiring layer and a molding resin layer that molds the second semiconductor chip on the second wiring layer are formed, and the molding resin layers are integrally formed through a through-hole.

Abstract: A liquid discharge apparatus includes a discharging unit configured to be capable of discharging a plurality of kinds of liquids onto a medium, and a waste liquid tank including a storage part configured to store a waste liquid of the liquid. The waste liquid tank includes a first inflow port and a second inflow port from which the waste liquid flows into the storage part, and a restriction portion located between the first inflow port and the second inflow port, and configured to restrict movement of the waste liquid in the storage part.

Abstract: A semiconductor device includes a wiring layer, and a first semiconductor chip and a second semiconductor chip disposed on the wiring layer. In addition, the semiconductor device includes a heat sink disposed on a back surface side of the first semiconductor chip and a back surface side of the second semiconductor chip. The heat sink includes a material having a thermal conductivity greater than thermal conductivities of the first semiconductor chip and the second semiconductor chip, and a reinforcing rib is formed on the heat sink.

Abstract: The purpose of the present invention is to provide: novel thiol compounds; a method for synthesizing said thiol compounds; curing agents containing said thiol compounds; resin compositions containing said thiol compounds and an epoxy compound; and resin compositions containing said thiol compounds and an ene compound having a carbon-carbon double bond in a molecule. Furthermore, the purpose of the present invention is to provide adhesives and sealants having these resin compositions as ingredients. The thiol compounds of the present invention are represented by chemical formula (I) to chemical formula (VII).

Abstract: An objective of the present invention is to provide: a novel thiol compound; a method for synthesizing the thiol compound; a curing agent containing the thiol compound; a resin composition containing the thiol compound and an epoxy compound; and a resin composition containing the thiol compound and an enic compound having an intramolecular carbon-carbon double bond. The thiol compound of the present invention, as exemplified by the compounds listed below, is a reaction product of a certain type of dialkene compound and a thiol compound, and has two or more intramolecular thioether bonds but no ester bonds.

Abstract: The present disclosure provides an electric wire including: a plurality of conductors that have been twisted together; and an insulation coating that covers an outer circumference of the plurality of conductors, wherein the plurality of conductors include: a plurality of outer conductors that are arranged along an outermost circumference; and at least one inner conductor that is provided on an inner side of the plurality of outer conductors, the at least one inner conductor includes one or more first strands, the one or more first strands are copper wires, each copper wire including a tin-plating layer, each of the plurality of outer conductors includes one or more second strands, and the one or more second strands are copper wires, each copper wire not including a plating layer.

Abstract: A semiconductor device includes a first heat sink formed in contact with a back surface of a first semiconductor chip, and a second heat sink formed in contact with a back surface of a second semiconductor chip. The first heat sink is made of a material with larger thermal conductivity than that of the first semiconductor chip and has a heat dissipation surface exposed from the mold resin layer to the outside. The second heat sink is made of a material with larger thermal conductivity than that of the second semiconductor chip and has a heat dissipation surface exposed from the mold resin layer to the outside.

Abstract: Provided is a graphite-based negative electrode active material that can impart both high output characteristics and high cycle characteristics to a nonaqueous electrolyte secondary battery. The graphite-based negative electrode active material disclosed herein is made up of particles having, in a cross-sectional view, a flat central portion made up of graphite, and a porous accumulation portion made up of accumulated graphite, on both sides of the flat central portion. The graphite that makes up the flat central portion is present more densely than the graphite that makes up the porous accumulation portion.

Abstract: A surfactant (a) having a critical micelle concentration (CMC) of 0.10 g/L or lower, represented by formula (1): R1—[—O-(A1O)n—H]m (1), wherein R1 is a C7-C20 hydrocarbon group having a valence number of m; m is an integer of 2 to 6; A1 in (A1O)n in each of [—O-(A1O)n—H]m is each independently a C2-C4 alkylene group; n in [—O-(A1O)n—H]m is each independently an integer of 1 to 100; and the sum of n in [—O-(A1O)n—H]m is 13 or greater.

