Patents by Inventor Yusuke Kaieda

Yusuke Kaieda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate
    Patent number: 8697534
    Abstract: A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: April 15, 2014
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Motohiko Sato, Kazuhiro Hayashi, Kenji Murakami, Motonobu Kurahashi, Yusuke Kaieda, Jun Otsuka, Manabu Sato
  • Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate
    Patent number: 8350306
    Abstract: A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.
    Type: Grant
    Filed: November 22, 2010
    Date of Patent: January 8, 2013
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Motohiko Sato, Kazuhiro Hayashi, Kenji Murakami, Motonobu Kurahashi, Yusuke Kaieda, Jun Otsuka, Manabu Sato
  • CAPACITOR TO BE INCORPORATED IN WIRING SUBSTRATE, METHOD FOR MANUFACTURING THE CAPACITOR, AND WIRING SUBSTRATE
    Publication number: 20130000820
    Abstract: A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.
    Type: Application
    Filed: September 12, 2012
    Publication date: January 3, 2013
    Applicant: NGK SPARK PLUG CO., LTD.,
    Inventors: Motohiko SATO, Kazuhiro HAYASHI, Kenji MURAKAMI, Motonobu KURAHASHI, Yusuke KAIEDA, Jun OTSUKA, Manabu SATO
  • Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate
    Patent number: 8304321
    Abstract: A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.
    Type: Grant
    Filed: November 22, 2010
    Date of Patent: November 6, 2012
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Motohiko Sato, Kazuhiro Hayashi, Kenji Murakami, Motonobu Kurahashi, Yusuke Kaieda, Jun Otsuka, Manabu Sato
  • CAPACITOR TO BE INCORPORATED IN WIRING SUBSTRATE, METHOD FOR MANUFACTURING THE CAPACITOR, AND WIRING SUBSTRATE
    Publication number: 20110090615
    Abstract: A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.
    Type: Application
    Filed: November 22, 2010
    Publication date: April 21, 2011
    Applicant: NGK SPARK PLUG CO., LTD.
    Inventors: Motohiko SATO, Kazuhiro Hayashi, Kenji Murakami, Motonobu Karahashi, Yusuke Kaieda, Jun Otsuka, Manabu Sato
  • CAPACITOR TO BE INCORPORATED IN WIRING SUBSTRATE, METHOD FOR MANUFACTURING THE CAPACITOR, AND WIRING SUBSTRATE
    Publication number: 20110083794
    Abstract: A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.
    Type: Application
    Filed: November 22, 2010
    Publication date: April 14, 2011
    Applicant: NGK SPARK PLUG CO., LTD.
    Inventors: Motohiko Sato, Kazuhiro Hayashi, Kenji Murakami, Motonobu Kurahashi, Yusuke Kaieda, Jun Otsuka, Manabu Sato
  • Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate
    Patent number: 7863662
    Abstract: A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.
    Type: Grant
    Filed: December 22, 2006
    Date of Patent: January 4, 2011
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Motohiko Sato, Kazuhiro Hayashi, Kenji Murakami, Motonobu Kurahashi, Yusuke Kaieda, Jun Otsuka, Manabu Sato
  • Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate
    Publication number: 20070145449
    Abstract: A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.
    Type: Application
    Filed: December 22, 2006
    Publication date: June 28, 2007
    Inventors: Motohiko Sato, Kazuhiro Hayashi, Kenji Murakami, Motonobu Kurahashi, Yusuke Kaieda, Jun Otsuka, Manabu Sato