Abstract: A semiconductor device manufacturing method of embodiments includes: performing a first supply of a chemical solution from an application nozzle onto a surface of a wafer; storing the application nozzle in a container; performing a second supply of a solvent into the container; measuring first defects in the solvent discharged from the container; performing the first supply of the chemical solution from the application nozzle onto the surface of the wafer when the number of first defects is less than a first threshold value; and continuing the second supply of the solvent into the container when the number of first defects is equal to or greater than the first threshold value.

Abstract: In a method for manufacturing a welded member, an irradiation area that is irradiated by a laser beam relatively moves along end surfaces. The irradiation area includes a first area, a second area, and a third area. The second area surrounds an outer circumference of the first area. The third area is located outside of the second area and at least forward of the second area in a moving direction. The moving direction is a direction in which the irradiation area relatively moves. A rear end of the third area is located in front of a rear end of the second area in the moving direction. A first power density q1, a second power density q2, and a third power density q3 of the laser beam with which the first area, the second area, and the third areas are respectively irradiated satisfy a relationship q1>q2, q3.

Abstract: A method of manufacturing a welded member, the method including welding end surfaces of a thick plate and a thin plate to each other by laser beams. Irradiation regions irradiated with the laser beams includes a first and a second region. A corner portion of the thick plate is heated to melt by the laser beams via the first region that passes through at least a vicinity of the end surface of the thick plate. The end surfaces are welded to each other by the laser beams via the second region that passes through a vicinity of the corner portion, which has melted by the laser beams via the first region, and a vicinity of the end surface of the thin plate. An amount of heat applied to the thick plate via the first region is greater than that applied to the thin plate via the first region.

Abstract: A method of manufacturing a resist according to an embodiment includes obtaining a resist mixture by mixing a raw material of the resist in a mixing vessel; repeating delivering the resist mixture from a bottom of the mixing vessel to an inlet of a filter, the filter including the inlet and an outlet; filtering the resist mixture using the filter; and delivering the filtered resist mixture from the outlet to the mixing vessel; obtaining a first mixture by mixing the resist mixture and a predetermined first solution, the resist mixture being obtained from between the bottom and the inlet; measuring first defects of the first mixture; obtaining a second mixture by mixing the resist mixture and the predetermined first solution, the resist mixture being obtained from between the outlet and the mixing vessel; measuring second defects of the second mixture; and comparing the first defects and the second defects.

Abstract: An electromedical device control system includes a power supply device that supplies electric power to an electromedical device; and one or more relay devices that relay between the electromedical device and the power supply device. A type of the electromedical device connected to the relay device is obtained by determination using at least the relay device. The power supply device outputs the electric power in an output mode corresponding to the type of the electromedical device.

Abstract: Disclosed herein is a copper alloy wire being a wire rod formed of a copper alloy and having a tensile strength of 400 MPa or more, an elongation at break of 5% or more, a conductivity of 60% IACS or more, and a wire diameter of 0.5 mm or less, wherein the copper alloy has a composition containing 0.05% by mass or more and 1.6% by mass or less of iron, 0.01% by mass or more and 0.7% by mass or less of phosphorus, and 0.05% by mass or more and 0.7% by mass or less of tin with the balance being copper and unavoidable impurities, the copper alloy has a structure containing crystals, and a crystal grain size difference determined as a difference between a maximum crystal grain size and a minimum crystal grain size in a cross-section is 1.0 ?m or less.

Abstract: An evaluation apparatus according to an embodiment includes an evaluator including a column being capable of storing a liquid containing defects, the column being transparent, the defects containing a bubble, a first particle containing metal, and a second particle being different from the bubble and the first particle, an irradiator irradiating the liquid in the column with an irradiation light, an imager imaging a scattered light emitted from the defects by the irradiation light, an analyzer obtaining a diffusion coefficient of the defects from the imaged scattered light, a calculator calculating a particle size and a refractive index of the defects, a determiner determining whether the defects contain the bubble or the second particle, or the first particle; a filter filtering the liquid, the filter including an inlet and an outlet; a first pipe connecting the outlet of the filter and the evaluator.

Abstract: A magnetic base body according to one embodiment includes: a plurality of soft magnetic metal particles; and a plurality of insulating films covering surfaces of the plurality of soft magnetic metal particles. The plurality of soft magnetic metal particles include a first soft magnetic metal particle, and the plurality of insulating films include a first insulating film covering a surface of the first soft magnetic metal particle. The first insulating film includes one or more first oxide regions, the one or more first oxide regions containing Fe and Cr and having a peak intensity at 730 cm?1 in a Raman spectrum obtained by Raman spectrometry.

Abstract: Object Provided is a power supply device and the like capable of improving convenience. Solving means A power supply device according to an embodiment of the present disclosure include a power supply unit that supplies power to an electromedical device, a first impedance control unit disposed on a path of a circulation path of the power between the power supply unit and the electromedical device, excluding an input path for inputting an electrical signal obtained in the electromedical device to another device, and a second impedance control unit disposed on the input path of a path between the power supply unit and the other device. An impedance state of each of the first and second impedance control units transitions in accordance with a supply state of the power to the electromedical device.