Abstract: An objective of the present invention is to provide: a novel thiol compound; a method for synthesizing the thiol compound; a curing agent containing the thiol compound; a resin composition containing the thiol compound and an epoxy compound; and a resin composition containing the thiol compound and an enic compound having an intramolecular carbon-carbon double bond. The thiol compound of the present invention, as exemplified by the compounds listed below, is a reaction product of a certain type of dialkene compound and a thiol compound, and has two or more intramolecular thioether bonds but no ester bonds.

Abstract: This connector is provided with: an apparatus-side connector (70) attached to an apparatus having a case (90); and a wire-side connector (20) to which a protective pipe (11) that protects a wire (10) is attached. A through hole (27) is formed inside the wire-side connector (20). A through hole (78) is formed inside the apparatus-side connector (70). When the wire-side connector (20) and the apparatus-side connector (70) are normally fitted, an air passage (60) communicating the inner space (S2) of the case (90) of the apparatus and the inner space (S1) of the protective pipe (11) through the through hole (27) and the through hole (78) is formed inside the wire-side connector (20) and the apparatus-side connector (70).

Abstract: The purpose of the present invention is to provide: a novel curable compound which can be expected to be used as a raw material for photocurable resins and thermosetting resins; a method for synthesizing said compound; a resin composition containing said compound; and a cured product thereof. This compound is an epoxy-oxetane compound represented by a formula, and this compound has a structure in which two epoxycyclohexyl groups (groups in which an oxirane ring and a cyclohexane ring are condensed) are bonded to an oxetane ring via a connector having one ether bond. In formula (I?), R1 to R3 may be the same as, or different from, each other, and each denote a hydrogen atom or a methyl group. n is 1 or 2.

Abstract: A surfactant (a) having a critical micelle concentration (CMC) of 0.10 g/L or lower, represented by formula (1): R1—[—O-(A1O)n—H]m (1), wherein R1 is a C7-C20 hydrocarbon group having a valence number of m; m is an integer of 2 to 6; A1 in (A1O)n in each of [—O-(A1O)n—H]m is each independently a C2-C4 alkylene group; n in [—O-(A1O)n—H]m is each independently an integer of 1 to 100; and the sum of n in [—O-(A1O)n—H]m is 13 or greater.

Abstract: The purpose of the present invention is to provide: novel thiol compounds; a method for synthesizing said thiol compounds; curing agents containing said thiol compounds; resin compositions containing said thiol compounds and an epoxy compound; and resin compositions containing said thiol compounds and an ene compound having a carbon-carbon double bond in a molecule. Furthermore, the purpose of the present invention is to provide adhesives and sealants having these resin compositions as ingredients. The thiol compounds of the present invention are represented by chemical formula (I) to chemical formula (VII).

Abstract: This connector is provided with: an apparatus-side connector (70) attached to an apparatus having a case (90); and a wire-side connector (20) to which a protective pipe (11) that protects a wire (10) is attached. A through hole (27) is formed inside the wire-side connector (20). A through hole (78) is formed inside the apparatus-side connector (70). When the wire-side connector (20) and the apparatus-side connector (70) are normally fitted, an air passage (60) communicating the inner space (S2) of the case (90) of the apparatus and the inner space (S1) of the protective pipe (11) through the through hole (27) and the through hole (78) is formed inside the wire-side connector (20) and the apparatus-side connector (70).

Abstract: The purpose of the present invention is to provide: a novel curable compound which can be expected to be used as a raw material for photocurable resins and thermosetting resins; a method for synthesizing said compound; a resin composition containing said compound; and a cured product thereof. This compound is an epoxy-oxetane compound represented by a formula, and this compound has a structure in which two epoxycyclohexyl groups (groups in which an oxirane ring and a cyclohexane ring are condensed) are bonded to an oxetane ring via a connector having one ether bond. In formula (I?), R1 to R3 may be the same as, or different from, each other, and each denote a hydrogen atom or a methyl group. n is 1 or 2.