Patents by Inventor Yusuke Kinoshita

Yusuke Kinoshita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10811525
    Abstract: A bidirectional switch includes a semiconductor element and a substrate potential stabilizer which stabilizes a substrate potential of a semiconductor element. The substrate potential stabilizer includes a first switch element and a second switch element. Both the first switch element and the second switch element are on when the semiconductor element is on.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: October 20, 2020
    Assignee: PANASONIC CORPORATION
    Inventors: Yusuke Kinoshita, Hidekazu Umeda
  • Patent number: 10807173
    Abstract: A second distance is longer than a first distance and a value obtained by dividing the third distance by the fourth distance is more than or equal to 0.5 and less than or equal to 0.8 when it is assumed that the first distance represents a distance between the cutting edge and the mounting surface in a direction perpendicular to the rake face, the second distance represents a distance between the mounting surface and a boundary portion between the rising portion and the flat portion in the direction perpendicular to the rake face, the third distance represents a distance between the boundary portion and a tip of the cutting edge in a direction parallel to the rake face, and the fourth distance represents a distance between the second discharging opening portion and the tip of the cutting edge in the direction parallel to the rake face.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: October 20, 2020
    Assignee: Sumitomo Electric Hardmetal Corp.
    Inventors: Keiji Kinoshita, Kouki Matsubara, Yusuke Koike
  • Publication number: 20200309107
    Abstract: A screw member that has passed through a holder insertion hole and a resistor insertion hole being screwed into an internal threaded hole fixes a holder and a resistor to a bottom wall of a motor housing member. Thus, the resistor is attached to the motor housing member using the screw member that attaches the holder to the motor housing member. This reduces the space in the inverter accommodation chamber.
    Type: Application
    Filed: March 25, 2020
    Publication date: October 1, 2020
    Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
    Inventors: Yusuke KINOSHITA, Keiji Yashiro, Kazuhiro Shiraishi
  • Publication number: 20200313504
    Abstract: Connectors are each integrated with a holder in a state in which bus bars are projected. A first projection and a second projection of the holder are respectively inserted in a first insertion hole and a second insertion hole in a circuit substrate. This determines positions of the holder and the circuit substrate relative to each other. The holder has coil lead wire insertion holes, capacitor lead wire insertion holes, and element lead wire insertion holes. These insertion holes extend in the same direction as the direction in which the bus bars project from the holder.
    Type: Application
    Filed: March 25, 2020
    Publication date: October 1, 2020
    Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
    Inventors: Takeshi OKOCHI, Yusuke KINOSHITA, Junya YANO, Shumpei YAMAKAGE
  • Publication number: 20200313495
    Abstract: An electric compressor includes a cylindrical motor housing, an inverter case, and a conductive member. The inverter case is joined to an end portion of the motor housing. The inverter case includes a cylindrical case peripheral wall surrounding the end portion. The end portion has an end face that extends in a radial direction of the motor housing and a peripheral surface that extends in an axial direction of the motor housing and is connected to the end face. A ring-shaped sealing member is disposed between the peripheral surface and the case peripheral wall. An accommodation groove for accommodating the sealing member is recessed in the peripheral surface. The sealing member is held by the peripheral surface and the case peripheral wall in a radial direction of the sealing member to seal a space in which the conductive member is disposed.
    Type: Application
    Filed: March 19, 2020
    Publication date: October 1, 2020
    Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
    Inventors: Shumpei YAMAKAGE, Yusuke KINOSHITA, Junya YANO
  • Publication number: 20200212757
    Abstract: An electric compressor includes a motor housing, an inverter, a cover, and a fastener. The inverter includes a board; an electronic component; a holder composed of an insulating material, the holder containing the electronic component and supporting the board; a bus bar integrated with the holder, and electrically connected to a circuit pattern and the motor housing; and a tubular member interposed between the cover and the bus bar, with the fastener inserted in the tubular member. The fastening force from the fastener causes the tubular member to press the bus bar toward the motor housing.
