Abstract: One object is to improve the insulation reliability of a laminated ceramic capacitor. The body of a laminated ceramic capacitor according to one embodiment includes a first internal electrode layer, a second internal electrode layer, and a ceramic layer. The ceramic layer is disposed between the first internal electrode layer and the second internal electrode layer and contains crystal grains of ceramic material. The crystal grains each include a core portion and a shell portion covering the core portion. The shell portion includes one or more intra-shell pores.

Abstract: A ceramic electronic device includes a multilayer chip having a multilayer portion in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked. The multilayer chip has a side margin outside a capacity section. The multilayer chip has cover layers on an upper face and a lower face of a capacity section. Each of the side margin and the cover layers has, on a side of an outer surface, a high concentration portion of a subcomponent of at least one of Si, Mn, Cu, Fe, V, Ni, B, Mg, Ho, Dy, Er, Tm, Yb, Gd, Li, Co, Sm and Y. A concentration of the subcomponent of the high concentration portion is higher than that of a portion closer to the capacity section than the high concentration portion.

Abstract: A ceramic electronic component, in which a dimension in a first direction being equal to or greater than 1.3 times a dimension in a second direction perpendicular to the first direction, includes a multilayer chip having a plurality of internal electrode layers stacked in the first direction; and a pair of external electrodes provided on a first end surface and a second end surface, wherein in each of the plurality of internal electrode layers, a width of a connecting portion thereof connected to the corresponding external electrode in the second direction is narrower than a width of other regions of the internal electrode layer, and wherein in at least two adjacent internal electrode layers connected to the same one of the pair of external electrodes, side edges of the connecting portions in the second direction are shifted in position with respect to each other in the second direction.

Abstract: A multi-layer ceramic electronic component includes a multi-layer unit and a side margin. The multi-layer unit includes a functional unit including internal electrodes laminated in a first direction, and a pair of covers that covers the functional unit from both sides in the first direction, the multi-layer unit satisfying a relationship of (2*t2)/t1?0.6, where t1 represents a dimension of the functional unit in the first direction and t2 represents a dimension of each of the pair of covers in the first direction. The side margin covers the multi-layer unit in a second direction orthogonal to the first direction.

Abstract: A ceramic electronic component includes a multilayer chip having a rectangular parallelepiped shape and including dielectric layers and internal electrode layers alternately stacked, the dielectric layers being mainly composed of ceramic, the internal electrode layers being alternately exposed to two edge faces of the multilayer chip opposite to each other, and external electrodes respectively formed on the two edge faces, wherein an average crystal grain size of the ceramic in a cross section is 200 nm or less in a dielectric portion, and a CV value of a grain size distribution of crystal grains of the ceramic in the cross section is less than 38% in the dielectric portion, the dielectric portion being defined as a region made of the ceramic in the multilayer chip that is in contact with one of the external electrodes and that has a width of 5 ?m from said one of the external electrodes.

Abstract: A multi-layer ceramic electronic component includes a multi-layer unit and a side margin. The multi-layer unit includes a functional unit including internal electrodes laminated in a first direction, and a pair of covers that covers the functional unit from both sides in the first direction, the multi-layer unit satisfying a relationship of (2*t2)/t1?0.6, where t1 represents a dimension of the functional unit in the first direction and t2 represents a dimension of each of the pair of covers in the first direction. The side margin covers the multi-layer unit in a second direction orthogonal to the first direction.

Abstract: A ceramic electronic device includes: a multilayer chip having a structure in which each of dielectric layers and each of internal electrode layers are alternately stacked; and external electrodes provided on end faces of the multilayer chip, wherein a main component of the external electrodes is a first metal, wherein the internal electrode layers include the first metal and a second metal of which a melting point is higher than that of the first metal, wherein a diffusion coefficient of the first metal with respect to the second metal is larger than that of the second metal with respect to the first metal, wherein a number of a cavity in a range of 10 numbers of the internal electrode layers that are next to each other and are connected to a same external electrode of the first external electrode and the second external electrode is 1 or less.

Abstract: A multilayer ceramic capacitor includes an element body of roughly rectangular solid shape which is constituted by dielectric layers alternately stacked with internal electrode layers having different polarities, with a pair of cover layers formed on it to cover the top and bottom faces in the direction of lamination of the foregoing, and which has a pair of principal faces, a pair of end faces, and a pair of side faces, wherein external electrodes are formed on the pair of end faces and at least one of the pair of principal faces of the element body, and Tt representing the thickness of the external electrode and Tc representing the thickness of the cover layer satisfy the relationship of 1/30?Tt/Tc?4/5, and the thickness of the cover layers, or Tc, is 10 ?m or more but 30 ?m or less.

Abstract: A multilayer ceramic capacitor includes an element body and a pair of external electrodes. The element body includes a laminate. The laminate has a plurality of inner electrode layers stacked via dielectric layers. A height of the laminate in a stacking direction of the inner electrode layers is greater than a width of each of the inner electrode layers. The two external electrodes are formed on the element body such that one of the two external electrodes is connected to every other ones of the inner electrode layers and the other external electrode is connected to the remaining every other ones of the inner electrode layers.

Abstract: A multi-layer ceramic electronic component includes a plurality of layered internal electrodes and a first crystal grain. The plurality of layered internal electrodes are disposed at intervals in a first direction and each include a pore. The first crystal grain has a larger diameter in the first direction than the interval and has a part disposed in the pore.

