Patents by Inventor Yusuke Morimoto

Yusuke Morimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11939641
    Abstract: A grain oriented electrical steel sheet includes the texture aligned with Goss orientation. In the grain oriented electrical steel sheet, when (?1 ?1 ?1) and (?2 ?2 ?2) represent deviation angles of crystal orientations measured at two measurement points which are adjacent on the sheet surface and which have an interval of 1 mm, the boundary condition BA is defined as [(?2??1)2+(?2??1)2+(?2??1)2]1/2?0.5°, and the boundary condition BB is defined as [(?2??1)2+(?2??1)2+(?2??1)2]1/2?2.0°, the boundary which satisfies the boundary condition BA and which does not satisfy the boundary condition BB is included.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: March 26, 2024
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Shuichi Nakamura, Yusuke Kawamura, Shota Morimoto
  • Patent number: 11445609
    Abstract: There is provided a printed circuit board in which an amount of molten solder adhering over electrodes adjacent to each other is increased in flow soldering. The printed circuit board according to the present invention includes: a first insulating substrate (6) having a mounting hole (15) that penetrates through the first insulating substrate (6) from a first surface (6a) to a second surface (6b); a second insulating substrate (18) including a connection portion (23a) that penetrates through the mounting hole (15) from the first surface (6a) side and protrudes from the second surface (6b); first electrodes (7 and 9) that are provided on the second surface (6b) and are arranged at an edge of the mounting hole (15); and second electrodes (19 and 25) provided on the connection portion (23a). The first electrodes (7 and 9) and the second electrodes (19 and 25) are joined by solder.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: September 13, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yoshiko Fujima, Toshiki Asai, Yusuke Morimoto, Kohei Sato, Shunsuke Sasaki
  • Patent number: 11432403
    Abstract: A printed circuit board includes: a first insulating substrate having a mounting hole that penetrates through the first insulating substrate from a first surface to a second surface; a second insulating substrate including a connection portion; a first electrode provided on the second surface and disposed at an edge of the mounting hole; a second electrode provided on the connection portion and joined to the first electrode; and an electronic component provided on the second surface. A center of mass of the second insulating substrate is disposed on the first surface of the first insulating substrate. A center of mass of the electronic component is disposed on the second surface of the first insulating substrate. The electronic component has a weight equivalent to a weight of the second insulating substrate.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: August 30, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yoshiko Fujima, Toshiki Asai, Yusuke Morimoto, Kohei Sato, Shunsuke Sasaki
  • Patent number: 11277914
    Abstract: A printed circuit board assembly includes a first printed circuit board with first surface and second surface with a slit portion and a second printed circuit board with third surface and fourth surface with a first end portion and a second end portion. The first end portion is fitted in the slit portion and a tip of the first end portion protrudes from the second surface. The first printed circuit board includes first electrodes arranged along the slit portion in a longitudinal direction of the slit portion on the second surface. The second printed circuit board includes second electrodes arranged in the first end portion on the third and fourth surfaces. The second electrodes are joined to the first electrodes with solder. The first printed circuit board includes a support fixed to the first surface. The second printed circuit board is attached to the support by an adhesive substance.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: March 15, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shusaku Nakase, Yusuke Morimoto
  • Publication number: 20220069716
    Abstract: A phase difference correction control unit determines, based on a difference between a voltage of a first input smoothing capacitor and a voltage of a second input smoothing capacitor, a difference between a current flowing through a first switching element and a current flowing through a second switching element, or a difference between a reactor current when a gate signal of the first switching element is turned on and a reactor current when a gate signal of the second switching element is turned on, an amount of correction of a difference between a phase of switching of the first switching element and a phase of switching of the second switching element. A switching control unit switches the first switching element and the second switching element based on the amount of correction.
    Type: Application
    Filed: February 6, 2020
    Publication date: March 3, 2022
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yusuke MORIMOTO, Yasuyuki MIYAZAKI
  • Patent number: 11266018
    Abstract: A printed wiring board includes a main substrate, a standing substrate, a first electrode portion, and a second electrode portion. The second electrode portion is connected to the first electrode portion with solder while a support portion is inserted in a slit. The first electrode portion is provided to reach the slit. The second electrode portion is disposed to span from a bottom surface to a height position higher than or equal to a midpoint between a top surface and the bottom surface.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: March 1, 2022
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shunsuke Sasaki, Yusuke Morimoto
  • Patent number: 11122687
    Abstract: A first substrate has a slit formed therein, passing through the first substrate from one first primary surface to the other first primary surface opposite the one first primary surface, the first substrate including at least one first electrode. A second substrate has one second primary surface and the other second primary surface opposite the one second primary surface, the second substrate: including a support inserted in the slit so as to intersect with the first substrate; and having at least one second electrode on the support. The first electrode and the second electrode are bonded by a solder. A dimension of the slit in the longitudinal direction is greater than the sum of a design dimension of the support in the longitudinal direction, a maximum design dimension tolerance of the support in the longitudinal direction, and a maximum design dimension tolerance of the slit in the longitudinal direction.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: September 14, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kohei Sato, Shunsuke Sasaki, Yusuke Morimoto
  • Publication number: 20210267056
    Abstract: A printed circuit board includes: a first insulating substrate having a mounting hole that penetrates through the first insulating substrate from a first surface to a second surface; a second insulating substrate including a connection portion; a first electrode provided on the second surface and disposed at an edge of the mounting hole; a second electrode provided on the connection portion and joined to the first electrode; and an electronic component provided on the second surface. A center of mass of the second insulating substrate is disposed on the first surface of the first insulating substrate. A center of mass of the electronic component is disposed on the second surface of the first insulating substrate. The electronic component has a weight equivalent to a weight of the second insulating substrate.
