Patents by Inventor Yusuke Nezu

Yusuke Nezu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEALING SHEET AND SEMICONDUCTOR-DEVICE MANUFACTURING METHOD
    Publication number: 20200027754
    Abstract: A sealing sheet is provided which is used for sealing of a semiconductor chip embedded in a substrate or a semiconductor chip on a pressure sensitive adhesive sheet in a method of manufacturing a semiconductor device. The method includes a treatment step using an alkaline solution. The sealing sheet includes at least an adhesive layer having curability. The adhesive layer is formed of an adhesive composition that contains a thermoset resin, a thermoplastic resin, and an inorganic filler. The inorganic filler is surface-treated with a surface treatment agent having a minimum coverage area of less than 550 m2/g. With the sealing sheet, blisters in plating are less likely to occur.
    Type: Application
    Filed: February 27, 2018
    Publication date: January 23, 2020
    Inventors: Yasutaka WATANABE, Yusuke NEZU, Takashi SUGINO
  • SEALING SHEET AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
    Publication number: 20200006167
    Abstract: A sealing sheet is provided which is used for sealing of a semiconductor chip embedded in a substrate or a semiconductor chip on a pressure sensitive adhesive sheet in a method for producing a semiconductor device. The method includes a treatment step using an alkaline solution. The sealing sheet includes at least an adhesive layer having curability. The adhesive layer is formed of an adhesive composition that contains a thermoset resin, a thermoplastic resin, and an inorganic filler. The inorganic filler is surface-treated with a surface treatment agent having a minimum coverage area of 550 m2/g or more and 1,500 m2/g or less. The sealing sheet is less likely to cause the inorganic filler to escape from a cured layer 11?.
    Type: Application
    Filed: February 5, 2018
    Publication date: January 2, 2020
    Inventors: Yusuke NEZU, Takashi SUGINO
  • Sheet having adhesive resin layer attached thereto, and method for producing semiconductor device
    Patent number: 10086594
    Abstract: A sheet having an adhesive resin layer attached thereto includes a base and an adhesive resin layer laminated on the base. The rate of shrinkage of the base in each of an MD direction and a CD direction after the heating of the sheet at 70° C. for 1 minute is ?0.5 to 0.5% and the bending resistance of the base is 80 mm or more.
    Type: Grant
    Filed: May 14, 2013
    Date of Patent: October 2, 2018
    Assignee: LINTEC Corporation
    Inventors: Katsuhiko Horigome, Akinori Sato, Yusuke Nezu
  • Sheet Having Adhesive Resin Layer Attached Thereto, and Method for Producing Semiconductor Device
    Publication number: 20150165743
    Abstract: A sheet having an adhesive resin layer attached thereto includes a base and an adhesive resin layer laminated on the base. The rate of shrinkage of the base in each of an MD direction and a CD direction after the heating of the sheet at 70° C. for 1 minute is ?0.5 to 0.5% and the bending resistance of the base is 80 mm or more.
    Type: Application
    Filed: May 14, 2013
    Publication date: June 18, 2015
    Inventors: Katsuhiko Horigome, Akinori Sato, Yusuke Nezu