Patents by Inventor Yusuke Murai

Yusuke Murai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240075794
    Abstract: A vehicle door device includes first and second link arms each including a first pivotal connection point to a vehicle body and a second pivotal connection point to a door of a vehicle, and a drive unit that opens and closes the door based on an operation of a link mechanism formed by the first and second link arms by using at least one of the first and second link arms as a drive link and pivoting the drive link. The drive unit includes an actuator that outputs drive torque, and a transmission mechanism that transmits the drive torque to the drive link disposed at a position separated from the actuator. The transmission mechanism includes a torque input portion that inputs the drive torque to the drive link, and a power transmission member that forms a transmission path for the drive torque in a state of extending between the actuator and the torque input portion and has flexibility to enable transmission of the drive torque in a bent state.
    Type: Application
    Filed: August 17, 2023
    Publication date: March 7, 2024
    Applicant: AISIN CORPORATION
    Inventors: Jueru SHIMIZU, Yosuke KAJI, Yusuke KAJINO, Manabu MURAI
  • Publication number: 20230140945
    Abstract: A surface performance evaluation device including memory and a processor coupled to the memory. The processor being configured to: acquire a captured image, which is a moving image of a test object on which a liquid is dispersed, and which is captured by a camera; quantify, based on the captured image that is acquired by the processor, a degree of diffusion of the liquid that is dispersed on the test object and diffuses; and evaluate a surface performance of the test object based on an index quantified by the processor.
    Type: Application
    Filed: October 18, 2022
    Publication date: May 11, 2023
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yusuke MURAI, Masao YANO, Tetsuya SHOJI
  • Patent number: 9894751
    Abstract: First and second semiconductor devices and first and second bypass circuits are mounted on a printed wiring board. The first bypass circuit and the second bypass circuit are provided closer to the first semiconductor device and to the second semiconductor device, respectively. The first bypass circuit has one end connected to a power plane through a first power supply via and the other end connected to a ground plane through a first ground via. The second bypass circuit has one end connected to the power plane through a second power supply via and the other end connected to the ground plane through a second ground via. The ground plane has a slit between the connecting portions of the first and second ground vias to increase the impedance between the connecting portions of the first and the second ground vias. Thus, jitters caused by power supply noise can be reduced.
    Type: Grant
    Filed: November 18, 2015
    Date of Patent: February 13, 2018
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yusuke Murai, Shoji Matsumoto, Takashi Numagi, Hiroyuki Yamaguchi, Nobuaki Yamashita
  • Patent number: 9693450
    Abstract: A printed wiring board includes conductive layers laminated with insulator layers interposed. A land group including a plurality of lands arranged with intervals between each other, is formed in a rectangular region on a surface layer, among the plurality of conductive layers, when viewed in a direction perpendicular to the surface layer. The land group is arrayed in a triangular lattice manner. The land group is arranged so that a smallest angle, among angles formed between one side of the rectangular region and respective three sides of the triangular lattice, is 7° or more and 23° or less.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: June 27, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hiroyuki Miyake, Yusuke Murai, Kiyoshi Sekiguchi
  • Publication number: 20160157336
    Abstract: First and second semiconductor devices and first and second bypass circuits are mounted on a printed wiring board. The first bypass circuit and the second bypass circuit are provided closer to the first semiconductor device and to the second semiconductor device, respectively. The first bypass circuit has one end connected to a power plane through a first power supply via and the other end connected to a ground plane through a first ground via. The second bypass circuit has one end connected to the power plane through a second power supply via and the other end connected to the ground plane through a second ground via. The ground plane has a slit between the connecting portions of the first and second ground vias to increase the impedance between the connecting portions of the first and the second ground vias. Thus, jitters caused by power supply noise can be reduced.
