Patents by Inventor Yusuke Nakatani
Yusuke Nakatani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11543390Abstract: An autosampler sets an injection valve to be in a sample filling state when a sample loop is filled with a sample, and, after completion of filling with the sample, switches the injection valve to an intermediate state and first connects only one end of the sample loop to a liquid delivery channel and an analysis channel. After the above, the injection valve is switched to the sample injection state and the sample loop is interposed between the liquid delivery channel and the analysis channel, so that the sample is injected into the analysis channel.Type: GrantFiled: July 4, 2017Date of Patent: January 3, 2023Assignee: Shimadzu CorporationInventors: Jun Yanagibayashi, Yusuke Nakatani
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Publication number: 20220319809Abstract: An object of the invention is to provide a plasma processing apparatus capable of both isotropic etching in which a flux of ions to a sample is reduced and anisotropic etching in which ions are incident on a sample in the same chamber.Type: ApplicationFiled: December 23, 2019Publication date: October 6, 2022Inventors: Taku Iwase, Naoyuki Kofuji, Yasushi Sonoda, Yusuke Nakatani, Motohiro Tanaka
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Publication number: 20210148868Abstract: An autosampler sets an injection valve to be in a sample filling state when a sample loop is filled with a sample, and, after completion of filling with the sample, switches the injection valve to an intermediate state and first connects only one end of the sample loop to a liquid delivery channel and an analysis channel. After the above, the injection valve is switched to the sample injection state and the sample loop is interposed between the liquid delivery channel and the analysis channel, so that the sample is injected into the analysis channel.Type: ApplicationFiled: July 4, 2017Publication date: May 20, 2021Inventors: Jun YANAGIBAYASHI, Yusuke NAKATANI
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Patent number: 10219372Abstract: A flexible printed board electrically connected to an electronic component (for example, a liquid crystal panel) by thermal compression bonding, including a flexible substrate, a terminal portion formed on one surface of the flexible substrate and having a plurality of connection terminals to be connected to the electronic component, a wire portion having a plurality of wires formed on the other surface of the flexible substrate, and a plurality of through wires formed inside through holes penetrating the flexible substrate in a compression bonding connection area to the electronic component of the terminal portion to connect the connection terminals of the terminal portion and the respective wires of the wire portion.Type: GrantFiled: July 25, 2014Date of Patent: February 26, 2019Assignee: FUJIKURA LTD.Inventors: Yuki Ishida, Yusuke Nakatani
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Patent number: 10008780Abstract: An antenna (1) of the present invention includes: a dielectric substrate (11); an antenna conductor (12) including: a power feeding line (12a) that extends in a first direction; and a stub (12b); and a ground conductor (13). The antenna (1) further includes: a first parasitic element (12d) facing a first side of the stub (12b) which first side is on a side of a direction opposite to the first direction; and a second parasitic element (12e) facing a second side of the stub (12b) which second side is on the first direction side.Type: GrantFiled: December 10, 2014Date of Patent: June 26, 2018Assignee: FUJIKURA LTD.Inventors: Ryohei Hosono, Ning Guan, Yusuke Nakatani
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Publication number: 20160365643Abstract: An antenna (1) of the present invention includes: a dielectric substrate (11); an antenna conductor (12) including: a power feeding line (12a) that extends in a first direction; and a stub (12b); and a ground conductor (13). The antenna (1) further includes: a first parasitic element (12d) facing a first side of the stub (12b) which first side is on a side of a direction opposite to the first direction; and a second parasitic element (12e) facing a second side of the stub (12b) which second side is on the first direction side.Type: ApplicationFiled: December 10, 2014Publication date: December 15, 2016Applicant: FUJIKURA LTD.Inventors: Ryohei Hosono, Ning Guan, Yusuke Nakatani
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Patent number: 9509057Abstract: An antenna includes a dielectric substrate, an antenna conductor, a ground conductor, a waveguide tube, a shield, and short-circuit portions. The shield is provided with a cut having a reverse-taper shape whose width becomes greater from an open end of the cut to an inward end of the cut. The short-circuit portions are provided along a whole periphery of the shield except for a portion provided with the cut.Type: GrantFiled: May 16, 2014Date of Patent: November 29, 2016Assignee: FUJIKURA LTD.Inventors: Ryohei Hosono, Ning Guan, Masahiro Iwamura, Yusuke Nakatani
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Publication number: 20160190703Abstract: An antenna includes a dielectric substrate, an antenna conductor, a ground conductor, a waveguide tube, a shield, and short-circuit portions. The shield is provided with a cut having a reverse-taper shape whose width becomes greater from an open end of the cut to an inward end of the cut. The short-circuit portions are provided along a whole periphery of the shield except for a portion provided with the cut.Type: ApplicationFiled: May 16, 2014Publication date: June 30, 2016Applicant: FUJIKURA LTD.Inventors: Ryohei Hosono, Ning Guan, Masahiro Iwamura, Yusuke Nakatani
