Abstract: The present invention addresses the problem of providing a photosensitive resin composition which exhibits good imidization rate even in cases where the photosensitive resin composition is fired at a temperature of 200° C. or less, while having high pattern processability, and a cured film of which exhibits high long-term reliability if used in an organic EL display device. In order to solve the above-described problem, a photosensitive resin composition according to the present invention contains (a) a polyimide precursor, (b) a phenolic compound having an electron-withdrawing group and (c) a photosensitive compound; and the polyimide precursor (a) has a residue which is derived from a diamine that has an ionization potential of less than 7.1 eV.

Abstract: A joined article including: a resin (1) having a linear expansion coefficient at 30° C. to 200° C. of 17 ppm/° C. or higher and a thickness of 5 to 100 ?m; and a metal joined to a surface of the resin (1) and having a thickness of 5 to 50 ?m. The resin (1) includes a heat-affected layer that is close to the metal and that occupies 80% or less of the thickness of the resin (1), and the joined article is a dielectric material for a substrate. Also disclosed is a substrate including the joined article and a resin (2) stacked on the joined article.

Abstract: The present invention relates to a photosensitive resin composition having high sensitivity, high bending resistance for the cured film, and high long-term reliability for an organic EL display device in which the cured film is used. The present invention is a photosensitive resin composition containing an alkali-soluble resin (a), a phenolic resin (b) having a halogen atom, and a photosensitive compound (c).

Abstract: An object of the present invention is to provide an organic EL display device which does not undergo the decrease in luminance or pixel shrinkage and has excellent long-term reliability. The present invention is an organic EL display device constituting a cured product of a photosensitive resin composition containing an alkali-soluble resin (A) and a naphthoquinone diazide sulfonic acid ester compound (B), wherein an intensity ratio I(S)/I(TOTAL) is 0.0001 or more and 0.008 or less, where I(S) is a negative secondary ion intensity of sulfur, and I(TOTAL) is a sum total of negative secondary ion intensities of carbon, oxygen, fluorine, silicon and sulfur obtained by time-of-flight secondary ion mass spectrometry of the cured product. Alternatively, the present invention is a method for producing the cured product.

Abstract: The present invention provides a resin composition which is highly sensitive and exhibits high chemical resistance even in the case of being baked at a low temperature of 250° C. or less and can suppress the generation of outgas after curing. The present invention is a resin composition which contains (a) an alkali-soluble resin containing polyimide, polybenzoxazole, polyamide-imide, a precursor of any one of these compounds and/or a copolymer of these compounds and (b) an alkali-soluble resin having a monovalent or divalent group represented by the following general formula (1) in a structural unit and in which the modification rate of a phenolic hydroxyl group in the alkali-soluble resin (b) is 5% to 50%. (In general formula (1), O represents an oxygen atom. R1 represents a hydrogen atom or a hydrocarbon group which has 1 to 20 carbon atoms and may be substituted and R2 represents an alkyl group having 1 to 5 carbon atoms. s and t each independently represent an integer from 0 to 3.

Abstract: The present invention addresses the problem of providing a photosensitive resin composition which exhibits good imidization rate even in cases where the photosensitive resin composition is fired at a temperature of 200° C. or less, while having high pattern processability, and a cured film of which exhibits high long-term reliability if used in an organic EL display device. In order to solve the above-described problem, a photosensitive resin composition according to the present invention contains (a) a polyimide precursor, (b) a phenolic compound having an electron-withdrawing group and (c) a photosensitive compound; and the polyimide precursor (a) has a residue which is derived from a diamine that has an ionization potential of less than 7.1 eV.

Abstract: The present invention provides a resin composition having a high sensitivity and serving to produce a cured film with a low water absorption rate.

Abstract: The present invention relates to a photosensitive resin composition having high sensitivity, high bending resistance for the cured film, and high long-term reliability for an organic EL display device in which the cured film is used. The present invention is a photosensitive resin composition containing an alkali-soluble resin (a), a phenolic resin (b) having a halogen atom, and a photosensitive compound (c).

Abstract: The present invention provides a resin composition which is highly sensitive and exhibits high chemical resistance even in the case of being baked at a low temperature of 250° C. or less and can suppress the generation of outgas after curing. The present invention is a resin composition which contains (a) an alkali-soluble resin containing polyimide, polybenzoxazole, polyamide-imide, a precursor of any one of these compounds and/or a copolymer of these compounds and (b) an alkali-soluble resin having a monovalent or divalent group represented by the following general formula (1) in a structural unit and in which the modification rate of a phenolic hydroxyl group in the alkali-soluble resin (b) is 5% to 50%. (In general formula (1), O represents an oxygen atom. R1 represents a hydrogen atom or a hydrocarbon group which has 1 to 20 carbon atoms and may be substituted and R2 represents an alkyl group having 1 to 5 carbon atoms. s and t each independently represent an integer from 0 to 3.

Abstract: The present invention provides a resin composition having a high sensitivity and serving to produce a cured film with a low water absorption rate.

Abstract: The purpose of the present invention is to provide a photosensitive resin composition for thin film transistors, a cured film of which generates an extremely small amount of an outgas, and which is capable of forming an insulating layer for thin film transistors having excellent drive performance. In order to achieve the above-described purpose, the present invention has the configuration described below. Namely, a photosensitive resin composition for thin film transistors, which contains (A) an alkali-soluble resin having an amide group and/or an imide group, (B) a photosensitive compound and (C) organic solvents, and wherein the content of an organic solvent having nitrogen atoms in the organic solvents (C) is 1% by mass or less relative to the total mass of the organic solvents.

Abstract: The present invention provides a photosensitive resin composition which uses a polyimide precursor that has excellent solubility in organic solvents and is capable of reducing the viscosity of a resin composition obtained therefrom. The solution according to the present invention is a photosensitive resin composition which contains: an aromatic amide resin that has, as a main repeating unit, a specific structure having an amide group, a trifluoromethyl group and an aromatic ring; (b) a sensitizer; and (c) a solvent.

Abstract: The purpose of the present invention is to provide a photosensitive resin composition for thin film transistors, a cured film of which generates an extremely small amount of an outgas, and which is capable of forming an insulating layer for thin film transistors having excellent drive performance. In order to achieve the above-described purpose, the present invention has the configuration described below. Namely, a photosensitive resin composition for thin film transistors, which contains (A) an alkali-soluble resin having an amide group and/or an imide group, (B) a photosensitive compound and (C) organic solvents, and wherein the content of an organic solvent having nitrogen atoms in the organic solvents (C) is 1% by mass or less relative to the total mass of the organic solvents.

Abstract: Provided are a photosensitive resin composition which has excellent pattern processabilities (high sensitivity and high resolution) and is excellent in chemical resistance and thermal resistance after thermally treated; a heat-resistant resin or heat-resistant resin precursor used for the composition; and a diamine compound which is a raw material of the resin and the precursor. The diamine compound is a diamine compound represented by a general formula (1).

Abstract: The present invention provides a photosensitive resin composition which uses a polyimide precursor that has excellent solubility in organic solvents and is capable of reducing the viscosity of a resin composition obtained therefrom. The solution according to the present invention is a photosensitive resin composition which contains: an aromatic amide resin that has, as a main repeating unit, a specific structure having an amide group, a trifluoromethyl group and an aromatic ring; (b) a sensitizer; and (c) a solvent.