Abstract: Provided are: a shield film having excellent shield characteristics in the high frequency region of the shield film; and a shield printed wiring board. A shield film (1) is provided on a flexible printed wiring board (8), which has a base film (5) having a signal circuit (6a) formed thereon, and an insulating film (7) that is provided on the whole upper surface of the base film (5) such that the insulating film covers the signal circuit (6a). The shield film 1 has an electroconductive adhesive layer 15 provided throughout a surface of the insulating film 7, and a metal layer 11 provided throughout a surface of the electroconductive adhesive layer 15.

Abstract: A method of manufacturing a shield printed wiring board, a shield film, and a shield printed wiring board, which make it possible to achieve cost reduction, are provided. A method of manufacturing a shield printed wiring board 10 includes the steps of: forming a shield film 1 which includes an insulating layer 7 formed of resin in which polymerization has proceeded so that a resin cure degree is 90% or higher, a metal layer 8a stacked onto the insulating layer 7, and an adhesive layer 8b stacked onto the metal layer 8a; mounting the shield film 1 on a printed board 5; and thermally pressing the shield film 1 and the printed board 5 onto each other.

Abstract: A method of manufacturing a shield printed wiring board, a shield film, and a shield printed wiring board, which make it possible to achieve cost reduction, are provided. A method of manufacturing a shield printed wiring board includes the steps of: forming a shield film which includes an insulating layer formed of resin in which polymerization has proceeded so that a resin cure degree is 90% or higher, a metal layer stacked onto the insulating layer, and an adhesive layer stacked onto the metal layer; mounting the shield film on a printed board; and thermally pressing the shield film and the printed board onto each other.

Abstract: Provided are: a shield film having excellent shield characteristics in the high frequency region of the shield film; and a shield printed wiring board. A shield film (1) is provided on a flexible printed wiring board (8), which has a base film (5) having a signal circuit (6a) formed thereon, and an insulating film (7) that is provided on the whole upper surface of the base film (5) such that the insulating film covers the signal circuit (6a). The shield film 1 has an electroconductive adhesive layer 15 provided throughout a surface of the insulating film 7, and a metal layer 11 provided throughout a surface of the electroconductive adhesive layer 15.

Abstract: There is provided a method of manufacturing an outwardly flanged metal member, by which a metal member having outward flange portions which extend radially outwardly from a plurality of positions along a circumferential direction on an outer peripheral surface can be formed without a flash, or with a reduced amount of a flash. While surrounding a periphery of a metal blank 15 by a stationary die 21 and a movable die 22 and butting a distal face of the movable die 22 and a distal face of the stationary die 21, an axial end face of the blank 15 is plastically deformed by pressing the axial end face with the punch under a warm or hot condition to form the outward flange portions 7a by filling flange molding cavities 32 with a portion of the blank 15.

Abstract: There is provided a method of manufacturing an outwardly flanged metal member, by which a metal member having outward flange portions which extend radially outwardly from a plurality of positions along a circumferential direction on an outer peripheral surface can be formed without a flash, or with a reduced amount of a flash. While surrounding a periphery of a metal blank 15 by a stationary die 21 and a movable die 22 and butting a distal face of the movable die 22 and a distal face of the stationary die 21, an axial end face of the blank 15 is plastically deformed by pressing the axial end face with the punch under a warm or hot condition to form the outward flange portions 7a by filling flange molding cavities 32 with a portion of the blank 15.