Abstract: A transparent resin composition is provided which contains at least (A) a siloxane resin, (B) an organic solvent, and two or more kinds of (C) surfactants, wherein the surfactants include (C1) a silicone-modified acrylic surfactant and (C2) a thermally decomposable fluorine-containing surfactant, and the total content of the surfactants (C1) and (C2) is 50-500 ppm with respect to the transparent resin composition. Further provided is a transparent resin composition from which a transparent coating film, that suppresses pin hole or unevenness and has a good appearance and an excellent adhesion property to an inorganic film or an organic film, can be formed even when coated by spray coating or inkjet coating.

Abstract: A negative photosensitive resin composition is provided which contains (A) a siloxane resin having a radically polymerizable group and a carboxyl group and/or a dicarboxylic acid anhydride group, (B) a reactive monomer, (C) a radical photopolymerization initiator, (D) silica particles and (E) a siloxane compound having an oxetanyl group. The present invention provides a negative photosensitive resin composition which is capable of forming a cured film that has high glass surface strength, while exhibiting excellent adhesion to an inorganic film or to an organic film.

Abstract: A transparent resin composition is provided which contains at least (A) a siloxane resin, (B) an organic solvent, and two or more kinds of (C) surfactants, wherein the surfactants include (C1) a silicone-modified acrylic surfactant and (C2) a thermally decomposable fluorine-containing surfactant, and the total content of the surfactants (C1) and (C2) is 50-500 ppm with respect to the transparent resin composition. Further provided is a transparent resin composition from which a transparent coating film, that suppresses pin hole or unevenness and has a good appearance and an excellent adhesion property to an inorganic film or an organic film, can be formed even when coated by spray coating or inkjet coating.

Abstract: The present invention provides a photosensitive resin composition comprising an unsaturated group-containing resin (D), a (meth)acrylic compound (E) having a specific structure, a silane compound (G) having a substituent selected from the group consisting of an amino group, an amide group, a ureido group, a ketimine group, and an isocyanate group, and a photo-polymerization initiator (F), the unsaturated group-containing resin (D) being obtained by adding an epoxy group-containing unsaturated compound (C) to some acid radicals of a copolymer obtained by copolymerizing a (meth)acrylic ester (A) with an unsaturated group- and acid-containing compound (B).

Abstract: The present invention provides a photosensitive resin composition comprising an unsaturated group-containing resin (D), a (meth)acrylic compound (E) having a specific structure, a silane compound (G) having a substituent selected from the group consisting of an amino group, an amide group, a ureido group, a ketimine group, and an isocyanate group, and a photo-polymerization initiator (F), the unsaturated group-containing resin (D) being obtained by adding an epoxy group-containing unsaturated compound (C) to some acid radicals of a copolymer obtained by copolymerizing a (meth)acrylic ester (A) with an unsaturated group- and acid-containing compound (B).