Abstract: A hands-free device capable of supporting a first mobile phone and a second mobile phone so as to communicate with each of the two mobile phones via a short-range wireless link is configured in such a manner that when the hands-free device receives a link establishment request from the second mobile phone for a period after receiving a call start signal from the first mobile phone until a call through the first mobile phone ends, the hands-free device rejects the link establishment request from the second mobile phone regardless of a state of a link between the hands-free device and the first mobile phone.

Abstract: A thin-film magnetic head comprises a reproducing element formed on an undercoat film on a head substrate surface, a recording element formed on the upper side of the reproducing element, and a heater formed on the upper or lower side of the reproducing element, the heater generating heat upon energization so as to project at least the reproducing element by thermal expansion toward a recording medium. A shield layer is formed between the reproducing element and the heater by a plurality of layers including at least first and second shield layers. In the first and second shield layers, the second upper shield layer located closer to the heater is formed by a material having a coefficient of thermal expansion smaller than that of the first shield layer located closer to the reproducing element.

Abstract: A thin-film magnetic head comprises a reproducing element formed on an undercoat film on a head substrate surface, a recording element formed on the upper side of the reproducing element, and a heater formed on the upper or lower side of the reproducing element, the heater generating heat upon energization so as to project at least the reproducing element by thermal expansion toward a recording medium. A shield layer is formed between the reproducing element and the heater by a plurality of layers including at least first and second shield layers. In the first and second shield layers, the second upper shield layer located closer to the heater is formed by a material having a coefficient of thermal expansion smaller than that of the first shield layer located closer to the reproducing element.