Patents by Inventor Yusuke Ino

Yusuke Ino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11935801
    Abstract: An electronic component built-in wiring board includes a substrate having a cavity, an electronic component accommodated in the cavity of the substrate and having pads on a surface of the component, a coating insulating layer formed on the substrate such that the insulating layer is covering the component and has via holes, via conductors formed in the via holes such that the via conductors are penetrating through the insulating layer, and a resin coating formed between the component and the insulating layer and having through holes such that the through holes are partially exposing the pads in the via holes and that the coating has adhesion to the component that is stronger than adhesion of the insulating layer to the component. The via conductors are formed in the via holes and the through holes such that the via conductors are connected to the pads on the surface of the component.
    Type: Grant
    Filed: April 27, 2022
    Date of Patent: March 19, 2024
    Assignee: IBIDEN CO., LTD.
    Inventors: Yusuke Tanaka, Tomohiro Futatsugi, Yuichi Nakamura, Yoshiki Matsui, Keinosuke Ino, Tomohiro Fuwa, Seiji Izawa
  • Patent number: 11532544
    Abstract: A high frequency module includes a power amplifier and a substrate on which the power amplifier is mounted. The power amplifier includes a first external terminal and a second external terminal formed on a mounting surface. The substrate includes a first land electrode and a second land electrode formed on one principal surface. The first external terminal is connected to the first land electrode, and the second external terminal is connected to the second land electrode. A distance from the mounting surface to a connection surface of the first external terminal is shorter than a distance from the mounting surface to a connection surface of the second external terminal, and a distance from a connection surface of the first land electrode to the one principal surface is longer than a distance from a connection surface of the second land electrode to the one principal surface.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: December 20, 2022
    Inventor: Yusuke Ino
  • Publication number: 20200343172
    Abstract: A high frequency module includes a power amplifier and a substrate on which the power amplifier is mounted. The power amplifier includes a first external terminal and a second external terminal formed on a mounting surface. The substrate includes a first land electrode and a second land electrode formed on one principal surface. The first external terminal is connected to the first land electrode, and the second external terminal is connected to the second land electrode. A distance from the mounting surface to a connection surface of the first external terminal is shorter than a distance from the mounting surface to a connection surface of the second external terminal, and a distance from a connection surface of the first land electrode to the one principal surface is longer than a distance from a connection surface of the second land electrode to the one principal surface.
    Type: Application
    Filed: July 8, 2020
    Publication date: October 29, 2020
    Inventor: Yusuke INO
  • Patent number: 10338290
    Abstract: A cellulose ester film contains a compound having a structural unit denoted by —NR—(C?O)— in which R represents a hydrogen atom or a substituent, a surface having knoop hardness of greater than or equal to 210 N/mm2 is provided, and loss tangent tan ? at 25° C. is greater than or equal to 0.03.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: July 2, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Yasukazu Kuwayama, Hiroshi Inada, Aiko Yoshida, Yoshitaka Maeda, Yusuke Ino, Shuuji Kanayama, Nobutaka Fukagawa
  • Patent number: 10292271
    Abstract: A high-frequency module according to the present disclosure includes: an MMIC; a multilayer substrate on which the MMIC is mounted; a signal wire that is arranged above the multilayer substrate, is connected to the MMIC and is a transmission path that transmits a high-frequency signal outputted from the MMIC; and a ground wire having at least one end that is connected to a ground electrode on an upper surface of the multilayer substrate and that is arranged so as to straddle the signal wire.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: May 14, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Yusuke Ino
  • Publication number: 20170118841
    Abstract: A high-frequency module according to the present disclosure includes: an MMIC; a multilayer substrate on which the MMIC is mounted; a signal wire that is arranged above the multilayer substrate, is connected to the MMIC and is a transmission path that transmits a high-frequency signal outputted from the MMIC; and a ground wire having at least one end that is connected to a ground electrode on an upper surface of the multilayer substrate and that is arranged so as to straddle the signal wire.
    Type: Application
    Filed: October 25, 2016
    Publication date: April 27, 2017
    Inventor: Yusuke INO
  • Publication number: 20160370522
    Abstract: A cellulose ester film contains a compound having a structural unit denoted by —NR—(C?O)— in which R represents a hydrogen atom or a substituent, a surface having knoop hardness of greater than or equal to 210 N/mm2 is provided, and loss tangent tan ? at 25° C. is greater than or equal to 0.03.
    Type: Application
    Filed: August 31, 2016
    Publication date: December 22, 2016
    Applicant: FUJIFILM Corporation
    Inventors: Yasukazu KUWAYAMA, Hiroshi INADA, Aiko YOSHIDA, Yoshitaka MAEDA, Yusuke INO, Shuuji KANAYAMA, Nobutaka FUKAGAWA
  • Publication number: 20100020273
    Abstract: A polymer film stretched after formed by solution casting, of which the wavelength dispersion of the refractivity anisotropy and/or the refractivity anisotropy differ between two surfaces of the film is disclosed.
    Type: Application
    Filed: July 23, 2009
    Publication date: January 28, 2010
    Applicant: FUJIFILM Corporation
    Inventors: Hirofumi Toyama, Kotaro Yasuda, Yusuke Ino, Yujiro Yanai, Yasuyuki Sasada, Jun Takeda