    Type: Application
    Filed: December 23, 2019
    Publication date: July 2, 2020
    Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
    Inventors: Yusuke KINOSHITA, Shingo ENAMI, Junya YANO
  • Patent number: 10677262
    Abstract: A motor-driven compressor includes collars, which maintain the gap between a cover and an outer surface of a first housing member. Fasteners fasten the cover to the first housing member. Each collar is arranged to face a seating surface of the head of the corresponding fastener such that the cover is sandwiched between the collars and the seating surfaces. Each collar thus includes a facing portion, which faces the seating surface and receives a pressing force from the seating surface via the cover, and a transmitting portion, which transmits the pressing force received at the facing portion to a base member. Accordingly, the pressing force applied through the seating surface of the fastener is transmitted to the base member through the collar, so that the base member is pressed against the outer surface of the first housing member.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: June 9, 2020
    Assignee: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
    Inventors: Yusuke Kinoshita, Shingo Enami, Junya Yano
  • Patent number: 10658901
    Abstract: A cover assembly for on-board electric equipment includes a cover body and a connector including a terminal and a connector housing. The cover body includes a ferrous base metal body, and a Zn-based plating layer formed on a surface of the base metal body. The cover body has a through hole formed through the base metal body and the plating layer. The terminal is passed through the through hole and electrically connected to an electric circuit. The connector housing is formed on the cover body so as to surround the terminal. A laser mark is formed on the cover body. The laser mark has a circular shape about the through hole and penetrates the plating layer to the base metal body. The connector housing extends to the base metal body through the plating layer within the laser mark.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: May 19, 2020
    Assignee: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
    Inventors: Yusuke Kinoshita, Junya Yano, Shingo Enami
  • Publication number: 20200132460
    Abstract: A sensor unit with high reliability and stable detection accuracy against vibrations of an installation target object is to be provided. A sensor unit includes: a sensor module configured including a substrate with inertial sensors mounted thereon, and an inner case in which the substrate is installed; and an outer case accommodating the sensor module. A recessed part is formed in the inner case. The inertial sensors are arranged in an area overlapping with the recessed part as viewed in a plan view seen from the direction of thickness of the substrate, and a filling member is provided to fill a space formed by the substrate and the recessed part. The sensor module is joined to a bottom wall of the outer case via a joining member.
    Type: Application
    Filed: December 30, 2019
    Publication date: April 30, 2020
    Inventors: Yusuke KINOSHITA, Masayasu SAKUMA
  • Patent number: 10622446
    Abstract: A semiconductor device includes in an active region in which current flows, an n+-type silicon carbide epitaxial layer of a low concentration and formed on an n+-type silicon carbide substrate; a p-type channel region constituting a channel region; a trench contacting the p-type channel region and having embedded therein an oxide film and a gate electrode; a p+-type base layer arranged beneath the trench; a third n-type CSL layer region contacting the p-type channel region; a second n-type CSL layer region having a maximum impurity concentration higher than that of the third n-type CSL layer region, the maximum impurity concentration being farther on a substrate front side than a top of the p+-type base layer arranged beneath the trench is; and a first n-type CSL layer region contacting the second n-type CSL layer region and having a maximum impurity concentration lower than that of the second n-type CSL layer region.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: April 14, 2020
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Yusuke Kobayashi, Akimasa Kinoshita, Shinsuke Harada
  • Publication number: 20200073368
    Abstract: To effectively utilize work information acquired by maintenance of an instrument in a plant, an apparatus is provided, which includes an acquisition unit that acquires work information about at least one of a calibration or an adjustment performed on the instrument in a plant; an extraction unit that extracts a plurality of data elements to be included in output information having a predetermined output format from the work information; and a generation unit that generates the output information from the plurality of data elements.
    Type: Application
    Filed: August 26, 2019
    Publication date: March 5, 2020
    Inventors: Ryouhei FURIHATA, Yusuke YOKOTA, Takahiro KINOSHITA, Toshiaki KASE
  • Publication number: 20200064146
    Abstract: A computer-implemented method for controlling navigation includes generating an emotion data of a first user that illustrates emotion of the first user based on information received from a sensor. The method includes transmitting the emotion data of the first user to a controller configured to control a navigation of a second user. The first user and the second user are members of a same group. The method includes modifying the navigation of the second user according to the emotion data of the first user.
    Type: Application
    Filed: August 24, 2018
    Publication date: February 27, 2020
    Inventors: Takeshi Kitajima, Takao Fujiwara, Yoshitaka Suzuki, Kazuto Kawata, Wonravee Chavalit, Jenny Le, Ryan Lacross, Shigeyuki Seko, Shuhei Kinoshita, Yusuke Narita, Toshiaki Takano
  • Patent number: 10551194
    Abstract: A sensor unit with high reliability and stable detection accuracy against vibrations of an installation target object is to be provided. A sensor unit includes: a sensor module configured including a substrate with inertial sensors mounted thereon, and an inner case in which the substrate is installed; and an outer case accommodating the sensor module. A recessed part is formed in the inner case. The inertial sensors are arranged in an area overlapping with the recessed part as viewed in a plan view seen from the direction of thickness of the substrate, and a filling member is provided to fill a space formed by the substrate and the recessed part. The sensor module is joined to a bottom wall of the outer case via a joining member.
