Patents by Inventor Yusuke Nakatani

Yusuke Nakatani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10219372
    Abstract: A flexible printed board electrically connected to an electronic component (for example, a liquid crystal panel) by thermal compression bonding, including a flexible substrate, a terminal portion formed on one surface of the flexible substrate and having a plurality of connection terminals to be connected to the electronic component, a wire portion having a plurality of wires formed on the other surface of the flexible substrate, and a plurality of through wires formed inside through holes penetrating the flexible substrate in a compression bonding connection area to the electronic component of the terminal portion to connect the connection terminals of the terminal portion and the respective wires of the wire portion.
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: February 26, 2019
    Assignee: FUJIKURA LTD.
    Inventors: Yuki Ishida, Yusuke Nakatani
  • Patent number: 10008780
    Abstract: An antenna (1) of the present invention includes: a dielectric substrate (11); an antenna conductor (12) including: a power feeding line (12a) that extends in a first direction; and a stub (12b); and a ground conductor (13). The antenna (1) further includes: a first parasitic element (12d) facing a first side of the stub (12b) which first side is on a side of a direction opposite to the first direction; and a second parasitic element (12e) facing a second side of the stub (12b) which second side is on the first direction side.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: June 26, 2018
    Assignee: FUJIKURA LTD.
    Inventors: Ryohei Hosono, Ning Guan, Yusuke Nakatani
  • Publication number: 20160365643
    Abstract: An antenna (1) of the present invention includes: a dielectric substrate (11); an antenna conductor (12) including: a power feeding line (12a) that extends in a first direction; and a stub (12b); and a ground conductor (13). The antenna (1) further includes: a first parasitic element (12d) facing a first side of the stub (12b) which first side is on a side of a direction opposite to the first direction; and a second parasitic element (12e) facing a second side of the stub (12b) which second side is on the first direction side.
    Type: Application
    Filed: December 10, 2014
    Publication date: December 15, 2016
    Applicant: FUJIKURA LTD.
    Inventors: Ryohei Hosono, Ning Guan, Yusuke Nakatani
  • Patent number: 9509057
    Abstract: An antenna includes a dielectric substrate, an antenna conductor, a ground conductor, a waveguide tube, a shield, and short-circuit portions. The shield is provided with a cut having a reverse-taper shape whose width becomes greater from an open end of the cut to an inward end of the cut. The short-circuit portions are provided along a whole periphery of the shield except for a portion provided with the cut.
    Type: Grant
    Filed: May 16, 2014
    Date of Patent: November 29, 2016
    Assignee: FUJIKURA LTD.
    Inventors: Ryohei Hosono, Ning Guan, Masahiro Iwamura, Yusuke Nakatani
  • Publication number: 20160190703
    Abstract: An antenna includes a dielectric substrate, an antenna conductor, a ground conductor, a waveguide tube, a shield, and short-circuit portions. The shield is provided with a cut having a reverse-taper shape whose width becomes greater from an open end of the cut to an inward end of the cut. The short-circuit portions are provided along a whole periphery of the shield except for a portion provided with the cut.
    Type: Application
    Filed: May 16, 2014
    Publication date: June 30, 2016
    Applicant: FUJIKURA LTD.
    Inventors: Ryohei Hosono, Ning Guan, Masahiro Iwamura, Yusuke Nakatani
  • Publication number: 20160183366
    Abstract: A flexible printed board electrically connected to an electronic component (for example, a liquid crystal panel) by thermal compression bonding, including a flexible substrate, a terminal portion formed on one surface of the flexible substrate and having a plurality of connection terminals to be connected to the electronic component, a wire portion having a plurality of wires formed on the other surface of the flexible substrate, and a plurality of through wires formed inside through holes penetrating the flexible substrate in a compression bonding connection area to the electronic component of the terminal portion to connect the connection terminals of the terminal portion and the respective wires of the wire portion.
    Type: Application
    Filed: July 25, 2014
    Publication date: June 23, 2016
    Applicant: FUJIKURA LTD.