    Type: Application
    Filed: November 18, 2015
    Publication date: June 2, 2016
    Inventors: Yusuke Murai, Shoji Matsumoto, Takashi Numagi, Hiroyuki Yamaguchi, Nobuaki Yamashita
  • Publication number: 20160143133
    Abstract: A printed wiring board includes conductive layers laminated with insulator layers interposed. A land group including a plurality of lands arranged with intervals between each other, is formed in a rectangular region on a surface layer, among the plurality of conductive layers, when viewed in a direction perpendicular to the surface layer. The land group is arrayed in a triangular lattice manner. The land group is arranged so that a smallest angle, among angles formed between one side of the rectangular region and respective three sides of the triangular lattice, is 7° or more and 23° or less.
    Type: Application
    Filed: November 17, 2015
    Publication date: May 19, 2016
    Inventors: Hiroyuki Miyake, Yusuke Murai, Kiyoshi Sekiguchi
  • Patent number: 9345126
    Abstract: A substrate of a semiconductor package comprises a conductor pattern which is formed in a surface layer, and is electrically connected to one terminal out of a power terminal and a ground terminal of a semiconductor element. The substrate also comprises in the surface layer a conductor pattern which is arranged while being separated from the conductor pattern, and a conductor pattern which is formed so as to have a wiring width thinner than that of the conductor pattern and connects the conductor pattern with the conductor pattern. The substrate also comprises a conductor pattern which is formed in an inner layer, faces the conductor pattern through a dielectric and is electrically connected to the other terminal out of the power terminal and the ground terminal of the semiconductor element.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: May 17, 2016
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Sou Hoshi, Nobuaki Yamashita, Yusuke Murai
  • Patent number: 9326370
    Abstract: Provided is a printed circuit board capable of increasing an inductance value of a power pattern and a ground pattern while keeping a low electric resistance value of the power pattern and the ground pattern. The printed circuit board includes a printed wiring board including: a power layer having a power pattern formed therein; and a ground layer having a ground pattern formed therein. On the printed wiring board, an LSI as a semiconductor device and an LSI as a power supply member are mounted. The ground pattern has a first ground region that overlaps the power pattern as viewed from the direction perpendicular to the surface of the printed wiring board. In the first ground region, at least one defect portion is formed. In the first ground region, the defect portion forms a region that is narrower than the power pattern.
    Type: Grant
    Filed: March 28, 2013
    Date of Patent: April 26, 2016
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Yusuke Murai, Sou Hoshi, Nobuaki Yamashita
  • Patent number: 9084364
    Abstract: On a surface layer of a printed wiring board, main power supply patterns to be applied with different DC voltages are disposed in a second region. Power supply patterns are disposed on the surface layer, and the power supply patterns are led from the main power supply patterns to a first region. The power supply patterns connect power supply terminals of terminal groups in the second region. The power supply patterns connect the power supply terminals between the terminal groups in the first region. Power supply terminals of the terminal groups of a semiconductor package are electrically connected to the main power supply patterns by the power supply patterns. Thus, potential fluctuations are reduced and radiation noise is suppressed, and the number of layers of the printed wiring board is reduced.
    Type: Grant
    Filed: June 12, 2013
    Date of Patent: July 14, 2015
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Sou Hoshi, Nobuaki Yamashita, Yusuke Murai, Tohru Ohsaka
  • Patent number: 8885633
    Abstract: A portable telephone unit 10 receives management information comprising size information for contents data wanting to be downloaded, and adjusts an environment for receiving the object data, based on size information for contents data contained in the management information. To adjust the environment for receiving the object data it is possible, for example, to determine a communication system for receipt, or to secure a storage region for storing object data that has been received. After that, the portable telephone unit 10 transmits a contents data download request, and receives contents data returned in response to the download request. As a result, it is possible for the communication terminal to download the contents data in a state where the receive environment has been optimized according to the size of the contents.
    Type: Grant
    Filed: March 14, 2006
    Date of Patent: November 11, 2014
    Assignee: Vodafone Group PLC
    Inventors: Yusuke Murai, Masayuki Doi, Akiho Shibata, Takafumi Okaniwa, Tatsuhiro Aoyagi
  • Publication number: 20140268586
    Abstract: A substrate of a semiconductor package comprises a conductor pattern which is formed in a surface layer, and is electrically connected to one terminal out of a power terminal and a ground terminal of a semiconductor element. The substrate also comprises in the surface layer a conductor pattern which is arranged while being separated from the conductor pattern, and a conductor pattern which is formed so as to have a wiring width thinner than that of the conductor pattern and connects the conductor pattern with the conductor pattern. The substrate also comprises a conductor pattern which is formed in an inner layer, faces the conductor pattern through a dielectric and is electrically connected to the other terminal out of the power terminal and the ground terminal of the semiconductor element.
