Patents by Inventor Yusuke EBIHARA

Yusuke EBIHARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BONDED BODY, SUBSTRATE, METHOD FOR PRODUCING BONDED BODY, AND METHOD FOR PRODUCING SUBSTRATE
    Publication number: 20240092061
    Abstract: A joined article including: a resin (1) having a linear expansion coefficient at 30° C. to 200° C. of 17 ppm/° C. or higher and a thickness of 5 to 100 ?m; and a metal joined to a surface of the resin (1) and having a thickness of 5 to 50 ?m. The resin (1) includes a heat-affected layer that is close to the metal and that occupies 80% or less of the thickness of the resin (1), and the joined article is a dielectric material for a substrate. Also disclosed is a substrate including the joined article and a resin (2) stacked on the joined article.
    Type: Application
    Filed: October 27, 2023
    Publication date: March 21, 2024
    Applicants: THE UNIVERSITY OF TOKYO, DAIKIN INDUSTRIES, LTD.
    Inventors: Keisuke NAGATO, Kota AONO, Yusuke EBIHARA, Masayuki NAKAO, Yuki UEDA, Shingo OKUNO, Hirokazu KOMORI, Akiyoshi YAMAUCHI, Yosuke KISHIKAWA