Patents by Inventor Yusuke Obata

Yusuke Obata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12651866
    Abstract: A connector comprises a housing and a connector position assurance (CPA) member. The housing is provided with a repositioning portion, a lock portion and a stopper. The CPA member has a base end portion, a regulating portion, a first arm portion, a distal end portion and a second arm portion. The distal end portion is provided with an abutment portion. The abutment portion is selectively positionable at a facing position or at a non-facing position. At least one of the first arm portion and the distal end portion is provided with a release projection. The release projection projects in a perpendicular direction from the at least one of the first arm portion and the distal end portion. Upon connection of the connector with a mating connector, the release projection is pushed by a mating release portion and moves the abutment portion from the facing position to the non-facing position.
    Type: Grant
    Filed: November 3, 2023
    Date of Patent: June 9, 2026
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Yusuke Obata, Yukuya Morishita
  • Publication number: 20260100534
    Abstract: A board waterproofing connector includes a circuit board having a flexible plane conductor, a fitting cover having a fitting portion, and a seal member that demonstrates a sealing property and that is sandwiched between the circuit board and the fitting cover. The fitting cover has a lock portion attached to the circuit board, and the circuit board has a locked portion onto which the lock portion is locked. In a state wherein the seal member is sandwiched between the circuit board and the fitting cover, the lock portion of the fitting cover is locked onto the locked portion of the circuit board such that the seal member waterproofs a space between the circuit board and the fitting cover.
    Type: Application
    Filed: June 27, 2025
    Publication date: April 9, 2026
    Inventors: Yusuke OBATA, Yukuya MORISHITA
  • Patent number: D1082704
    Type: Grant
    Filed: November 9, 2023
    Date of Patent: July 8, 2025
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Yukuya Morishita, Yusuke Obata
  • Patent number: D1082719
    Type: Grant
    Filed: August 31, 2023
    Date of Patent: July 8, 2025
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Yusuke Obata, Yukuya Morishita
  • Patent number: D1079643
    Type: Grant
    Filed: January 8, 2024
    Date of Patent: June 17, 2025
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Yusuke Obata
  • Patent number: D1079651
    Type: Grant
    Filed: January 8, 2024
    Date of Patent: June 17, 2025
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Yusuke Obata, Yukuya Morishita
  • Patent number: D1079652
    Type: Grant
    Filed: January 8, 2024
    Date of Patent: June 17, 2025
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Yusuke Obata
  • Patent number: D1079653
    Type: Grant
    Filed: January 8, 2024
    Date of Patent: June 17, 2025
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Yusuke Obata
  • Patent number: D1086060
    Type: Grant
    Filed: October 12, 2023
    Date of Patent: July 29, 2025
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Yusuke Obata
  • Patent number: D1089119
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: August 19, 2025
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Yukuya Morishita, Yusuke Obata
  • Patent number: D1096639
    Type: Grant
    Filed: November 9, 2023
    Date of Patent: October 7, 2025
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Yukuya Morishita, Yusuke Obata
  • Patent number: D1098020
    Type: Grant
    Filed: November 9, 2023
    Date of Patent: October 14, 2025
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Yukuya Morishita, Yusuke Obata
  • Patent number: D1098021
    Type: Grant
    Filed: November 9, 2023
    Date of Patent: October 14, 2025
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Yukuya Morishita, Yusuke Obata
  • Patent number: D1099039
    Type: Grant
    Filed: November 9, 2023
    Date of Patent: October 21, 2025
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Yukuya Morishita, Yusuke Obata
  • Patent number: D1104994
    Type: Grant
    Filed: January 8, 2024
    Date of Patent: December 9, 2025
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Yusuke Obata, Yukuya Morishita
  • Patent number: D1105000
    Type: Grant
    Filed: January 8, 2024
    Date of Patent: December 9, 2025
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Yusuke Obata, Yukuya Morishita
  • Patent number: D1105001
    Type: Grant
    Filed: January 8, 2024
    Date of Patent: December 9, 2025
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Yusuke Obata, Yukuya Morishita
  • Patent number: D1106081
    Type: Grant
    Filed: November 9, 2023
    Date of Patent: December 16, 2025
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Yukuya Morishita, Yusuke Obata
  • Patent number: D1112103
    Type: Grant
    Filed: April 11, 2024
    Date of Patent: February 10, 2026
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Yusuke Obata, Yukuya Morishita
  • Patent number: D1113736
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: February 17, 2026
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Yukuya Morishita, Yusuke Obata