    Inventors: Yuki Ishida, Yusuke Nakatani
  • Patent number: 8933099
    Abstract: The present invention provides a novel compound having FGFR inhibitory activity or a pharmaceutically acceptable salt thereof, and a pharmaceutical composition containing the same. Specifically, the present invention provides a compound represented by the following formula (I) or a pharmaceutically acceptable salt thereof: wherein n represents 0 to 2; A represents an arylene group or a heteroarylene group; G represents a single bond, an oxygen atom or —CH2—; E represents a nitrogen-containing non-aromatic heterocycle; R1 represents an alkoxy group or the like; R2 represents a hydrogen atom or the like; and R3 represents a hydrogen atom, an alkyl group, an alkoxy group or the like, with the proviso that when E represents an azetidine ring and R2 or R3 is present on a nitrogen atom on the azetidine ring, the R2 or R3 does not represent a hydrogen atom.
    Type: Grant
    Filed: February 19, 2014
    Date of Patent: January 13, 2015
    Assignee: Eisai R&D Management Co., Ltd.
    Inventors: Setsuo Funasaka, Toshimi Okada, Keigo Tanaka, Satoshi Nagao, Isao Ohashi, Yoshinobu Yamane, Yusuke Nakatani, Yuki Karoji
  • Publication number: 20140235614
    Abstract: The present invention provides a novel compound having FGFR inhibitory activity or a pharmaceutically acceptable salt thereof, and a pharmaceutical composition containing the same. Specifically, the present invention provides a compound represented by the following formula (I) or a pharmaceutically acceptable salt thereof: wherein n represents 0 to 2; A represents an arylene group or a heteroarylene group; G represents a single bond, an oxygen atom or —CH2—; E represents a nitrogen-containing non-aromatic heterocycle; R1 represents an alkoxy group or the like; R2 represents a hydrogen atom or the like; and R3 represents a hydrogen atom, an alkyl group, an alkoxy group or the like, with the proviso that when E represents an azetidine ring and R2 or R3 is present on a nitrogen atom on the azetidine ring, the R2 or R3 does not represent a hydrogen atom.
    Type: Application
    Filed: February 19, 2014
    Publication date: August 21, 2014
    Applicant: Eisai R&D Management Co., Ltd.
    Inventors: Setsuo Funasaka, Toshimi Okada, Keigo Tanaka, Satoshi Nagao, Isao Ohashi, Yoshinobu Yamane, Yusuke Nakatani, Yuki Karoji
  • Publication number: 20130098665
    Abstract: The present invention is a flexible printed circuit board provided with an insulating substrate and a wiring circuit provided on at least one main surface side of the insulating substrate, wherein the wiring circuit has a laminate having a first metal layer that contains first metallic crystal grains and a second metal layer that is adjacent to the first metal layer and contains second metallic crystal grains, with the first metal layer and the second metal layer being laminated along a direction perpendicular to the main surface of the insulating substrate, and the average grain size of the first metallic crystal grains is smaller than the average grain size of the second metallic crystal grains.
    Type: Application
    Filed: October 18, 2012
    Publication date: April 25, 2013
    Inventors: Yuu Ishii, Atsuki Nogami, Yusuke Nakatani
  • Publication number: 20100212939
    Abstract: A module of the present invention is provided with; a circuit board in which conductors are patterned on an insulating layer, and a functional element that is mounted on the conductor pattern face down via bumps. An aperture section is formed in an area of the circuit board which is the functional element mounting position, which is smaller than, a projected surface of the functional element, and is inside of a region where the bumps are joined with the conductors. A gap between the functional element and the circuit board, and the aperture section are sealed by a sealing resin.
    Type: Application
    Filed: October 3, 2008
    Publication date: August 26, 2010
    Applicant: FUJIKURA LTD.
    Inventors: Shoji Ito, Yusuke Nakatani, Ryo Takami, Tadanori Ohminato