Abstract: An information transaction device is connected to an information holding device including a storage unit storing personal information and includes a sharing approval reception unit configured to receive approval of sharing of the personal information by an information sharing destination device from a user associated with the personal information, a provision approval reception unit configured to receive approval of provision which is transmission of the personal information to an information provision destination device, from the user associated with the personal information, a sharing instruction unit configured to, in a case where the sharing approval reception unit receives the approval of the sharing, instruct the information holding device to perform the sharing, and a provision instruction unit configured to, in a case where the provision approval reception unit receives the approval of the provision, instruct the information holding device to perform the provision.

Abstract: An information transaction device stores catalog information including detailed information related to one or more datasets including personal information providable to an information provision destination device from an information provision source device. The information transaction device receives a provision request for the dataset from the information provision destination device. The information transaction device outputs a transmission request for the dataset indicated by the provision request to the information provision source device.

Abstract: A semiconductor device includes: a signal input circuit that receives a signal from an outside; a signal output circuit that outputs the signal to the outside; a coupling element connected between the signal input circuit and the signal output circuit; an inspection output circuit that causes the signal input circuit to output an inspection signal to the outside not via the coupling element or an inspection input circuit that causes the signal output circuit to receive the inspection signal from the outside not via the coupling element. The signal input circuit, the signal output circuit, and the coupling element are formed on a semiconductor chip and packaged.

Abstract: A semiconductor device includes: a signal input circuit that receives a signal from an outside; a signal output circuit that outputs the signal to the outside; a coupling element connected between the signal input circuit and the signal output circuit; an inspection output circuit that causes the signal input circuit to output an inspection signal to the outside not via the coupling element or an inspection input circuit that causes the signal output circuit to receive the inspection signal from the outside not via the coupling element. The signal input circuit, the signal output circuit, and the coupling element are formed on a semiconductor chip and packaged.

Abstract: A gate driving device drives a plurality of semiconductor elements connected in parallel. The plurality of semiconductor elements includes a start-up semiconductor element and a next-stage driving semiconductor element. The gate driving device includes a current detection circuit, a constant current circuit, a selector switch, and a control circuit. In start-up control performed by the control circuit, the control circuit applies a gate signal to the start-up semiconductor element at a constant current to turn on the start-up semiconductor element. In next-stage drive control performed by the control circuit, in response to the current of the semiconductor element reaches a threshold current, the control circuit sets the selector switch to an operating state and applies a gate signal to the next-stage driving semiconductor element at a constant voltage to turn on the next-stage driving semiconductor element.

Abstract: An electronic circuit device comprises an output part, which includes at least three phase parts and a first temperature sensor and a second temperature sensor, which output detection signals corresponding to temperatures of the output part. Each phase part includes two high-side and low-side switching elements. The first temperature sensor is located at a position between the first phase part and the second phase part. The second temperature sensor is located at a position between the second phase part and the third phase part. The electronic circuit device further comprises a control circuit part, which specifies a phase part of overheat among the phase parts based on the detection signals of the first temperature sensor and the second temperature sensor.

Abstract: An electronic circuit device comprises an output part, which includes at least three phase parts and a first temperature sensor and a second temperature sensor, which output detection signals corresponding to temperatures of the output part. Each phase part includes two high-side and low-side switching elements. The first temperature sensor is located at a position between the first phase part and the second phase part. The second temperature sensor is located at a position between the second phase part and the third phase part. The electronic circuit device further comprises a control circuit part, which specifies a phase part of overheat among the phase parts based on the detection signals of the first temperature sensor and the second temperature sensor.