    Type: Grant
    Filed: July 13, 2015
    Date of Patent: February 4, 2020
    Assignee: Seiko Epson Corporation
    Inventors: Yusuke Kinoshita, Masayasu Sakuma
  • Publication number: 20200027814
    Abstract: A semiconductor device includes a supporting substrate, a semiconductor chip, a resin member, and a heat-dissipating metal layer. The supporting substrate has a first surface and a second surface located opposite from each other in a thickness direction defined for the supporting substrate. The semiconductor chip includes a plurality of electrodes. The semiconductor chip is bonded to the supporting substrate on one side thereof with the first surface. The resin member has a first surface and a second surface located opposite from each other in a thickness direction defined for the resin member. The resin member covers at least a side surface of the supporting substrate and a side surface of the semiconductor chip. The heat-dissipating metal layer is arranged in contact with the supporting substrate and the resin member to cover the second surface of the supporting substrate and the second surface of the resin member at least partially.
    Type: Application
    Filed: March 27, 2018
    Publication date: January 23, 2020
    Inventors: Takashi ICHIRYU, Masanori NOMURA, Yusuke KINOSHITA, Hidetoshi ISHIDA, Yasuhiro YAMADA
  • Patent number: 10537927
    Abstract: A bending apparatus has (a) a first manipulator which feeds a hollow metal blank of closed cross section in its lengthwise direction, (b) a second manipulator which supports a first support means disposed at a first position and a metal blank while feeding it, a heating means disposed at a second position downstream of the first position in the blank feed direction for heating all or part of the circumference of the blank, and a cooling means disposed at a third position downstream of the second position for cooling a portion of the heated blank, and (c) a third manipulator which constitutes a second support means disposed at a fourth position downstream of the third position in the feed direction of the blank and which moves two-dimensionally or three-dimensionally while supporting at least one location of the metal blank to bend the metal blank into a desired shape.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: January 21, 2020
    Assignees: NIPPON STEEL CORPORATION, NIPPON STEEL & SUMIKIN PIPE CO., LTD., KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Atsushi Tomizawa, Naoaki Shimada, Shinjiro Kuwayama, Saburo Inoue, Manabu Okahisa, Yusuke Kinoshita, Takashi Suyama
  • Patent number: 10541590
    Abstract: A fluid machine includes a housing including a suction port through which fluid is drawn, an electric motor accommodated in the housing, and a drive device configured to drive the electric motor. The drive device includes a circuit board, a heat-generating component, and a metal member. The circuit board includes a pattern wire. The circuit board is opposed to an outer surface of the housing. The heat-generating component is located between the circuit board and the outer surface of the housing and spaced apart from the circuit board. The heat-generating component generates electromagnetic noise. The metal member is at least partially located between the circuit board and the heat-generating component. The metal member is configured to transmit heat from the heat-generating component to the housing and absorb or block the electromagnetic noise.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: January 21, 2020
    Assignee: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
    Inventors: Fumihiro Kagawa, Atsushi Naito, Yusuke Kinoshita
  • Patent number: 10527731
    Abstract: When an object detected by a distance measuring sensor is located in a monitoring region set in a blind spot of an operator, an obstacle determination section determines the detected object as an obstacle. Then, the obstacle determination section sets a monitoring region so that a region indicating a lower travelling body (2) is excluded according to a slewing angle detected by an angle sensor. Based on the slewing angle detected by the angle sensor, a stop control section determines a component, of at least one of the lower travelling body and an upper slewing body, which has a possibility that a construction machine collides with the obstacle when the component is operated, and stops operation of the determined component.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: January 7, 2020
    Assignee: KOBELCO CONSTRUCTION MACHINERY CO., LTD.
    Inventors: Akira Kinoshita, Yusuke Kamimura
  • Patent number: 10510656
    Abstract: A semiconductor device includes: a high-side transistor having a first gate electrode, first drain electrodes and first source electrodes; a low-side transistor having a second gate electrode, second drain electrodes and second source electrodes; a plurality of first drain pads that are disposed above the first drain electrodes and are electrically connected to the first drain electrodes; a plurality of first source pads that are disposed above the second source electrodes and are electrically connected to the second source electrodes; a plurality of first common interconnects that are disposed above the first source electrodes and above the second drain electrodes and are electrically connected to the first source electrodes and the second drain electrodes; and a plurality of second common interconnects that are connected to the first common interconnects, and extend in a direction that intersects with the first common interconnects.
    Type: Grant
    Filed: July 1, 2015
    Date of Patent: December 17, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yusuke Kinoshita, Satoshi Tamura
  • Patent number: D877787
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: March 10, 2020
    Assignee: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Yusuke Kinoshita, Kyoko Sotobayashi, Masato Ito, Kengo Nagamitsu
  • Patent number: D879848
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: March 31, 2020
    Assignee: Sumitomo Electric Hardmetal Corp.
    Inventors: Keiji Kinoshita, Kouki Matsubara, Yusuke Koike