Abstract: A covered electrical wire comprises a conductor and an insulating covering layer provided outside the conductor, the conductor being a stranded wire composed of a plurality of copper alloy wires composed of a copper alloy and twisted together, and having a wire diameter of 0.5 mm or less, the copper alloy containing Fe in an amount of 0.1% by mass or more and 1.6% by mass or less, P in an amount of 0.05% by mass or more and 0.7% by mass or less, and one or more elements selected from Ni, Al, Cr and Co in an amount of 0.01% by mass or more and 0.7% by mass or less in total, with a balance being Cu and impurities.

Abstract: An electromedical device control system includes a power supply device that supplies electric power to an electromedical device; and one or more relay devices that relay between the electromedical device and the power supply device. A type of the electromedical device connected to the relay device is obtained by determination using at least the relay device. The power supply device outputs the electric power in an output mode corresponding to the type of the electromedical device.

Abstract: Object Provided is a power supply device and the like capable of improving convenience. Solving means A power supply device according to an embodiment of the present disclosure include a power supply unit that supplies power to an electromedical device, a first impedance control unit disposed on a path of a circulation path of the power between the power supply unit and the electromedical device, excluding an input path for inputting an electrical signal obtained in the electromedical device to another device, and a second impedance control unit disposed on the input path of a path between the power supply unit and the other device. An impedance state of each of the first and second impedance control units transitions in accordance with a supply state of the power to the electromedical device.

Abstract: A covered electrical wire comprises a conductor and an insulating covering layer provided outside the conductor, the conductor being a stranded wire composed of a plurality of copper alloy wires composed of a copper alloy and twisted together, and having a wire diameter of 0.5 mm or less, the copper alloy containing Fe in an amount of 0.1% by mass or more and 1.6% by mass or less, P in an amount of 0.05% by mass or more and 0.7% by mass or less, and one or more elements selected from Ni, Al, Cr and Co in an amount of 0.01% by mass or more and 0.7% by mass or less in total, with a balance being Cu and impurities.

Abstract: A covered electrical wire comprises a conductor and an insulating covering layer provided outside the conductor, the conductor being a stranded wire composed of a plurality of copper alloy wires composed of a copper alloy and twisted together, and has a wire diameter of 0.5 mm or less, the copper alloy containing Ni, or Ni and Fe in an amount of 0.1% by mass or more and 1.6% by mass or less in total, and P in an amount of 0.05% by mass or more and 0.7% by mass or less, with a balance being Cu and impurities, in the copper alloy, a ratio of precipitation of P to solid solution of P being 1.1 or more.

Abstract: A covered electrical wire comprising a conductor and an insulating covering layer provided outside the conductor, the conductor being a stranded wire composed of a strand of a plurality of copper alloy wires: composed of a copper alloy containing Fe in an amount of 0.1% by mass or more and 1.6% by mass or less, P in an amount of 0.05% by mass or more and 0.7% by mass or less, and Sn in an amount of 0.05% by mass or more and 0.7% by mass or less, with the balance being Cu and impurities; and having a wire diameter of 0.5 mm or less, the copper alloy wire having a tensile strength of 385 MPa or more and a work-hardening exponent of 0.1 or more.

Abstract: A covered electrical wire comprises a conductor and an insulating covering layer provided outside the conductor, the conductor being a stranded wire composed of a strand of a plurality of copper alloy wires: composed of a copper alloy containing Fe in an amount of 0.2% by mass or more and 1.6% by mass or less, P in an amount of 0.05% by mass or more and 0.4% by mass or less, and Sn in an amount of 0.05% by mass or more and 0.7% by mass or less, with the balance being Cu and impurities, and having a mass ratio of Fe/P of 4.0 or more; and having a wire diameter of 0.5 mm or less.

Abstract: A covered electrical wire comprises a conductor and an insulating covering layer provided outside the conductor, the conductor being a stranded wire composed of a plurality of copper alloy wires composed of a copper alloy and twisted together, and having a wire diameter of 0.5 mm or less, the copper alloy containing Fe in an amount of 0.1% by mass or more and 1.6% by mass or less, P in an amount of 0.05% by mass or more and 0.7% by mass or less, and Sn in an amount of 0.05% by mass or more and 0.7% by mass or less, and further including one or more elements selected from Zr, Ti and B in an amount of 1000 ppm by mass or less in total, with a balance being Cu and impurities.

Abstract: A covered electrical wire comprises a conductor and an insulating covering layer provided outside the conductor, the conductor being a stranded wire composed of a plurality of copper alloy wires composed of a copper alloy and twisted together, and has a wire diameter of 0.5 mm or less, the copper alloy containing Ni, or Ni and Fe in an amount of 0.1% by mass or more and 1.6% by mass or less in total, and P in an amount of 0.05% by mass or more and 0.7% by mass or less, with a balance being Cu and impurities, in the copper alloy, a ratio of precipitation of P to solid solution of P being 1.1 or more.

Abstract: A covered electric wire comprises an insulating coating layer on the outer side of a conductor. The conductor comprises a copper alloy consisting of: not less than 0.05% by mass and not more than 2.0% by mass of Fe; not less than 0.02% by mass and not more than 1.0% by mass of Ti; not less than 0% by mass and not more than 0.6% by mass of Mg; and the balance being Cu and impurities. The covered electric wire is a stranded wire comprising a plurality of copper alloy wires stranded together. The plurality of copper alloy wires each have a work hardening coefficient of not less than 0.1 and a wire diameter of not more than 0.5 mm.