Abstract: The present disclosure relates to a semiconductor device, a solid-state imaging device, and an electronic apparatus that can reduce warping. In a mounted substrate, the solid-state imaging device has a light receiving surface on which a subject image is incident, and by connecting solder balls disposed on the back surface of the light receiving surface to a wiring substrate, it is possible to take out an electric signal to the outside for image recognition. Furthermore, a thermal expansion adjustment member is provided on the side opposite to the solid-state imaging device mounted on the wiring substrate. The linear expansion coefficient and the Young's modulus of the thermal expansion adjustment member are adjusted, so that rigidity is equal or substantially equal between the solid-state imaging device side and the thermal expansion adjustment member side. The present disclosure can be applied, for example, to a CMOS solid-state imaging device used for an imaging device such as a camera.

Abstract: The present technology relates to a camera module and an electronic apparatus that can lower the risk of breakage. An imaging element has a light receiving surface to receive light, and is flip-chip mounted on a base. A joining material is joined to the optical back surface of the imaging element so that a space is formed between the joining material and a back-surface-side member provided on the side of the optical back surface on the opposite side of the imaging element from the light receiving surface. The present technology can be applied to camera modules and the like that capture images, for example.

Abstract: The present technology relates to a camera module and an electronic apparatus that can lower the risk of breakage. An imaging element has a light receiving surface to receive light, and is flip-chip mounted on a base. A joining material is joined to the optical back surface of the imaging element so that a space is formed between the joining material and a back-surface-side member provided on the side of the optical back surface on the opposite side of the imaging element from the light receiving surface. The present technology can be applied to camera modules and the like that capture images, for example.

Abstract: An image display device includes an image forming unit and a light guide unit. The light guide unit includes a light guide plate and a housing member. The light guide plate is configured to guide light of an image formed in the image forming unit. The housing member is configured to house the light guide plate. The housing member includes a first cover member, a second cover member, and an attachment member. The second cover member is attached to the first cover member. The attachment member is configured to attach the light guide plate to a housing unit that is surrounded by the first cover member and the second cover member.

Abstract: An image display device includes an image forming unit and a light guide unit. The light guide unit includes a light guide plate and a housing member. The light guide plate is configured to guide light of an image formed in the image forming unit. The housing member is configured to house the light guide plate. The housing member includes a first cover member, a second cover member, and an attachment member. The second cover member is attached to the first cover member. The attachment member is configured to attach the light guide plate to a housing unit that is surrounded by the first cover member and the second cover member.