Patents by Inventor Yusuke NUIDA

Yusuke NUIDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11905388
    Abstract: The present invention provides a resin composition that contains copper particles and a particular resin and that is capable of producing a cured product having a low volume resistance value, and a cured product obtained by curing the resin composition. The resin composition contains (A) copper particles having an average particle diameter of 0.1 to 20 ?m, (B) a phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (b1) with an epoxy compound (b2), and (C) a curing agent, wherein the content of the component (B) and the content of the component (C), based on 100 parts by mass of the total amount of the components (A) to (C), are 0.1 to 30 parts by mass and 0.1 to 5 parts by mass, respectively. Further, the cured product is obtained by curing the resin composition.
    Type: Grant
    Filed: August 11, 2020
    Date of Patent: February 20, 2024
    Assignee: ADEKA CORPORATION
    Inventors: Yusuke Nuida, Hitoshi Hosokawa, Hiroshi Morita
  • Patent number: 11440092
    Abstract: A method of manufacturing copper powder according to the present invention includes: a first step of reducing copper particles in water by using at least one compound selected from the group consisting of potassium borohydride, sodiumborohydride, and lithium borohydride; after the first step, a second step of washing with water; a third step of washing copper powder obtained in the second step with at least one compound selected from the group consisting of ether compounds and alcohol compounds; and a fourth step of bringing the copper powder obtained in the third step into contact with an organic acid solution, in which at least one compound selected from the group consisting of ether compounds and alcohol compounds is used as a solvent.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: September 13, 2022
    Assignee: ADEKA CORPORATION
    Inventors: Yusuke Nuida, Hiroshi Morita
  • Publication number: 20220282059
    Abstract: The present invention provides a resin composition that contains copper particles and a particular resin and that is capable of producing a cured product having a low volume resistance value, and a cured product obtained by curing the resin composition. The resin composition contains (A) copper particles having an average particle diameter of 0.1 to 20 ?m, (B) a phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (b1) with an epoxy compound (b2), and (C) a curing agent, wherein the content of the component (B) and the content of the component (C), based on 100 parts by mass of the total amount of the components (A) to (C), are 0.1 to 30 parts by mass and 0.1 to 5 parts by mass, respectively. Further, the cured product is obtained by curing the resin composition.
    Type: Application
    Filed: August 11, 2020
    Publication date: September 8, 2022
    Inventors: Yusuke NUIDA, Hitoshi HOSOKAWA, Hiroshi MORITA
  • Publication number: 20200001371
    Abstract: A method of manufacturing copper powder according to the present invention includes: a first step of reducing copper particles in water by using at least one compound selected from the group consisting of potassium borohydride, sodiumborohydride, and lithium borohydride; after the first step, a second step of washing with water; a third step of washing copper powder obtained in the second step with at least one compound selected from the group consisting of ether compounds and alcohol compounds; and a fourth step of bringing the copper powder obtained in the third step into contact with an organic acid solution, in which at least one compound selected from the group consisting of ether compounds and alcohol compounds is used as a solvent.
    Type: Application
    Filed: December 7, 2017
    Publication date: January 2, 2020
    Applicant: ADEKA CORPORATION
    Inventors: Yusuke NUIDA, Hiroshi MORITA
  • Publication number: 20190168308
    Abstract: Provided is a method for producing copper powder, including using, as raw materials, (A) cuprous oxide, (B) at least one selected from the group consisting of boric acid and salts thereof, (C) at least one selected from the group consisting of ammonia and an ammonium ion source, and (D) at least one selected from the group consisting of monosaccharides, disaccharides, and polysaccharides. Component (C) preferably includes at least one selected from the group consisting of ammonia, ammonium chloride, ammonium bromide, ammonium formate, and ammonium acetate.
    Type: Application
    Filed: July 5, 2017
    Publication date: June 6, 2019
    Applicant: ADEKA CORPORATION
    Inventors: Yusuke NUIDA, Hiroshi MORITA