    Type: Application
    Filed: February 13, 2019
    Publication date: August 26, 2021
    Inventors: Yoshiko FUJIMA, Toshiki ASAI, Yusuke MORIMOTO, Kohei SATO, Shunsuke SASAKI
  • Publication number: 20210267060
    Abstract: There is provided a printed circuit board in which an amount of molten solder adhering over electrodes adjacent to each other is increased in flow soldering. The printed circuit board according to the present invention includes: a first insulating substrate (6) having a mounting hole (15) that penetrates through the first insulating substrate (6) from a first surface (6a) to a second surface (6b); a second insulating substrate (18) including a connection portion (23a) that penetrates through the mounting hole (15) from the first surface (6a) side and protrudes from the second surface (6b); first electrodes (7 and 9) that are provided on the second surface (6b) and are arranged at an edge of the mounting hole (15); and second electrodes (19 and 25) provided on the connection portion (23a). The first electrodes (7 and 9) and the second electrodes (19 and 25) are joined by solder.
    Type: Application
    Filed: February 13, 2019
    Publication date: August 26, 2021
    Inventors: Yoshiko FUJIMA, Toshiki ASAI, Yusuke MORIMOTO, Kohei SATO, Shunsuke SASAKI
  • Patent number: 11089679
    Abstract: A printed wiring board includes a main substrate and a rising substrate. A support portion of the rising substrate is inserted into a slit in the main substrate. In a direction in which a plurality of first electrodes are aligned, a width of each of the plurality of first electrodes is larger than a width of each of a plurality of second electrodes, and the width of each of the plurality of second electrodes is arranged to fit within the width of each of the plurality of first electrodes.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: August 10, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shunsuke Sasaki, Kohei Sato, Yusuke Morimoto
  • Patent number: 11059672
    Abstract: A fire protection door in an open position is present above a traveling path of a transport vehicle. The fire protection door is capable of moving downward from the open position to a closed position along a door trajectory. The transport vehicle includes: a control portion; an area detection portion that detects an interference area, which is an area in which a portion of the transport vehicle in the traveling path overlaps the door trajectory; and a descent detection portion that detects a descent of the fire protection door. The control portion performs a retraction control such that the transport vehicle travels to the outside of the interference area when the descent detection portion has detected a descent of the fire protection door in a state in which the transport vehicle is located in the interference area.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: July 13, 2021
    Assignee: Daifuku Co., Ltd.
    Inventors: Yuso Ogawa, Natsuo Takagawa, Kazuharu Yoshinaga, Toshikazu Kato, Yusuke Morimoto
  • Publication number: 20210195744
    Abstract: A first substrate has a slit formed therein, passing through the first substrate from one first primary surface to the other first primary surface opposite the one first primary surface, the first substrate including at least one first electrode. A second substrate has one second primary surface and the other second primary surface opposite the one second primary surface, the second substrate: including a support inserted in the slit so as to intersect with the first substrate; and having at least one second electrode on the support. The first electrode and the second electrode are bonded by a solder. A dimension of the slit in the longitudinal direction is greater than the sum of a design dimension of the support in the longitudinal direction, a maximum design dimension tolerance of the support in the longitudinal direction, and a maximum design dimension tolerance of the slit in the longitudinal direction.
    Type: Application
    Filed: November 30, 2018
    Publication date: June 24, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kohei SATO, Shunsuke SASAKI, Yusuke MORIMOTO
  • Patent number: 10862380
    Abstract: A rotor with four axially stacked rotor cores, and a plurality of field magnets interposed between them. Each rotor core includes a rotor-side claw-shaped magnetic pole. Each rotor-side claw-shaped magnetic poles are respectively extending from and formed on each rotor core at equal angle intervals. Tip end surfaces of the first and third rotor-side claw-shaped magnetic pole abut against or are closely opposed to each other axially. Tip end surfaces of the second and fourth rotor-side claw-shaped magnetic poles abut against or are closely opposed to each other in the axial direction. The plurality of field magnets are magnetized in the axial direction such that the field magnets causes the first and third rotor-side claw-shaped magnetic poles to function as first magnetic poles, and cause the second and fourth rotor-side claw-shaped magnetic poles to function as second magnetic poles.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: December 8, 2020
    Assignee: DENSO CORPORATION
    Inventors: Yoshiaki Takemoto, Yusuke Morimoto, Masashi Matsuda, Seiya Yokoyama
  • Publication number: 20200323079
    Abstract: A printed wiring board includes a main substrate and a rising substrate. A support portion of the rising substrate is inserted into a slit in the main substrate. In a direction in which a plurality of first electrodes are aligned, a width of each of the plurality of first electrodes is larger than a width of each of a plurality of second electrodes, and the width of each of the plurality of second electrodes is arranged to fit within the width of each of the plurality of first electrodes.
