Patents by Inventor Yusuke KAMITSUBO

Yusuke KAMITSUBO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210014962
    Abstract: A resin substrate includes a resin body, an interlayer connection conductor provided in the resin body, and a conductor pattern bonded to the interlayer connection conductor. The resin body includes a gap provided adjacent to or in a vicinity of a bonding portion of the interlayer connection conductor and the conductor pattern, and a contact portion that contacts the interlayer connection conductor.
    Type: Application
    Filed: September 30, 2020
    Publication date: January 14, 2021
    Inventor: Yusuke KAMITSUBO
  • Publication number: 20200396836
    Abstract: A resin multilayer board includes a substrate including a stack of resin layers, and a first metal pin including a first end portion exposed at a first main surface of the substrate and penetrating through at least one of the resin layers in a thickness direction, wherein a gap is provided at a portion of an interface between a lateral side of the first metal pin and the resin layer.
    Type: Application
    Filed: August 31, 2020
    Publication date: December 17, 2020
    Inventors: Atsushi KASUYA, Yusuke KAMITSUBO
  • Patent number: 10813218
    Abstract: A resin multilayer board includes a substrate including a stack of resin layers, and a first metal pin including a first end portion exposed at a first main surface of the substrate and penetrating through at least one of the resin layers in a thickness direction, wherein a gap is provided at a portion of an interface between a lateral side of the first metal pin and the resin layer.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: October 20, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Atsushi Kasuya, Yusuke Kamitsubo
  • Publication number: 20200178391
    Abstract: A resin multilayer board includes a substrate including a stack of resin layers, and a first metal pin including a first end portion exposed at a first main surface of the substrate and penetrating through at least one of the resin layers in a thickness direction, wherein a gap is provided at a portion of an interface between a lateral side of the first metal pin and the resin layer.
    Type: Application
    Filed: February 12, 2020
    Publication date: June 4, 2020
    Inventors: Atsushi KASUYA, Yusuke KAMITSUBO