Abstract: A multilayer ceramic capacitor includes an element body of roughly rectangular solid shape which is constituted by dielectric layers alternately stacked with internal electrode layers having different polarities, with a pair of cover layers formed on it to cover the top and bottom faces in the direction of lamination of the foregoing, and which has a pair of principal faces, a pair of end faces, and a pair of side faces, wherein external electrodes are formed on the pair of end faces and at least one of the pair of principal faces of the element body, and Tt representing the thickness of the external electrode and Tc representing the thickness of the cover layer satisfy the relationship of 1/30?Tt/Tc?4/5, and the thickness of the cover layers, or Tc, is 10 ?m or more but 30 ?m or less.

Abstract: A multi-layer ceramic electronic component includes a multi-layer unit and a side margin. The multi-layer unit includes ceramic layers laminated in a direction of a first axis, internal electrodes positioned between the ceramic layers, and a side surface facing in a direction of a second axis orthogonal to the first axis, the internal electrodes being exposed from the side surface, the multi-layer unit having a first dimension of 0.5 mm or less along a direction of a third axis orthogonal to the first axis and the second axis, the side surface having an area of 0.1 mm2 or more. The side margin covers the side surface of the multi-layer unit.

Abstract: A ceramic electronic component includes a multilayer chip having a rectangular parallelepiped shape and including dielectric layers and internal electrode layers alternately stacked, the dielectric layers being mainly composed of ceramic, the internal electrode layers being alternately exposed to two edge faces of the multilayer chip opposite to each other, and external electrodes respectively formed on the two edge faces, wherein an average crystal grain size of the ceramic in a cross section is 200 nm or less in a dielectric portion, and a CV value of a grain size distribution of crystal grains of the ceramic in the cross section is less than 38% in the dielectric portion, the dielectric portion being defined as a region made of the ceramic in the multilayer chip that is in contact with one of the external electrodes and that has a width of 5 ?m from said one of the external electrodes.

Abstract: A method for manufacturing a multilayer ceramic capacitor includes: producing a plurality of dielectric green sheets; producing therefrom a plurality of internal electrode-printed green sheets; producing therefrom a plurality of individually cut unsintered laminates by stacking some of the plurality of dielectric green sheets, as cover layers, and the plurality of internal electrode-printed green sheets together; producing therefrom element body precursors by applying a ceramic paste to side faces of the unsintered laminates for forming side margins thereon, wherein an application thickness of the ceramic paste is adjusted in a manner such that a thickness of the side margins is greater than a thickness of the cover layers in the final product; producing therefrom element bodies by sintering; and forming external electrodes on at least one of principal faces and on both end faces of the element bodies.

Abstract: A ceramic electronic device includes: a multilayer chip having a structure in which each of dielectric layers and each of internal electrode layers are alternately stacked; and external electrodes provided on end faces of the multilayer chip, wherein a main component of the external electrodes is a first metal, wherein the internal electrode layers include the first metal and a second metal of which a melting point is higher than that of the first metal, wherein a diffusion coefficient of the first metal with respect to the second metal is larger than that of the second metal with respect to the first metal, wherein a number of a cavity in a range of 10 numbers of the internal electrode layers that are next to each other and are connected to a same external electrode of the first external electrode and the second external electrode is 1 or less.

Abstract: A multi-layer ceramic electronic component includes a multi-layer unit and a side margin. The multi-layer unit includes a functional unit including internal electrodes laminated in a first direction, and a pair of covers that covers the functional unit from both sides in the first direction, the multi-layer unit satisfying a relationship of (2*t2)/t1>0.6, where t1 represents a dimension of the functional unit in the first direction and t2 represents a dimension of each of the pair of covers in the first direction. The side margin covers the multi-layer unit in a second direction orthogonal to the first direction.

Abstract: A multi-layer ceramic electronic component includes a multi-layer unit and a side margin. The multi-layer unit includes ceramic layers laminated in a direction of a first axis, internal electrodes positioned between the ceramic layers, and a side surface facing in a direction of a second axis orthogonal to the first axis, the internal electrodes being exposed from the side surface, the multi-layer unit having a first dimension of 0.5 mm or less along a direction of a third axis orthogonal to the first axis and the second axis, the side surface having an area of 0.1 mm2 or more. The side margin covers the side surface of the multi-layer unit.

Abstract: A multilayer ceramic capacitor includes an element body of roughly rectangular solid shape which is constituted by dielectric layers alternately stacked with internal electrode layers having different polarities and which has a pair of principle faces, a pair of end faces, and a pair of side faces, wherein the multilayer ceramic capacitor is such that: external electrodes are formed on the pair of end faces and one principle face of the element body; and on a cross section taken in parallel with one end face of the multilayer ceramic capacitor near the end face, the ratio of area A constituted by the internal electrode layers connected to the external electrode on this end face side and the dielectric layers present between the internal electrode layers, and area B covering the part of the section excluding the external electrodes, A/B, is 0.92 or more.

Abstract: In an exemplary embodiment, a multilayer ceramic capacitor 10 is formed in such a way that a first face f1 of a capacitor body 11 has a concave shape and a first part 12a of a first external electrode 12 contacts the concave-shaped first face f1, and that a second face f2 of the capacitor body 11 has a concave shape and a first part 13a of a second external electrode 13 contacts the concave-shaped second face f2.

Abstract: A multi-layer ceramic electronic component includes a plurality of layered internal electrodes and a first crystal grain. The plurality of layered internal electrodes are disposed at intervals in a first direction and each include a pore. The first crystal grain has a larger diameter in the first direction than the interval and has a part disposed in the pore.