    Type: Application
    Filed: June 23, 2020
    Publication date: October 8, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Shunsuke SASAKI, Kohei SATO, Yusuke MORIMOTO
  • Patent number: 10766513
    Abstract: An article transport vehicle includes an obstacle sensor having a detection area that includes at least the width of the own vehicle and that expands in the advancing direction, controls the travel of the own vehicle, based on as front inter-object distance corresponding to own-vehicle position information indicating a position of the own vehicle and front object position information indicating a position on a track of a front object that is located in front of the own vehicle and whose position on the track is specified, and sets a length of the detection area E along the advancing direction of the obstacle sensor to be variable according to the front inter-object distance such that the length is less than the front inter-object distance.
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: September 8, 2020
    Assignee: Daifuku Co., Ltd.
    Inventors: Natsuo Takagawa, Kazuharu Yoshinaga, Toshikazu Kato, Yusuke Morimoto
  • Patent number: 10756607
    Abstract: A motor includes a rotor and a stator. The rotor includes a first rotor core including a plurality of first claw-like magnetic poles, a second rotor core including a plurality of second claw-like magnetic poles, and a magnetic field magnet arranged between the first and second rotor cores. The first and second claw-like magnetic poles are alternately arranged in a circumferential direction. The magnetic field magnet causes the first and second claw-like magnetic poles to function as magnetic poles different from each other. The stator includes a first stator core including a plurality of first claw-like magnetic poles, a second stator core including a plurality of second claw-like magnetic poles, and a coil section arranged between the first and second stator cores. The stator is configured to cause the first and second claw-like magnetic poles of the stator to function as magnetic poles different from each other and switch polarities of the magnetic poles on the basis of energization to the coil section.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: August 25, 2020
    Assignee: Denso Corporation
    Inventors: Yoshiaki Takemoto, Masashi Matsuda, Yusuke Morimoto
  • Patent number: 10757807
    Abstract: A printed wiring board includes a main substrate and a rising substrate. A support portion of the rising substrate is inserted into a slit in the main substrate. In a direction in which a plurality of first electrodes are aligned, a width of each of the plurality of first electrodes is larger than a width of each of a plurality of second electrodes, and the width of each of the plurality of second electrodes is arranged to fit within the width of each of the plurality of first electrodes.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: August 25, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shunsuke Sasaki, Kohei Sato, Yusuke Morimoto
  • Publication number: 20200260583
    Abstract: A printed circuit board assembly includes a first printed circuit board having a first surface and a second surface that is opposite the first surface and including a slit portion and a second printed circuit board having a third surface and a fourth surface that is opposite the third surface and including a first end portion and a second end portion that is opposite the first end portion. The first end portion is fitted in the slit portion in such a manner that a tip of the first end portion protrudes from the second surface. The first printed circuit board includes a plurality of first electrodes arranged along the slit portion in a longitudinal direction of the slit portion on the second surface. The second printed circuit board includes a plurality of second electrodes arranged in the first end portion on the third surface and the fourth surface, and the plurality of second electrodes are joined to the plurality of first electrodes with solder.
    Type: Application
    Filed: November 2, 2017
    Publication date: August 13, 2020
    Inventors: Shusaku NAKASE, Yusuke MORIMOTO
  • Publication number: 20200236786
    Abstract: A printed wiring board includes a main substrate, a standing substrate, a first electrode portion, and a second electrode portion. The second electrode portion is connected to the first electrode portion with solder while a support portion is inserted in a slit. The first electrode portion is provided to reach the slit. The second electrode portion is disposed to span from a bottom surface to a height position higher than or equal to a midpoint between a top surface and the bottom surface.
    Type: Application
    Filed: December 4, 2018
    Publication date: July 23, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Shunsuke SASAKI, Yusuke MORIMOTO
  • Patent number: 10536132
    Abstract: An elastic wave element having a piezoelectric substrate equipped with a first main surface, and an excitation electrode arranged on the first main surface and having multiple electrode fingers, wherein, in a cross-sectional view in the direction orthogonal to the first main surface, the width of the electrode fingers at a first height at a distance from the first main surface is greater than the width at a second height located closest to the first main surface.
    Type: Grant
    Filed: November 18, 2015
    Date of Patent: January 14, 2020
    Assignee: KYOCERA Corporation
    Inventors: Yusuke Morimoto, Masahisa Shimozono