    Type: Application
    Filed: March 6, 2014
    Publication date: September 18, 2014
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Sou Hoshi, Nobuaki Yamashita, Yusuke Murai
  • Patent number: 8774796
    Abstract: The present invention provides a system using an international roaming-capable mobile communication network in which a server controls the form in which a service is provided in accordance with the country of a service area in which a mobile station is located. The mobile station 1 determines the service area in which the mobile station 1 is located in accordance with a mobile communication mode set by a mobile communication mode setting function. Alternatively, the mobile station 1 determines the service area in which it is located through notification information relating to a mobile communication network system, received from a base station. When the mobile station 1 transmits a request for a service to a content provider server 4, the mobile station 1 simultaneously adds a region header describing the determined service area. A gateway G/W63 may add the region header instead of the mobile station 1.
    Type: Grant
    Filed: September 17, 2004
    Date of Patent: July 8, 2014
    Assignee: Vodafone Group PLC
    Inventors: Tomonori Aoki, Masayuki Doi, Yusuke Murai, Tadahisa Iritani, Eiichi Kataoka
  • Publication number: 20130343024
    Abstract: On a surface layer of a printed wiring board, main power supply patterns to be applied with different DC voltages are disposed in a second region. Power supply patterns are disposed on the surface layer, and the power supply patterns are led from the main power supply patterns to a first region. The power supply patterns connect power supply terminals of terminal groups in the second region. The power supply patterns connect the power supply terminals between the terminal groups in the first region. Power supply terminals of the terminal groups of a semiconductor package are electrically connected to the main power supply patterns by the power supply patterns. Thus, potential fluctuations are reduced and radiation noise is suppressed, and the number of layers of the printed wiring board is reduced.
    Type: Application
    Filed: June 12, 2013
    Publication date: December 26, 2013
    Inventors: Sou Hoshi, Nobuaki Yamashita, Yusuke Murai, Tohru Ohsaka
  • Publication number: 20130265726
    Abstract: Provided is a printed circuit board capable of increasing an inductance value of a power pattern and a ground pattern while keeping a low electric resistance value of the power pattern and the ground pattern. The printed circuit board includes a printed wiring board including: a power layer having a power pattern formed therein; and a ground layer having a ground pattern formed therein. On the printed wiring board, an LSI as a semiconductor device and an LSI as a power supply member are mounted. The ground pattern has a first ground region that overlaps the power pattern as viewed from the direction perpendicular to the surface of the printed wiring board. In the first ground region, at least one defect portion is formed. In the first ground region, the defect portion forms a region that is narrower than the power pattern.
    Type: Application
    Filed: March 28, 2013
    Publication date: October 10, 2013
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Yusuke Murai, Sou Hoshi, Nobuaki Yamashita
  • Patent number: 8407310
    Abstract: A cellular phone 10 transmits a request for management information including size information of object data which is desired to be downloaded, and determines whether a size of the object data exceeds a predetermined value or not, based on the size information. If the size of the object data does not exceed the predetermined value, the cellular phone 10 stores the object data, received in response to the download request, in a temporary storage area. If the size of the object data does exceed the predetermined value, the cellular phone 10 determines whether a free area for storing the object data in a permanent storage area exists or not. If a free area exists, the object data received in response to the download request is stored in the permanent storage area.
