Abstract: Provided are a method of producing an automobile structure, which can suppress appearance failure of the automobile structure, and a curable composition that has enhanced thixotropy, an improved thread-forming property and excellent oily surface adhesion, and is suitably used in production of the automobile structure. The method of producing an automobile structure is a method of producing an automobile structure, including a step of applying a curable composition for production of an automobile structure to an adherend, the curable composition containing: (A) a liquid epoxy resin containing dispersed rubber particles; (B) a latent curing agent; (C) surface-treated fumed silica; (D) a block urethane resin; and (E) polyethylene powder, the curable composition having a ratio of a viscosity at a shear rate of 0.5/s to a viscosity at a shear rate of 1,000/s at 50° C. of 50 or more.

Abstract: Provided are a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects after open-state standing, and is excellent in rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition. The low-temperature heat-curable adhesive composition for structures includes (A) an epoxy resin, (B) a micro-encapsulated curing agent, (C) a hygroscopic agent, (D) a viscosity modifier, and (E) a stabilizer. The hygroscopic agent (C) is calcium oxide, which suitably includes both a surface-treated grade and a non-surface-treated grade.

Abstract: Provided are a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects after open-state standing, and is excellent in rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition. The low-temperature heat-curable adhesive composition for structures includes (A) an epoxy resin, (B) a micro-encapsulated curing agent, (C) a hygroscopic agent, (D) a viscosity modifier, and (E) a stabilizer. The hygroscopic agent (C) is calcium oxide, which suitably includes both a surface-treated grade and a non-surface-treated grade.