Abstract: Noise included in a signal related to biological information acquired by a radio wave sensor is reduced. A biological information detection device includes: a reflection signal acquiring unit to acquire a reflection signal, from a living body, of a radio wave emitted toward the living body; an image acquiring unit that acquires an image of the living body; an image processing unit that performs image processing on the acquired image; a signal strength estimating unit that estimates a possible range of signal strength of the reflection signal on the basis of a result of the image processing; and a noise reduction processing unit that reduces, from the reflection signal, a signal having strength outside the estimated range of signal strength.

Abstract: A semiconductor device improved in deterioration detection accuracy by using an inductance of a bonding wire. The semiconductor device includes a first conductor pattern formed on the insulating substrate, the main current of the semiconductor die device flowing through the first conductor pattern; a second conductor pattern formed on the insulating substrate for sensing the potential of the surface electrode of the semiconductor die device; a first bonding wire for connecting the surface electrode and the first conductor pattern; and a second bonding wire. Further, there is a voltage sensing unit which is connected to the first conductor pattern and the second conductor pattern to sense a potential difference between the first conductor pattern and the second conductor pattern at the time of switching of the semiconductor die device; and a deterioration detection unit for detecting deterioration of the first bonding wire by using the sensed potential difference.

Abstract: A three-dimensional position estimation device includes: a feature point extracting unit for detecting an area corresponding to the face of an occupant in an image captured by a camera for imaging a vehicle interior and extracting a plurality of feature points in the detected area; an inter-feature-point distance calculating unit for calculating a first inter-feature-point distance that is a distance between distance-calculating feature points among the plurality of feature points; a face direction detecting unit for detecting the face direction of the occupant; a head position angle calculating unit for calculating a head position angle indicating the position of the head of the occupant with respect to an imaging axis of the camera; an inter-feature-point distance correcting unit for correcting the first inter-feature-point distance to a second inter-feature-point distance that is a distance between distance-calculating feature points in a state where portions of the head corresponding to the distance-calcu

Abstract: A three-dimensional position estimation device includes: a feature point extracting unit for detecting an area corresponding to the face of an occupant in an image captured by a camera for imaging a vehicle interior and extracting a plurality of feature points in the detected area; an inter-feature-point distance calculating unit for calculating a first inter-feature-point distance that is a distance between distance-calculating feature points among the plurality of feature points; a face direction detecting unit for detecting the face direction of the occupant; a head position angle calculating unit for calculating a head position angle indicating the position of the head of the occupant with respect to an imaging axis of the camera; an inter-feature-point distance correcting unit for correcting the first inter-feature-point distance to a second inter-feature-point distance that is a distance between distance-calculating feature points in a state where portions of the head corresponding to the distance-calcu

Abstract: A semiconductor device improved in deterioration detection accuracy by using an inductance of a bonding wire. The semiconductor device includes a first conductor pattern formed on the insulating substrate, the main current of the semiconductor die device flowing through the first conductor pattern; a second conductor pattern formed on the insulating substrate for sensing the potential of the surface electrode of the semiconductor die device; a first bonding wire for connecting the surface electrode and the first conductor pattern; and a second bonding wire. Further, there is a voltage sensing unit which is connected to the first conductor pattern and the second conductor pattern to sense a potential difference between the first conductor pattern and the second conductor pattern at the time of switching of the semiconductor die device; and a deterioration detection unit for detecting deterioration of the first bonding wire by using the sensed potential difference.