    Type: Grant
    Filed: November 13, 2006
    Date of Patent: March 26, 2013
    Assignee: Vodafone Group PLC
    Inventors: Yusuke Murai, Masayuki Doi, Tatsuhiro Aoyagi
  • Patent number: 7877775
    Abstract: When a command for starting up a specific versatile application of a versatile application section is made during an execution of a native application included in a basic processing section, a judgment of the following condition for combining is satisfied: whether or not the specific versatile application is in a paused state, and the specific versatile application has made a request for starting up the native application, is made (step S51). When a judgment that the condition for combining is satisfied is made, an execution of the specific versatile application is restarted (step S56). As a result, it is possible to have a prompt coordination between the basic processing section and the versatile application, while respecting a feeling of presence which is established in the mind of a user.
    Type: Grant
    Filed: May 1, 2007
    Date of Patent: January 25, 2011
    Assignee: Vodafone K.K.
    Inventors: Takashi Aoki, Yusuke Murai, Satoru Yokota, Takeo Matsuba
  • Publication number: 20090011758
    Abstract: The present invention provides a system using an international roaming-capable mobile communication network in which a server controls the form in which a service is provided in accordance with the country of a service area in which a mobile station is located. The mobile station 1 determines the service area in which the mobile station 1 is located in accordance with a mobile communication mode set by a mobile communication mode setting function. Alternatively, the mobile station 1 determines the service area in which it is located through notification information relating to a mobile communication network system, received from a base station. When the mobile station 1 transmits a request for a service to a content provider server 4, the mobile station 1 simultaneously adds a region header describing the determined service area. A gateway G/W63 may add the region header instead of the mobile station 1.
    Type: Application
    Filed: September 17, 2004
    Publication date: January 8, 2009
    Inventors: Tomonori Aoki, Masayuki Doi, Yusuke Murai, Tadahisa Iritani, Eiichi Kataoka
  • Publication number: 20070213844
    Abstract: When a command for starting up a specific versatile application of a versatile application section is made during an execution of a native application included in a basic processing section, a judgment of the following condition for combining is satisfied: whether or not the specific versatile application is in a paused state, and the specific versatile application has made a request for starting up the native application, is made (step S51). When a judgment that the condition for combining is satisfied is made, an execution of the specific versatile application is restarted (step S56). As a result, it is possible to have a prompt coordination between the basic processing section and the versatile application, while respecting a feeling of presence which is established in the mind of a user.
    Type: Application
    Filed: May 1, 2007
    Publication date: September 13, 2007
    Applicant: VODAFONE K.K.
    Inventors: Takashi Aoki, Yusuke Murai, Satoru Yokota, Takeo Matsuba
  • Publication number: 20070078951
    Abstract: A cellular phone 10 transmits management information including size information of object data desirably downloaded, and determines whether a size of the object data exceeds the second predetermined value or not, based on the size information. If the result is negative, the cellular phone 10 stores the object data, sent back responding to download request, in a temporary storage area. If the result is affirmative, the cellular phone 10 determines whether a free area for storing the object data in a permanent storage area exists or not. If the result is affirmative, the object data sent back responding to the downloading request is stored in the permanent storage area. As a result, the temporary storage area to be used for storing history is not used any more for storing a large amount of content data, and number of histories held in the temporary storage area can be guaranteed.
    Type: Application
    Filed: November 13, 2006
    Publication date: April 5, 2007
    Applicant: VODAFONE K.K.
    Inventors: Yusuke Murai, Masayuki Doi, Tatsuhiro Aoyagi
  • Publication number: 20060179135
    Abstract: A portable telephone unit 10 receives management information comprising size information for contents data wanting to be downloaded, and adjusts an environment for receiving the object data, based on size information for contents data contained in the management information. To adjust the environment for receiving the object data it is possible, for example, to determine a communication system for receipt, or to secure a storage region for storing object data that has been received. After that, the portable telephone unit 10 transmits a contents data download request, and receives contents data returned in response to the download request. As a result, it is possible for the communication terminal to download the contents data in a state where the receive environment has been optimized according to the size of the contents.
    Type: Application
    Filed: March 14, 2006
    Publication date: August 10, 2006
    Applicant: VODAFONE K.K.
    Inventors: Yusuke Murai, Masayuki Doi, Akiho Shibata, Takafumi Okaniwa, Tatsuhiro Aoyagi