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Publication number: 20160183366Abstract: A flexible printed board electrically connected to an electronic component (for example, a liquid crystal panel) by thermal compression bonding, including a flexible substrate, a terminal portion formed on one surface of the flexible substrate and having a plurality of connection terminals to be connected to the electronic component, a wire portion having a plurality of wires formed on the other surface of the flexible substrate, and a plurality of through wires formed inside through holes penetrating the flexible substrate in a compression bonding connection area to the electronic component of the terminal portion to connect the connection terminals of the terminal portion and the respective wires of the wire portion.Type: ApplicationFiled: July 25, 2014Publication date: June 23, 2016Applicant: FUJIKURA LTD.Inventors: Yuki Ishida, Yusuke Nakatani
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Patent number: 8933099Abstract: The present invention provides a novel compound having FGFR inhibitory activity or a pharmaceutically acceptable salt thereof, and a pharmaceutical composition containing the same. Specifically, the present invention provides a compound represented by the following formula (I) or a pharmaceutically acceptable salt thereof: wherein n represents 0 to 2; A represents an arylene group or a heteroarylene group; G represents a single bond, an oxygen atom or —CH2—; E represents a nitrogen-containing non-aromatic heterocycle; R1 represents an alkoxy group or the like; R2 represents a hydrogen atom or the like; and R3 represents a hydrogen atom, an alkyl group, an alkoxy group or the like, with the proviso that when E represents an azetidine ring and R2 or R3 is present on a nitrogen atom on the azetidine ring, the R2 or R3 does not represent a hydrogen atom.Type: GrantFiled: February 19, 2014Date of Patent: January 13, 2015Assignee: Eisai R&D Management Co., Ltd.Inventors: Setsuo Funasaka, Toshimi Okada, Keigo Tanaka, Satoshi Nagao, Isao Ohashi, Yoshinobu Yamane, Yusuke Nakatani, Yuki Karoji
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Publication number: 20140235614Abstract: The present invention provides a novel compound having FGFR inhibitory activity or a pharmaceutically acceptable salt thereof, and a pharmaceutical composition containing the same. Specifically, the present invention provides a compound represented by the following formula (I) or a pharmaceutically acceptable salt thereof: wherein n represents 0 to 2; A represents an arylene group or a heteroarylene group; G represents a single bond, an oxygen atom or —CH2—; E represents a nitrogen-containing non-aromatic heterocycle; R1 represents an alkoxy group or the like; R2 represents a hydrogen atom or the like; and R3 represents a hydrogen atom, an alkyl group, an alkoxy group or the like, with the proviso that when E represents an azetidine ring and R2 or R3 is present on a nitrogen atom on the azetidine ring, the R2 or R3 does not represent a hydrogen atom.Type: ApplicationFiled: February 19, 2014Publication date: August 21, 2014Applicant: Eisai R&D Management Co., Ltd.Inventors: Setsuo Funasaka, Toshimi Okada, Keigo Tanaka, Satoshi Nagao, Isao Ohashi, Yoshinobu Yamane, Yusuke Nakatani, Yuki Karoji
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Publication number: 20130098665Abstract: The present invention is a flexible printed circuit board provided with an insulating substrate and a wiring circuit provided on at least one main surface side of the insulating substrate, wherein the wiring circuit has a laminate having a first metal layer that contains first metallic crystal grains and a second metal layer that is adjacent to the first metal layer and contains second metallic crystal grains, with the first metal layer and the second metal layer being laminated along a direction perpendicular to the main surface of the insulating substrate, and the average grain size of the first metallic crystal grains is smaller than the average grain size of the second metallic crystal grains.Type: ApplicationFiled: October 18, 2012Publication date: April 25, 2013Inventors: Yuu Ishii, Atsuki Nogami, Yusuke Nakatani
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Publication number: 20100212939Abstract: A module of the present invention is provided with; a circuit board in which conductors are patterned on an insulating layer, and a functional element that is mounted on the conductor pattern face down via bumps. An aperture section is formed in an area of the circuit board which is the functional element mounting position, which is smaller than, a projected surface of the functional element, and is inside of a region where the bumps are joined with the conductors. A gap between the functional element and the circuit board, and the aperture section are sealed by a sealing resin.Type: ApplicationFiled: October 3, 2008Publication date: August 26, 2010Applicant: FUJIKURA LTD.Inventors: Shoji Ito, Yusuke Nakatani, Ryo Takami, Tadanori Ohminato
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Patent number: D1008986Type: GrantFiled: October 25, 2021Date of Patent: December 26, 2023Assignee: Hitachi High-Tech CorporationInventors: Yusuke Nakatani, Kazuumi Tanaka, Masahiro Yamaoka, Yasushi Sonoda, Taku Iwase